JP2018142738A - 洗浄具、洗浄具の製造方法、および、基板洗浄装置 - Google Patents
洗浄具、洗浄具の製造方法、および、基板洗浄装置 Download PDFInfo
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- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B9/00—Arrangements of the bristles in the brush body
- A46B9/005—Arrangements of the bristles in the brush body where the brushing material is not made of bristles, e.g. sponge, rubber or paper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
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- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
- A46B13/02—Brushes with driven brush bodies or carriers power-driven carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/145—Swabs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】洗浄具(3)は、回転しながら被洗浄基板を洗浄する洗浄部材(31)と、それぞれが前記洗浄部材(31)の側面の一部を挟み込む複数のチャック爪(32a)に下部が分割されており、前記洗浄部材(31)の周囲に沿って設けられるスリーブ(32)と、を備え、前記複数のチャック爪(32a)のそれぞれの内面には、前記洗浄部材(31)の回転方向と略平行に並んでおり、先端が前記洗浄部材(31)の側面に接触する複数の突起(32b)が設けられる。
【選択図】図2
Description
このような複数の突起を設けることで、洗浄部材が大きな場合でもその空転を抑制でき、大型な基板も洗浄できる。
また、前記スリーブが回転駆動される際、前記複数の突起が前記洗浄部材に回転方向の駆動力を伝達するのが望ましい。
、前記洗浄部材の上面の略中心には凹部が設けられ、当該洗浄具は、前記スリーブと固定される保持芯体であって、前記洗浄部材の上面と対向する面の略中心に、前記凹部と係合する凸部が設けられる保持芯体を備えていてもよい。これにより、精度よく洗浄部材をスリーブの中心に位置決めでき、洗浄部材が偏心した状態で回転するのを防止し、洗浄部材が長寿命化する。
また、前記凹部の底部と接触する前記凸部の面には、溝が設けられているのが望ましい。洗浄部材が回転する際に溝の縁に力が集中し、洗浄力が増す。
望ましくは、前記凹部の断面は、直線で形成される。これにより、凹部を容易に形成できるとともに、直線部分が回転方向の駆動力を洗浄部材に伝達できる。
ノズル4は純水などの洗浄液を被洗浄基板Wf上に供給する。容器5には洗浄液が入っており、被洗浄基板Wfを洗浄した後の洗浄具3を洗浄する。
続いて、洗浄具3について説明する。
とで、被洗浄基板Wfが洗浄される。被洗浄基板Wfの直径が450mmである場合、例えば下側円柱部31aの直径は42mm程度である。
ほぼ中央には凹部31cが形成されている。
次に、洗浄具3の特徴の1つである洗浄部材31上面の凹部31cおよび保持芯体33下面の凸部33dについて詳しく説明する。
央に向かって深くなっていてもよい。洗浄部材31は弾性を有するが、外力が加わらない状態での凹部31cの深さをaとする。深さaは、例えば上側円柱部31bの60%程度である。
b>a+c ・・・(1)
図9(b)に示すように、上側円柱部31bの中心のみならず、その周囲に等間隔で配置される複数の凹部31b’を設けてもよい。これにより、中心の凹部31bが小さくても、洗浄部材31が被洗浄基板Wfを押圧する面積を大きくできる。
なお、保持芯体33の凸部33dは、洗浄部材31の凹部31cの形状に合わせておけばよい。
れている。突起32bの幅は隙間32fの幅より大きくてもよいし、隙間32fの幅と同程度であってもよい。また、隙間32fの底部はチャック爪32aの内面と同一面上にあってもよい。
図10(a)および図12に示すように、チャック爪32aには内側に向かう凹凸が形成されていればよい。
なお、図13は洗浄具3を製造する方法であるが、同様にして消耗品である洗浄部材31を交換することもできる。
2 洗浄具装着機構
3 洗浄具
4 ノズル
5 容器
31 洗浄部材
31a 下側円柱部
31b 上側円柱部
31c 凹部
32 スリーブ
32a チャック爪
32b,32g,32i 突起
33 保持芯体
33d 凸部
33e 溝
34 リング部材
35 ネジ
36 隙間
Wf 被洗浄基板
Claims (17)
- 洗浄面を有する大径部と、前記洗浄面とは反対側の第1面に凹部が設けられた小径部と、を有する洗浄部材を保持する洗浄部材保持装置であって、
前記小径部の側面を保持するチャック部と、
前記凹部と係合する凸部と、を備える洗浄部材保持装置。 - 前記凸部は、当該洗浄部材保持装置の第2面に設けられており、
前記小径部の前記第1面と、当該洗浄部材保持装置の前記第2面は対向しており、前記第1面と前記第2面との間には隙間がある、請求項1に記載の洗浄部材保持装置。 - 前記凹部の深さをa、前記凸部の長さをb、前記隙間の高さをcとすると、
b>a+c
の関係を満たす、請求項2に記載の洗浄部材保持装置。 - 複数の前記凸部を備える、請求項1乃至3のいずれかに記載の洗浄部材保持装置。
- 前記凸部には、溝が設けられる、請求項1乃至4のいずれかに記載の洗浄部材保持装置。
- 前記凸部には、リング状の溝が設けられる、請求項1乃至5のいずれかに記載の洗浄部材保持装置。
- 前記凸部の先端は尖っている、請求項1乃至6のいずれかに記載の洗浄部材保持装置。
- 前記凸部の底面の中央には、凹部が設けられている、請求項1乃至7のいずれかに記載の洗浄部材保持装置。
- 前記凸部の断面の少なくとも一部は、直線で形成される、請求項1乃至8のいずれかに記載の洗浄部材保持装置。
- それぞれが、回転しながら被洗浄基板を洗浄する洗浄部材の側面の一部を挟み込む複数のチャック部を備え、
前記複数のチャック部のそれぞれの内面には、先端が前記洗浄部材の側面に接触する複数の突起が設けられる、洗浄部材保持装置。 - 前記複数の突起は、前記洗浄部材に食い込んでおり、
前記複数の突起の隙間には、前記洗浄部材の側面がせり出している、請求項10に記載の洗浄部材保持装置。 - 前記複数のチャック部のそれぞれの内面には、前記複数の突起が設けられる位置とは異なる位置に、前記洗浄部材の回転方向と略直交する方向に延びており、先端が前記洗浄部材に接触する別の突起がさらに設けられる、請求項10または11に記載の洗浄部材保持装置。
- 前記チャック部は、チャック爪である、請求項1乃至12のいずれかに記載の洗浄部材保持装置。
- 洗浄面である下面と、上面とを有する下側円柱部と、前記下側円柱部と接続された上側円柱部とを有する洗浄部材と、
前記洗浄部材の前記上側円柱部の側面と、前記下側円柱部の上面と、が接する部分において前記上側円柱部の側面を保持するチャック部を有する洗浄部材保持装置と、
を備えた、洗浄具。 - 洗浄面を有するより大径部と、
洗浄面とは反対側の第1面に、洗浄部材保持装置の凸部が挿入されるように構成された凹部が設けられた小径部と、を備える洗浄部材。 - 前記洗浄部材と、請求項1乃至13のいずれかに記載の洗浄部材保持装置と、を備える洗浄具。
- 請求項15に記載の洗浄部材と、前記洗浄部材保持装置と、を備える洗浄具。
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JP6316730B2 (ja) * | 2014-10-31 | 2018-04-25 | 株式会社荏原製作所 | ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置 |
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Citations (4)
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JPH0515857A (ja) * | 1991-07-15 | 1993-01-26 | Sharp Corp | 洗浄装置 |
JPH10135166A (ja) * | 1996-10-28 | 1998-05-22 | Sony Corp | 基板洗浄装置 |
JP2000173966A (ja) * | 1998-12-08 | 2000-06-23 | Ebara Corp | 洗浄具及び基板洗浄装置 |
JP2007335909A (ja) * | 2007-09-18 | 2007-12-27 | Ebara Corp | 基板洗浄方法 |
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US3100311A (en) * | 1962-09-25 | 1963-08-13 | Dominick J Tutino | Cleaning pad holder |
JPH03192429A (ja) | 1989-12-06 | 1991-08-22 | Fujitsu Ltd | 平方根演算装置 |
JP3632259B2 (ja) * | 1995-11-08 | 2005-03-23 | 富士通株式会社 | 基板洗浄装置及び基板洗浄方法 |
JP3654779B2 (ja) * | 1998-01-06 | 2005-06-02 | 東京エレクトロン株式会社 | 基板洗浄具及び基板洗浄方法 |
JP4046931B2 (ja) * | 2000-07-14 | 2008-02-13 | 株式会社荏原製作所 | 基板洗浄装置及び洗浄具 |
TWD161690S (zh) * | 2013-04-17 | 2014-07-11 | 東京威力科創股份有限公司 | 基板洗淨具之部分 |
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Patent Citations (4)
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JPH0515857A (ja) * | 1991-07-15 | 1993-01-26 | Sharp Corp | 洗浄装置 |
JPH10135166A (ja) * | 1996-10-28 | 1998-05-22 | Sony Corp | 基板洗浄装置 |
JP2000173966A (ja) * | 1998-12-08 | 2000-06-23 | Ebara Corp | 洗浄具及び基板洗浄装置 |
JP2007335909A (ja) * | 2007-09-18 | 2007-12-27 | Ebara Corp | 基板洗浄方法 |
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JP6352158B2 (ja) | 2018-07-04 |
US9643216B2 (en) | 2017-05-09 |
US10625308B2 (en) | 2020-04-21 |
JP2016100423A (ja) | 2016-05-30 |
US20160144410A1 (en) | 2016-05-26 |
JP6589015B2 (ja) | 2019-10-09 |
US20170209902A1 (en) | 2017-07-27 |
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