JP7348623B2 - 基板洗浄用ブラシ - Google Patents
基板洗浄用ブラシ Download PDFInfo
- Publication number
- JP7348623B2 JP7348623B2 JP2019099190A JP2019099190A JP7348623B2 JP 7348623 B2 JP7348623 B2 JP 7348623B2 JP 2019099190 A JP2019099190 A JP 2019099190A JP 2019099190 A JP2019099190 A JP 2019099190A JP 7348623 B2 JP7348623 B2 JP 7348623B2
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- JP
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- Prior art keywords
- holder
- brush
- cleaning
- substrate
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims description 97
- 239000000758 substrate Substances 0.000 claims description 60
- 230000001105 regulatory effect Effects 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000011148 porous material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
- A46B13/008—Disc-shaped brush bodies
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
- A46B13/02—Brushes with driven brush bodies or carriers power-driven carriers
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B5/00—Brush bodies; Handles integral with brushware
- A46B5/0095—Removable or interchangeable brush heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B2200/00—Brushes characterized by their functions, uses or applications
- A46B2200/30—Brushes for cleaning or polishing
- A46B2200/3073—Brush for cleaning specific unusual places not otherwise covered, e.g. gutters, golf clubs, tops of tin cans, corners
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
2:ブラシ回転軸
3:ブラシ回転軸の軸心
4:基板
5:被洗浄面
10:ブラシホルダ
11:上ホルダ(ホルダ上部)
12:下ホルダ
13:上ホルダ大径部
14:上ホルダ小径部
15:ホルダ雄ネジ部
16:係止突部
17:角穴
18:ホルダ下部
19:ホルダ底板部
20:ブラシカバー部
21:ブラシ変形規制部
22:係止孔
23:ブラシ収容空間
24:ホルダ開口
25:突起
30:ブラシ本体
31:被保持部
32:洗浄部
L1:洗浄部の突出長さ
L2:ホルダ開口の上下長さ
Claims (2)
- 軸心が上下方向に延びる基板洗浄装置のブラシ回転軸と一体的に回転することによって基板を洗浄する基板洗浄用ブラシであって、
前記ブラシ回転軸の下端に取付けられるホルダ上部と、前記ホルダ上部を前記ブラシ回転軸に取付けたホルダ取付状態で前記ホルダ上部から下方へ延びる円筒状のホルダ下部と、前記ホルダ取付状態で前記ホルダ下部の下端内縁から径方向内側へ突出する中空円板状のホルダ底板部とを有し、前記ホルダ取付状態で、前記ホルダ上部の下面と前記ホルダ下部の内周面と前記ホルダ底板部の上面とはブラシ収容空間を区画し、前記ホルダ底板部の内周縁は、前記ホルダ下部の内径よりも小径な円形状のホルダ開口を区画し、前記ブラシ収容空間の中心軸と前記ホルダ開口の中心軸とが前記ブラシ回転軸の前記軸心と略一致するブラシホルダと、
前記ホルダ開口を挿通不能な円柱状であり、前記ブラシ収容空間に収容されて保持される被保持部と、前記被保持部よりも小径で前記ホルダ開口を挿通可能な円柱状であり、前記ホルダ取付状態の前記ブラシ収容空間に前記被保持部が保持されたブラシ取付状態で、前記ホルダ開口を挿通して下方へ突出する洗浄部とを一体的に有し、前記ブラシ取付状態で前記洗浄部の下面を前記基板に上方から接触させて洗浄するブラシ本体と、を備え、
前記ブラシホルダは、前記ホルダ取付状態で前記ホルダ底板部の前記内周縁から下方へ突出する円筒状のブラシ変形規制部を有し、
前記ブラシ変形規制部の内周面は、前記ホルダ底板部の前記内周縁とともに前記ホルダ開口を区画し、
前記ブラシホルダの前記ホルダ開口の上下長さは、前記ブラシ本体の前記被保持部からの前記洗浄部の突出長さの1/4以上であって、前記洗浄部の突出長さよりも短い
ことを特徴とする基板洗浄用ブラシ。 - 請求項1に記載の基板洗浄用ブラシであって、
前記ホルダ下部の前記内周面には、前記ブラシ収容空間に収容された前記ブラシ本体の前記被保持部の外周面を径方向内側へ部分的に弾性変形させる複数の突起が形成されている
ことを特徴とする基板洗浄用ブラシ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019099190A JP7348623B2 (ja) | 2019-05-28 | 2019-05-28 | 基板洗浄用ブラシ |
TW109114803A TW202042706A (zh) | 2019-05-28 | 2020-05-04 | 基板洗淨刷 |
KR1020217038118A KR20220014324A (ko) | 2019-05-28 | 2020-05-27 | 기판 세정용 브러시 |
CN202080038113.4A CN113874131B (zh) | 2019-05-28 | 2020-05-27 | 基板清洗用刷 |
US17/614,270 US20220212234A1 (en) | 2019-05-28 | 2020-05-27 | Substrate cleaning brush |
PCT/JP2020/021024 WO2020241726A1 (ja) | 2019-05-28 | 2020-05-27 | 基板洗浄用ブラシ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019099190A JP7348623B2 (ja) | 2019-05-28 | 2019-05-28 | 基板洗浄用ブラシ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020194867A JP2020194867A (ja) | 2020-12-03 |
JP2020194867A5 JP2020194867A5 (ja) | 2022-06-01 |
JP7348623B2 true JP7348623B2 (ja) | 2023-09-21 |
Family
ID=73546002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019099190A Active JP7348623B2 (ja) | 2019-05-28 | 2019-05-28 | 基板洗浄用ブラシ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220212234A1 (ja) |
JP (1) | JP7348623B2 (ja) |
KR (1) | KR20220014324A (ja) |
CN (1) | CN113874131B (ja) |
TW (1) | TW202042706A (ja) |
WO (1) | WO2020241726A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000173966A (ja) | 1998-12-08 | 2000-06-23 | Ebara Corp | 洗浄具及び基板洗浄装置 |
KR20020022220A (ko) | 2000-09-19 | 2002-03-27 | 고석태 | 세정용 브러시 조립체 |
JP2003017454A (ja) | 2001-06-29 | 2003-01-17 | Shibaura Mechatronics Corp | 基板の洗浄ツール、基板の処理装置及び処理方法 |
JP2002028584A5 (ja) | 2000-07-14 | 2005-07-28 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3539787B2 (ja) * | 1995-03-09 | 2004-07-07 | 大日本スクリーン製造株式会社 | 回転式基板洗浄装置 |
JP3396124B2 (ja) * | 1995-12-25 | 2003-04-14 | 大日本スクリーン製造株式会社 | 基板洗浄用ブラシ |
JP4046931B2 (ja) * | 2000-07-14 | 2008-02-13 | 株式会社荏原製作所 | 基板洗浄装置及び洗浄具 |
JP3975073B2 (ja) * | 2001-11-01 | 2007-09-12 | 株式会社ジーベックテクノロジー | 研磨機用ブラシ |
DE10324709A1 (de) * | 2003-05-30 | 2004-12-16 | Mtu Aero Engines Gmbh | Bürstendichtung zum Abdichten relativ zueinander beweglicher Bauteile gegenüber einem Druckgefälle |
ATE352225T1 (de) * | 2004-05-07 | 2007-02-15 | Glaxosmithkline Consumer Healt | Bürstenkopf |
KR100522095B1 (ko) * | 2005-06-27 | 2005-10-18 | 백운 | 화장용 솔 |
CN101773333B (zh) * | 2006-02-03 | 2012-07-25 | 卡兹西塔株式会社 | 化妆品涂抹装置 |
JP2007273608A (ja) * | 2006-03-30 | 2007-10-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
KR101078512B1 (ko) * | 2009-11-02 | 2011-10-31 | 주식회사 케이씨텍 | 브러시 어셈블리 |
SG10201906815XA (en) * | 2014-08-26 | 2019-08-27 | Ebara Corp | Substrate processing apparatus |
JP6352158B2 (ja) * | 2014-11-20 | 2018-07-04 | 株式会社荏原製作所 | 洗浄具、洗浄具の製造方法、および、基板洗浄装置 |
EP3294089B1 (en) * | 2015-05-14 | 2024-08-21 | Koninklijke Philips N.V. | Brush head arrangements |
RU2717582C2 (ru) * | 2015-05-14 | 2020-03-24 | Конинклейке Филипс Н.В. | Блок головки щетки и способы его изготовления |
CN206560146U (zh) * | 2017-02-13 | 2017-10-17 | 九阳股份有限公司 | 一种清洁效果好的食品加工机用毛刷 |
CN208550358U (zh) * | 2018-06-05 | 2019-03-01 | 福建广德信息科技有限公司 | 一种便于使用的计算机键盘刷 |
CN109330174A (zh) * | 2018-12-12 | 2019-02-15 | 重庆羽狐科技有限公司 | 一种洗锅刷 |
-
2019
- 2019-05-28 JP JP2019099190A patent/JP7348623B2/ja active Active
-
2020
- 2020-05-04 TW TW109114803A patent/TW202042706A/zh unknown
- 2020-05-27 KR KR1020217038118A patent/KR20220014324A/ko unknown
- 2020-05-27 US US17/614,270 patent/US20220212234A1/en active Pending
- 2020-05-27 CN CN202080038113.4A patent/CN113874131B/zh active Active
- 2020-05-27 WO PCT/JP2020/021024 patent/WO2020241726A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000173966A (ja) | 1998-12-08 | 2000-06-23 | Ebara Corp | 洗浄具及び基板洗浄装置 |
JP2002028584A5 (ja) | 2000-07-14 | 2005-07-28 | ||
KR20020022220A (ko) | 2000-09-19 | 2002-03-27 | 고석태 | 세정용 브러시 조립체 |
JP2003017454A (ja) | 2001-06-29 | 2003-01-17 | Shibaura Mechatronics Corp | 基板の洗浄ツール、基板の処理装置及び処理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113874131B (zh) | 2024-05-14 |
US20220212234A1 (en) | 2022-07-07 |
TW202042706A (zh) | 2020-12-01 |
JP2020194867A (ja) | 2020-12-03 |
CN113874131A (zh) | 2021-12-31 |
KR20220014324A (ko) | 2022-02-04 |
WO2020241726A1 (ja) | 2020-12-03 |
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