JP2018137032A - シャシー - Google Patents
シャシー Download PDFInfo
- Publication number
- JP2018137032A JP2018137032A JP2017222644A JP2017222644A JP2018137032A JP 2018137032 A JP2018137032 A JP 2018137032A JP 2017222644 A JP2017222644 A JP 2017222644A JP 2017222644 A JP2017222644 A JP 2017222644A JP 2018137032 A JP2018137032 A JP 2018137032A
- Authority
- JP
- Japan
- Prior art keywords
- hard drive
- hard drives
- hard
- airflow
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 24
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 14
- 238000003491 array Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/187—Mounting of fixed and removable disk drives
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
- G11B33/127—Mounting arrangements of constructional parts onto a chassis
- G11B33/128—Mounting arrangements of constructional parts onto a chassis of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
- G11B33/142—Reducing the influence of the temperature by fluid cooling by air cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】基板部を介して接続される前端部及び後端部を含むハウジングと、気流をハウジングの前端部から後端部まで伝送するためのファンモジュールと、を備え、且つ、基板部が、その縁辺に配列される複数のハードドライブを含み、前記ハードドライブの配列により、前記ハードドライブの第1部が基板部の縁辺に対して傾斜するシャシー。
【選択図】図5
Description
本発明のシャシーにおいて、上記従来技術における部材等と同様のものを用いることができるが、上述のようにそれら部材等の個数は制限されない。
100 サーバー装置
101N ハードドライブ
102 前端部
103 後端部
105 ストレージアレイ
106 基板部
107 縁辺
109、110 空間
130 ストレージアレイモジュール
150 ファンモジュール
151N ファン
501 気流空間
A ハードドライブの傾斜の角度
Claims (10)
- 基板部を介して接続される前端部及び後端部を含むハウジングと、
気流を前記ハウジングの前記前端部から前記後端部まで伝送するためのファンモジュールと、
を備え、
前記基板部が、その縁辺に配列される複数のハードドライブを含み、
前記ハードドライブの配列により、前記ハードドライブの第1部が前記基板部の縁辺に対して傾斜して配置されるシャシー。 - 前記ハードドライブの第1部は、前記ハウジングの前記後端部に位置する請求項1に記載のシャシー。
- 前記ハードドライブの第1部は、前記基板部の縁辺に対して45度で傾斜する請求項1又は2に記載のシャシー。
- 前記ハードドライブの第1部は、前記基板部の縁辺に対して10度で傾斜する請求項1又は2に記載のシャシー。
- 前記ハードドライブの第1部の前記基板部の縁辺に対する傾斜角は、10度以上45度以下である請求項1又は2に記載のシャシー。
- 前記ハードドライブの第2部の前記基板部の縁辺に対する傾斜度は、前記ハードドライブの第1部の前記基板部の縁辺に対する傾斜度と鏡面対称の関係にある請求項1〜5の何れか1項に記載のシャシー。
- 前記ハードドライブの第2部は、前記ハウジングの前記前端部に位置する請求項1〜6の何れか1項に記載のシャシー。
- 前記ハードドライブの第2部は、前記基板部の縁辺に対して45度で傾斜する請求項1〜7の何れか1項に記載のシャシー。
- 前記ハードドライブの第2部は、前記基板部の縁辺に対して10度で傾斜する請求項1〜7の何れか1項に記載のシャシー。
- 前記ハードドライブの第2部の前記基板部の縁辺に対する傾斜角は、10度以上45度以下である請求項1〜7の何れか1項に記載のシャシー。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/440,999 | 2017-02-23 | ||
US15/440,999 US10412851B2 (en) | 2017-02-23 | 2017-02-23 | Inclined storage array for improved cooling |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018137032A true JP2018137032A (ja) | 2018-08-30 |
JP6546640B2 JP6546640B2 (ja) | 2019-07-17 |
Family
ID=59829121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017222644A Active JP6546640B2 (ja) | 2017-02-23 | 2017-11-20 | シャシー |
Country Status (5)
Country | Link |
---|---|
US (1) | US10412851B2 (ja) |
EP (1) | EP3367384B1 (ja) |
JP (1) | JP6546640B2 (ja) |
CN (1) | CN108508982B (ja) |
TW (1) | TWI643189B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109727613B (zh) * | 2017-10-27 | 2021-05-07 | 伊姆西Ip控股有限责任公司 | 存储系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000149541A (ja) * | 1998-11-13 | 2000-05-30 | Hitachi Ltd | 磁気ディスク装置および電子装置 |
JP2007517355A (ja) * | 2003-12-29 | 2007-06-28 | シャーウッド インフォメーション パートナーズ インコーポレイテッド | 多重ハードディスク・ドライブ・エンクロージャを使用した大容量ストレージのためのシステム及び方法 |
US9474190B1 (en) * | 2014-08-14 | 2016-10-18 | Amazon Technologies, Inc. | Computer system with side plenum cooling |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5497288A (en) | 1994-08-31 | 1996-03-05 | International Business Machines Corporation | Apparatus for tilted serial cooling in an electronic system |
JP2002353645A (ja) * | 2001-05-30 | 2002-12-06 | Sanyo Electric Co Ltd | 電子機器の筐体 |
JP4311538B2 (ja) * | 2003-06-27 | 2009-08-12 | 株式会社日立製作所 | ディスク記憶装置の冷却構造 |
CN1922945A (zh) * | 2003-12-29 | 2007-02-28 | 舍伍德信息合作公司 | 用于使用多硬盘驱动器机壳的大容量存贮器的系统和方法 |
JP2008016137A (ja) * | 2006-07-07 | 2008-01-24 | Hitachi Ltd | ディスクアレイ装置 |
US8842431B2 (en) * | 2007-10-15 | 2014-09-23 | Alcatel Lucent | Horizontal chassis having front to back airflow |
US8473779B2 (en) | 2008-02-29 | 2013-06-25 | Assurance Software And Hardware Solutions, Llc | Systems and methods for error correction and detection, isolation, and recovery of faults in a fail-in-place storage array |
US20100091458A1 (en) | 2008-10-15 | 2010-04-15 | Mosier Jr David W | Electronics chassis with angled card cage |
EP2490518A4 (en) | 2009-10-16 | 2014-06-11 | Fujitsu Ltd | ELECTRONIC DEVICE AND COMPOSITE ELECTRONIC DEVICE |
CN102375510A (zh) * | 2010-08-17 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | 电脑机箱散热系统 |
CN202171774U (zh) * | 2011-04-07 | 2012-03-21 | 孙煜 | 具备散热空气流道的计算机硬盘斜向安装与固定结构 |
CN202615298U (zh) * | 2012-05-14 | 2012-12-19 | 联想(北京)有限公司 | 计算机及其硬盘托架 |
JP6205706B2 (ja) * | 2012-10-26 | 2017-10-04 | 富士通株式会社 | ストレージ装置及び固定装置 |
CN105446437A (zh) * | 2014-08-19 | 2016-03-30 | 华为技术有限公司 | 一种硬盘阵列散热装置 |
JP6428359B2 (ja) * | 2015-02-20 | 2018-11-28 | 富士通株式会社 | 記憶装置の収納ユニット及び収納ユニットを備えるストレージ装置 |
TWI590741B (zh) * | 2015-04-16 | 2017-07-01 | 緯創資通股份有限公司 | 可裝載多個儲存單元的儲存單元結合模組、及可裝載多個儲存單元結合模組的儲存單元移動套件與其相關的伺服器設備 |
-
2017
- 2017-02-23 US US15/440,999 patent/US10412851B2/en active Active
- 2017-06-21 TW TW106120764A patent/TWI643189B/zh active
- 2017-07-04 CN CN201710536617.9A patent/CN108508982B/zh active Active
- 2017-08-17 EP EP17186721.1A patent/EP3367384B1/en active Active
- 2017-11-20 JP JP2017222644A patent/JP6546640B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000149541A (ja) * | 1998-11-13 | 2000-05-30 | Hitachi Ltd | 磁気ディスク装置および電子装置 |
JP2007517355A (ja) * | 2003-12-29 | 2007-06-28 | シャーウッド インフォメーション パートナーズ インコーポレイテッド | 多重ハードディスク・ドライブ・エンクロージャを使用した大容量ストレージのためのシステム及び方法 |
US9474190B1 (en) * | 2014-08-14 | 2016-10-18 | Amazon Technologies, Inc. | Computer system with side plenum cooling |
Also Published As
Publication number | Publication date |
---|---|
TWI643189B (zh) | 2018-12-01 |
EP3367384A1 (en) | 2018-08-29 |
CN108508982A (zh) | 2018-09-07 |
US20180242471A1 (en) | 2018-08-23 |
EP3367384B1 (en) | 2019-07-31 |
JP6546640B2 (ja) | 2019-07-17 |
US10412851B2 (en) | 2019-09-10 |
CN108508982B (zh) | 2021-02-02 |
TW201832228A (zh) | 2018-09-01 |
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