JP2018107299A - コイル部品及びこれを備える回路基板 - Google Patents
コイル部品及びこれを備える回路基板 Download PDFInfo
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- JP2018107299A JP2018107299A JP2016252588A JP2016252588A JP2018107299A JP 2018107299 A JP2018107299 A JP 2018107299A JP 2016252588 A JP2016252588 A JP 2016252588A JP 2016252588 A JP2016252588 A JP 2016252588A JP 2018107299 A JP2018107299 A JP 2018107299A
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- 239000004020 conductor Substances 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 42
- 230000035699 permeability Effects 0.000 claims description 41
- 230000004907 flux Effects 0.000 abstract description 28
- 238000005192 partition Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 91
- 239000000463 material Substances 0.000 description 14
- 230000002093 peripheral effect Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 239000006247 magnetic powder Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/288—Shielding
- H01F27/2885—Shielding with shields or electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/122—Insulating between turns or between winding layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
- H01F2027/2857—Coil formed from wound foil conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
【解決手段】コイル導体部40と、コイル導体部40のコイル軸方向における両側にそれぞれ設けられた第1及び第2の磁性層21,22とを備える。第1の磁性層21の厚さT1よりも、第2の磁性層22の厚さT2の方が厚く、コイル軸方向から見たコイル導体部40の外部領域には、第1の磁性層21と第2の磁性層22との間において磁路の一部を分断する非磁性の基板11が存在する。そして、第1の磁性層21のxy面を実装面として使用すれば、基板11から漏洩する磁束の広がりを第2の磁性層22によって抑制することが可能となる。
【選択図】図3
Description
図1は、本発明の第1の実施形態によるコイル部品1の外観形状を示す略斜視図である。
図4は、本発明の第2の実施形態によるコイル部品2の構造を説明するための断面図である。
図5は、本発明の第3の実施形態によるコイル部品3の構造を説明するための断面図である。
図6は、本発明の第4の実施形態によるコイル部品4の構造を説明するための断面図である。
5 実装基板
6,7 ランドパターン
8 グランドパターン
10 コイル層
11 基板
11a 上面
11b 下面
11c〜11f 側面
11g,11h スルーホール
11i 切り欠き部
12,13 絶縁樹脂層
19 スルーホール導体
21,22 磁性層
24,25 磁性部材
31,32 端子電極
40 コイル導体部
41,42 スパイラル導体
43,44 電極パターン
51〜53,61〜63 絶縁樹脂層
70 ドラム型コア
71,72 鍔部
73 巻芯部
81,82 端子電極
F ハンダフィレット
S 空間
W ワイヤ
φ 漏洩磁束
Claims (7)
- コイル導体部と、
前記コイル導体部のコイル軸方向における両側にそれぞれ設けられた第1及び第2の高透磁率部と、を備え、
前記第1の高透磁率部よりも前記第2の高透磁率部の方が前記コイル軸方向における厚さが厚く、
前記コイル軸方向から見た前記コイル導体部の外部領域には、前記第1の高透磁率部と前記第2の高透磁率部との間において磁路の少なくとも一部を分断する低透磁率部が存在することを特徴とするコイル部品。 - 前記低透磁率部は非磁性基板であり、前記コイル導体部は前記非磁性基板の表面に形成されていることを特徴とする請求項1に記載のコイル部品。
- 前記第1又は第2の高透磁率部は磁性基板であり、前記コイル導体部は前記磁性基板の表面に形成されており、
前記低透磁率部は前記コイル導体部を覆う絶縁樹脂層であることを特徴とする請求項1に記載のコイル部品。 - 前記第1の高透磁率部はドラム型コアの一方の鍔部であり、前記第2の高透磁率部はドラム型コアの他方の鍔部であることを特徴とする請求項1に記載のコイル部品。
- 前記第1の高透磁率部の前記コイル軸に対して垂直な面は、実装面を構成することを特徴とする請求項1乃至4のいずれか一項に記載のコイル部品。
- 実装基板と、
前記実装面が前記実装基板と向かい合うよう、前記実装基板に搭載された請求項5に記載のコイル部品と、を備えることを特徴とする回路基板。 - 前記実装基板は、前記コイル部品と重なる位置に設けられたグランドパターンを有することを特徴とする請求項6に記載の回路基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016252588A JP6919194B2 (ja) | 2016-12-27 | 2016-12-27 | コイル部品及びこれを備える回路基板 |
US15/852,662 US10388452B2 (en) | 2016-12-27 | 2017-12-22 | Coil component and circuit board including the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016252588A JP6919194B2 (ja) | 2016-12-27 | 2016-12-27 | コイル部品及びこれを備える回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018107299A true JP2018107299A (ja) | 2018-07-05 |
JP6919194B2 JP6919194B2 (ja) | 2021-08-18 |
Family
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Family Applications (1)
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JP2016252588A Active JP6919194B2 (ja) | 2016-12-27 | 2016-12-27 | コイル部品及びこれを備える回路基板 |
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US (1) | US10388452B2 (ja) |
JP (1) | JP6919194B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020107879A (ja) * | 2018-12-27 | 2020-07-09 | Tdk株式会社 | Lc複合部品 |
JP7404788B2 (ja) | 2018-12-27 | 2023-12-26 | Tdk株式会社 | Lc複合部品 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102662845B1 (ko) * | 2018-11-22 | 2024-05-03 | 삼성전기주식회사 | 인덕터 |
JP7331521B2 (ja) * | 2019-07-24 | 2023-08-23 | Tdk株式会社 | 電子部品内蔵基板 |
KR102404315B1 (ko) * | 2020-05-08 | 2022-06-07 | 삼성전기주식회사 | 코일 부품 |
CN112086261A (zh) * | 2020-09-08 | 2020-12-15 | 奇力新电子股份有限公司 | 薄膜电感及其制造方法 |
Citations (8)
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JPS6210419U (ja) * | 1985-07-02 | 1987-01-22 | ||
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JPH0476006U (ja) * | 1990-11-16 | 1992-07-02 | ||
JP2012015395A (ja) * | 2010-07-02 | 2012-01-19 | Murata Mfg Co Ltd | コモンモードチョークコイル実装構造 |
JP2012089765A (ja) * | 2010-10-21 | 2012-05-10 | Tdk Corp | コイル部品 |
JP2012114363A (ja) * | 2010-11-26 | 2012-06-14 | Tdk Corp | 電子部品 |
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EP1772878A4 (en) * | 2004-07-23 | 2012-12-12 | Murata Manufacturing Co | METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, NUT PLATE AND ELECTRONIC COMPONENT |
TW201106386A (en) * | 2009-08-03 | 2011-02-16 | Inpaq Technology Co Ltd | Common mode filter and method of manufacturing the same |
US8451083B2 (en) * | 2010-05-31 | 2013-05-28 | Tdk Corporation | Coil component and method of manufacturing the same |
CN103180919B (zh) * | 2010-10-21 | 2016-05-18 | Tdk株式会社 | 线圈部件及其制造方法 |
KR101397488B1 (ko) * | 2012-07-04 | 2014-05-20 | 티디케이가부시기가이샤 | 코일 부품 및 그의 제조 방법 |
JP6254071B2 (ja) * | 2013-11-26 | 2017-12-27 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | コモンモードフィルタ及びコモンモードフィルタが備えられた電子装置 |
-
2016
- 2016-12-27 JP JP2016252588A patent/JP6919194B2/ja active Active
-
2017
- 2017-12-22 US US15/852,662 patent/US10388452B2/en active Active
Patent Citations (8)
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JPS6210419U (ja) * | 1985-07-02 | 1987-01-22 | ||
JPH01223710A (ja) * | 1988-03-02 | 1989-09-06 | Maspro Denkoh Corp | 高周波トランス |
JPH0476006U (ja) * | 1990-11-16 | 1992-07-02 | ||
JP2012015395A (ja) * | 2010-07-02 | 2012-01-19 | Murata Mfg Co Ltd | コモンモードチョークコイル実装構造 |
JP2012089765A (ja) * | 2010-10-21 | 2012-05-10 | Tdk Corp | コイル部品 |
JP2012114363A (ja) * | 2010-11-26 | 2012-06-14 | Tdk Corp | 電子部品 |
JP2015103817A (ja) * | 2013-11-26 | 2015-06-04 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 電子部品及び電子部品実装回路基板 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2020107879A (ja) * | 2018-12-27 | 2020-07-09 | Tdk株式会社 | Lc複合部品 |
JP7404788B2 (ja) | 2018-12-27 | 2023-12-26 | Tdk株式会社 | Lc複合部品 |
Also Published As
Publication number | Publication date |
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US20190006088A1 (en) | 2019-01-03 |
US10388452B2 (en) | 2019-08-20 |
JP6919194B2 (ja) | 2021-08-18 |
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