JP2018101779A5 - - Google Patents

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Publication number
JP2018101779A5
JP2018101779A5 JP2017237854A JP2017237854A JP2018101779A5 JP 2018101779 A5 JP2018101779 A5 JP 2018101779A5 JP 2017237854 A JP2017237854 A JP 2017237854A JP 2017237854 A JP2017237854 A JP 2017237854A JP 2018101779 A5 JP2018101779 A5 JP 2018101779A5
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JP
Japan
Prior art keywords
shape
template
active region
adaptive chuck
correspondence
Prior art date
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Application number
JP2017237854A
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English (en)
Japanese (ja)
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JP7085827B2 (ja
JP2018101779A (ja
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Publication date
Priority claimed from US15/385,189 external-priority patent/US10578984B2/en
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Publication of JP2018101779A publication Critical patent/JP2018101779A/ja
Publication of JP2018101779A5 publication Critical patent/JP2018101779A5/ja
Application granted granted Critical
Publication of JP7085827B2 publication Critical patent/JP7085827B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017237854A 2016-12-20 2017-12-12 テンプレートの形状を調整する方法、システム、インプリントリソグラフィ方法 Active JP7085827B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/385,189 2016-12-20
US15/385,189 US10578984B2 (en) 2016-12-20 2016-12-20 Adaptive chucking system

Publications (3)

Publication Number Publication Date
JP2018101779A JP2018101779A (ja) 2018-06-28
JP2018101779A5 true JP2018101779A5 (enExample) 2021-01-28
JP7085827B2 JP7085827B2 (ja) 2022-06-17

Family

ID=62556290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017237854A Active JP7085827B2 (ja) 2016-12-20 2017-12-12 テンプレートの形状を調整する方法、システム、インプリントリソグラフィ方法

Country Status (3)

Country Link
US (1) US10578984B2 (enExample)
JP (1) JP7085827B2 (enExample)
KR (1) KR102272038B1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10276455B2 (en) * 2016-07-29 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for measurement of semiconductor device fabrication tool implement
JP7286391B2 (ja) 2019-04-16 2023-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
US11728203B2 (en) 2020-10-13 2023-08-15 Canon Kabushiki Kaisha Chuck assembly, planarization process, apparatus and method of manufacturing an article
US12463081B2 (en) 2023-05-31 2025-11-04 Canon Kabushiki Kaisha Apparatus including a bonding head and a method of using the same
CN118009890B (zh) * 2024-04-09 2024-06-21 佛山市仟安金属制品有限公司 一种五金件手持对比测量装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7019819B2 (en) 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6980282B2 (en) 2002-12-11 2005-12-27 Molecular Imprints, Inc. Method for modulating shapes of substrates
US7179396B2 (en) 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
US7396475B2 (en) 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
WO2005119802A2 (en) 2004-05-28 2005-12-15 Board Of Regents, The University Of Texas System Adaptive shape substrate support system and method
JP2007242893A (ja) * 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
US8945444B2 (en) * 2007-12-04 2015-02-03 Canon Nanotechnologies, Inc. High throughput imprint based on contact line motion tracking control
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
US8913230B2 (en) 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
JP5759303B2 (ja) * 2011-08-11 2015-08-05 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP2013110162A (ja) * 2011-11-17 2013-06-06 Canon Inc インプリント装置及び物品の製造方法
JP6021606B2 (ja) * 2011-11-28 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法、およびインプリント方法
DE102012111114B4 (de) * 2012-11-19 2018-10-04 Ev Group E. Thallner Gmbh Halbleiterbearbeitungsvorrichtung und -verfahren
JP2015050437A (ja) * 2013-09-04 2015-03-16 キヤノン株式会社 インプリント装置および物品の製造方法
CN105934711B (zh) 2013-11-08 2019-10-25 佳能纳米技术公司 用于改进的覆盖纠正的低接触式压印光刻术模板卡盘系统
JP6361317B2 (ja) * 2014-06-25 2018-07-25 大日本印刷株式会社 位置精度推定方法及び位置精度保証方法

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