JP2018137376A5 - - Google Patents
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- Publication number
- JP2018137376A5 JP2018137376A5 JP2017031791A JP2017031791A JP2018137376A5 JP 2018137376 A5 JP2018137376 A5 JP 2018137376A5 JP 2017031791 A JP2017031791 A JP 2017031791A JP 2017031791 A JP2017031791 A JP 2017031791A JP 2018137376 A5 JP2018137376 A5 JP 2018137376A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- adhesive tape
- semiconductor processing
- substrate
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims description 81
- 239000002390 adhesive tape Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 9
- 239000003999 initiator Substances 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical group C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 claims description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- NNAHKQUHXJHBIV-UHFFFAOYSA-N 2-methyl-1-(4-methylthiophen-2-yl)-2-morpholin-4-ylpropan-1-one Chemical compound CC1=CSC(C(=O)C(C)(C)N2CCOCC2)=C1 NNAHKQUHXJHBIV-UHFFFAOYSA-N 0.000 description 1
- 229920006266 Vinyl film Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017031791A JP6886838B2 (ja) | 2017-02-23 | 2017-02-23 | 半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017031791A JP6886838B2 (ja) | 2017-02-23 | 2017-02-23 | 半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018137376A JP2018137376A (ja) | 2018-08-30 |
| JP2018137376A5 true JP2018137376A5 (https=) | 2020-02-27 |
| JP6886838B2 JP6886838B2 (ja) | 2021-06-16 |
Family
ID=63365645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017031791A Active JP6886838B2 (ja) | 2017-02-23 | 2017-02-23 | 半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6886838B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022038213A (ja) * | 2020-08-26 | 2022-03-10 | 日東電工株式会社 | 部材加工方法 |
| JP7675533B2 (ja) | 2021-03-02 | 2025-05-13 | リンテック株式会社 | ワーク加工用シート |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001240842A (ja) * | 2000-02-28 | 2001-09-04 | Nitto Denko Corp | 紫外線硬化型粘着剤組成物とその粘着シ―ト類 |
| JP2008045091A (ja) * | 2006-08-21 | 2008-02-28 | Nitto Denko Corp | 加工用粘着シート |
| JP2011132354A (ja) * | 2009-12-24 | 2011-07-07 | Hitachi Maxell Ltd | 紫外線硬化型粘着フィルム |
| JP5977954B2 (ja) * | 2012-02-09 | 2016-08-24 | リンテック株式会社 | 半導体ウエハ加工用シート |
| JP5850773B2 (ja) * | 2012-03-19 | 2016-02-03 | 三井化学株式会社 | 粘着剤、積層体および表面保護フィルム |
| JP6360829B2 (ja) * | 2013-06-14 | 2018-07-18 | デンカ株式会社 | 半導体検査用の耐熱性粘着シート |
-
2017
- 2017-02-23 JP JP2017031791A patent/JP6886838B2/ja active Active
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