JP2018129405A5 - - Google Patents

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Publication number
JP2018129405A5
JP2018129405A5 JP2017021716A JP2017021716A JP2018129405A5 JP 2018129405 A5 JP2018129405 A5 JP 2018129405A5 JP 2017021716 A JP2017021716 A JP 2017021716A JP 2017021716 A JP2017021716 A JP 2017021716A JP 2018129405 A5 JP2018129405 A5 JP 2018129405A5
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JP
Japan
Prior art keywords
lead
dam bar
etched
width
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017021716A
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English (en)
Japanese (ja)
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JP6798670B2 (ja
JP2018129405A (ja
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Publication date
Application filed filed Critical
Priority to JP2017021716A priority Critical patent/JP6798670B2/ja
Priority claimed from JP2017021716A external-priority patent/JP6798670B2/ja
Priority to MYPI2018700506A priority patent/MY192268A/en
Priority to US15/891,755 priority patent/US10304760B2/en
Priority to CN201810127202.0A priority patent/CN108417553B/zh
Publication of JP2018129405A publication Critical patent/JP2018129405A/ja
Publication of JP2018129405A5 publication Critical patent/JP2018129405A5/ja
Application granted granted Critical
Publication of JP6798670B2 publication Critical patent/JP6798670B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017021716A 2017-02-08 2017-02-08 リードフレーム及びその製造方法 Expired - Fee Related JP6798670B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017021716A JP6798670B2 (ja) 2017-02-08 2017-02-08 リードフレーム及びその製造方法
MYPI2018700506A MY192268A (en) 2017-02-08 2018-02-08 Lead frame and method for manufacturing the same
US15/891,755 US10304760B2 (en) 2017-02-08 2018-02-08 Lead frame and method for manufacturing the same
CN201810127202.0A CN108417553B (zh) 2017-02-08 2018-02-08 引线框及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017021716A JP6798670B2 (ja) 2017-02-08 2017-02-08 リードフレーム及びその製造方法

Publications (3)

Publication Number Publication Date
JP2018129405A JP2018129405A (ja) 2018-08-16
JP2018129405A5 true JP2018129405A5 (enExample) 2019-11-21
JP6798670B2 JP6798670B2 (ja) 2020-12-09

Family

ID=63037345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017021716A Expired - Fee Related JP6798670B2 (ja) 2017-02-08 2017-02-08 リードフレーム及びその製造方法

Country Status (4)

Country Link
US (1) US10304760B2 (enExample)
JP (1) JP6798670B2 (enExample)
CN (1) CN108417553B (enExample)
MY (1) MY192268A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11545418B2 (en) * 2018-10-24 2023-01-03 Texas Instruments Incorporated Thermal capacity control for relative temperature-based thermal shutdown
US11581195B2 (en) * 2020-12-21 2023-02-14 Alpha And Omega Semiconductor International Lp Semiconductor package having wettable lead flank and method of making the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6700186B2 (en) * 2000-12-21 2004-03-02 Mitsui High-Tec, Inc. Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device
KR20020093250A (ko) * 2001-06-07 2002-12-16 삼성전자 주식회사 리드 노출형 리드 프레임 및 그를 이용한 리드 노출형반도체 패키지
US7259460B1 (en) * 2004-06-18 2007-08-21 National Semiconductor Corporation Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package
US7968377B2 (en) * 2005-09-22 2011-06-28 Stats Chippac Ltd. Integrated circuit protruding pad package system
JP5214911B2 (ja) * 2006-12-27 2013-06-19 株式会社デンソー モールドパッケージの製造方法
JP2009088412A (ja) * 2007-10-02 2009-04-23 Renesas Technology Corp 半導体装置の製造方法
JP5899614B2 (ja) * 2010-11-26 2016-04-06 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
JP6087153B2 (ja) * 2013-01-10 2017-03-01 株式会社三井ハイテック リードフレーム
JP6143468B2 (ja) * 2013-01-11 2017-06-07 株式会社三井ハイテック リードフレーム
KR101486790B1 (ko) * 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
JP6319644B2 (ja) * 2013-10-01 2018-05-09 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置の製造方法
US9252063B2 (en) * 2014-07-07 2016-02-02 Infineon Technologies Ag Extended contact area for leadframe strip testing
CN104659010B (zh) * 2015-02-11 2018-03-16 江苏长电科技股份有限公司 一种四方扁平无引脚型态封装的引线框结构与封装体结构
JP6603538B2 (ja) * 2015-10-23 2019-11-06 新光電気工業株式会社 リードフレーム及びその製造方法

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