JP6886838B2 - 半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法 - Google Patents

半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法 Download PDF

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JP6886838B2
JP6886838B2 JP2017031791A JP2017031791A JP6886838B2 JP 6886838 B2 JP6886838 B2 JP 6886838B2 JP 2017031791 A JP2017031791 A JP 2017031791A JP 2017031791 A JP2017031791 A JP 2017031791A JP 6886838 B2 JP6886838 B2 JP 6886838B2
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JP2018137376A5 (https=
JP2018137376A (ja
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雄紀 柴山
雄紀 柴山
齊藤　岳史
岳史 齊藤
智章 田中
智章 田中
将 中村
将 中村
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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JP2017031791A 2017-02-23 2017-02-23 半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法 Active JP6886838B2 (ja)

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JP2017031791A JP6886838B2 (ja) 2017-02-23 2017-02-23 半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法

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JP2017031791A JP6886838B2 (ja) 2017-02-23 2017-02-23 半導体加工用粘着テープ及びそれを用いた半導体チップ又は半導体部品の製造方法

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JP2018137376A JP2018137376A (ja) 2018-08-30
JP2018137376A5 JP2018137376A5 (https=) 2020-02-27
JP6886838B2 true JP6886838B2 (ja) 2021-06-16

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022038213A (ja) * 2020-08-26 2022-03-10 日東電工株式会社 部材加工方法
JP7675533B2 (ja) 2021-03-02 2025-05-13 リンテック株式会社 ワーク加工用シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
JP2008045091A (ja) * 2006-08-21 2008-02-28 Nitto Denko Corp 加工用粘着シート
JP2011132354A (ja) * 2009-12-24 2011-07-07 Hitachi Maxell Ltd 紫外線硬化型粘着フィルム
JP5977954B2 (ja) * 2012-02-09 2016-08-24 リンテック株式会社 半導体ウエハ加工用シート
JP5850773B2 (ja) * 2012-03-19 2016-02-03 三井化学株式会社 粘着剤、積層体および表面保護フィルム
JP6360829B2 (ja) * 2013-06-14 2018-07-18 デンカ株式会社 半導体検査用の耐熱性粘着シート

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