USRE47271E1 - Imprint recipe creating device and imprint device - Google Patents
Imprint recipe creating device and imprint device Download PDFInfo
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- USRE47271E1 USRE47271E1 US15/173,516 US201615173516A USRE47271E US RE47271 E1 USRE47271 E1 US RE47271E1 US 201615173516 A US201615173516 A US 201615173516A US RE47271 E USRE47271 E US RE47271E
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Definitions
- Embodiments described herein relate generally to an imprint recipe creating device and an imprint device.
- a nanoimprint method As a technique for realizing both formation of a fine pattern not larger than 100 nm and mass productivity in a manufacturing process of a semiconductor element, attention has been focused on a nanoimprint method.
- a template having unevenness (concave-convex) corresponding to a pattern desired to be formed on a substrate is pressed to an imprint material which has been applied to the surface of the substrate to be transferred and has photo curability, and held until the imprint material permeates inside the unevenness pattern. Thereafter, application of light is performed, to cure the imprint material, and the template is released from the imprint material, to obtain a desired pattern.
- the imprint material is applied to the substrate by ink-jetting with reference to each one shot based on an imprint recipe (information of droplet positions of the imprint material).
- an imprint recipe information of droplet positions of the imprint material.
- FIGS. 1A-1D are process sectional views illustrating an imprint method
- FIG. 2A is a view showing a shot area on a wafer
- FIG. 2B is a view illustrating a droplet position of an imprint material in a shot area
- FIG. 2C is a view illustrating a droplet position of an imprint material in a shot area
- FIG. 3 is a hardware configuration diagram of an imprint recipe creating device according to a first embodiment of the present invention
- FIG. 4 is a function block diagram of the imprint recipe creating device according to the first embodiment
- FIG. 5 is a flowchart illustrating an imprint recipe creating method according to the first embodiment
- FIG. 6 is a view showing an imprint material that fills an unevenness pattern of a template and a residual film
- FIG. 7 is a view showing an example of inside-standard-shot information laid in each shot area
- FIG. 8A is a view showing the inside-standard-shot information
- FIG. 8B is a view showing an example of first inside-wafer-surface information
- FIGS. 9A and 9B are views showing unevenness of a substrate
- FIG. 10 is a view showing variations in unevenness of a substrate inside a wafer surface
- FIG. 11 is a view showing variations in processing size of post-process processing
- FIG. 12 is a view showing an example of a residual film thickness inside the wafer surface
- FIG. 13 is a hardware configuration diagram of an imprint recipe creating device according to a second embodiment of the present invention.
- FIG. 14 is a function block diagram of the imprint recipe creating device according to the second embodiment.
- an imprint recipe creating device comprising a first creation unit which creates inside-standard-shot information indicating droplet positions of an imprint material in a shot area corresponding to one shot of imprinting, a second creation unit which creates first inside-wafer-surface information indicating droplet positions of the imprint material inside a wafer surface, a third creation unit which creates first correction information indicating droplet positions of the imprint material for correcting unevenness generated in a substrate of the shot area inside the wafer surface, a fourth creation unit which creates second correction information indicating droplet positions of the imprint material for correcting variations in processing size in processing after the imprint process inside the wafer surface, and a fifth creation unit which creates second inside-wafer-surface information.
- the first creation unit creates the inside-standard-shot information by use of filling amount information indicating an amount of the imprint material that fills depressed portions of a template and a residual film thickness information indicating a film thickness of a residual film that is formed on a wafer.
- the second creation unit creates the first inside-wafer-surface information by use of shot position information indicating a position at which a shot of imprinting is performed inside the wafer surface, edge information indicating an edge of the wafer, and the inside-standard-shot information.
- the third creation unit creates the first correction information by use of unevenness information indicating the unevenness, and unevenness distribution information indicating variations in depth of the unevenness inside the wafer surface.
- the fourth creation unit creates the second correction information by use of post-process information indicating the variations in processing size.
- the fifth creation unit synthesizes the first inside-wafer-surface information, the first correction information and the second correction information, to create the second inside-wafer-surface information.
- an imprint method will be described.
- an imprint material 12 is applied onto a substrate 11 based on an after-mentioned imprint recipe. Then, a template 13 having unevenness corresponding to a pattern to be formed is brought into contact with the applied imprint material 12 .
- the imprint material 12 is a liquid photo-curable organic material, such as an acrylic monomer.
- the liquid imprint material 12 flows in accordance with the unevenness pattern of the template 13 and gets thereinto.
- the applied light may be one that cures the imprint material 12 , and lump light or the like may, for example, be used.
- the template 13 is formed of such a material as to allow this light therethrough, such as quartz glass.
- the template 13 is separated from the imprint material 12 . Since the imprint material 12 has already been cured in this state, it is kept in a state (form) where the template 13 was in contact.
- FIGS. 1A to 1D The steps shown in FIGS. 1A to 1D are repeated, to form a plurality of imprint materials having a desired unevenness pattern on the substrate.
- a substrate (for example, wafer) 20 is divided into shot areas 21 in each of which one shot of imprinting is performed, and the steps shown in FIGS. 1A to 1D are implemented in each shot area 21 .
- the shot area 21 has a size equivalent to that of the template 13 .
- the shot area 21 in an edge portion of the wafer 20 is a partial shot where part of the template 13 lies off the wafer 20 .
- the shot area 21 as the partial shot is shaded in FIG. 2A .
- An imprint recipe is information defining where to apply (drop) the imprint material 12 with regard to each of the all the shot areas 21 of the wafer 20 .
- FIG. 3 shows a hardware configuration of an imprint recipe creating device 100 according to the present embodiment.
- the imprint recipe creating device 100 includes a CPU (central processing unit) 110 , a disk device (hard disk drive) 120 , a main memory 130 and an interface 140 . Each unit of the imprint recipe creating device 100 is connected through a bus.
- the disk device 120 stores a variety of information for use in creation of the imprint recipe. Specifically, the disk device 120 stores filling amount information, residual film thickness information, shot position information, edge information, unevenness information, unevenness distribution information, post-process information, and shot size information. Details of respective information will be described later.
- the disk device 120 stores an imprint recipe creating program to be executed by the CPU 110 .
- the CPU 110 loads the imprint recipe creating program inside the disk device 120 to the main memory 130 , to execute the imprint recipe creating program.
- the respective information filling amount information, residual film thickness information, shot position information, edge information, unevenness information, unevenness distribution information, post-process information, and shot size information
- the respective information inside the disk device 120 may also be loaded to the main memory 130 .
- FIG. 4 is a function block diagram that is realized by the CPU 110 executing the imprint recipe creating program.
- a first creation unit 111 which creates inside-standard-shot information
- a second creation unit 112 which creates first inside-wafer-surface information (first inside-substrate-surface information)
- a third creation unit 113 which creates first correction information
- a fourth creation unit 114 which creates second correction information
- a fifth creation unit 115 which creates second inside-wafer-surface information (second inside-substrate-surface information)
- a sixth creation unit 116 which creates an imprint recipe.
- the inside-standard-shot information, the first inside-wafer-surface information, the second inside-wafer-surface information, the first correction information and the second correction information will be described later.
- the first creation unit 111 creates the inside-standard-shot information by use of the filling amount information and the residual film thickness information.
- the filling amount information is information indicating an amount of the imprint material that fills the inside of the unevenness pattern of the template at the time of performing a shot of imprinting.
- the residual film thickness information is information indicating a thickness of a residual film for preventing the template from directly coming into contact with the substrate.
- the inside-standard-shot information is information indicating droplet (applied) positions of the imprint material in an area (shot area) corresponding to one shot of imprinting.
- an area A 1 corresponds to the imprint material that fills the unevenness patterns of the template
- an area A 2 corresponds to the residual film.
- the first creation unit 111 obtains droplet positions (a droplet amount) of the imprint material which is required for filling the inside of the unevenness pattern of the template. For example, in the area corresponding to the depressed portions of the template, the droplet positions of the imprint material are made dense (the number of droplet places is made large), to make the droplet amount large. Further, the first creation unit 111 obtains droplet positions (a droplet amount) of the imprint material which is required for forming the residual film. Then, as shown in FIG. 7 , the first creation unit 111 synthesizes (adds) these two types of droplet positions, to create the inside-standard-shot information.
- the second creation unit 112 creates the first inside-wafer-surface information based on the shot position information, the edge information, and the inside-standard-shot information created in Step S 101 .
- the shot position information is information showing a position where a shot of imprinting is performed on the wafer.
- the shot position information is information indicating a position (coordinate) of the center of each shot area 21 in FIG. 2A .
- the edge information is information indicating an edge of the wafer.
- the edge information is information required for preventing the imprint material from being dropped to the outside of the edge of the wafer.
- the first inside-wafer-surface information is information indicating droplet positions of the imprint material across the wafer surface.
- the second creation unit 112 discriminates between a shot area being the partial shot and a shot area not being the partial shot. The second creation unit 112 then corrects the inside-standard-shot information with regard to the short area as the partial shot such that the imprint material is not dropped to the outside of the edge of the wafer, to create the first inside-wafer-surface information.
- the second creation unit 112 first lays the inside-standard-shot information in each shot area. Then, as shown in FIG. 8B , the second creation unit 112 corrects the inside-standard-shot information with regard to the short area as the partial shot such that the imprint material is not dropped to the outside of the edge of the wafer. In this manner, the first inside-wafer-surface information indicating the droplet positions of the imprint material across the inside of the wafer surface can be created.
- the third creation unit 113 creates first correction information by use of the unevenness information and the unevenness distribution information.
- the unevenness information is information indicating unevenness generated in each shot area by a process before the imprint process.
- a depressed portion 33 is also formed on the processed film 32 in association with the depressed portion 31 of the substrate 30 .
- CMP chemical-mechanical polishing
- the unevenness distribution information indicates how the unevenness information changes (varies) depending on the position inside the wafer surface. For example, when the depressed portion 34 shown in FIG. 9B becomes deeper as its position gets farther away from the center of the wafer (closer to the edge) as shown in FIG. 10 , such changes (variations) are included in the unevenness distribution information.
- the third creation unit 113 creates the first correction information indicating such droplet positions of the imprint material as to correct varied unevenness inside the wafer surface by use of the unevenness information and unevenness distribution information as described above.
- the first correction information is created in which droplet positions of the imprint material are set in positions corresponding, to the depressed portions 34 . This is because a further imprint material is required for filling the depressed portions 34 than in the other area. It is to be noted that in this example, as the position gets farther away from the center of the wafer, the more imprint material is required for filling the depressed portion 34 , and the number of applied positions is made larger (the applied positions are made denser).
- the fourth creation unit 114 creates the second correction information by use of the post-process information.
- the post-process information includes information of variations (distribution) in processing size in the processing process (post-process) implemented after the imprint process inside the wafer surface.
- a pattern of an imprint material 42 formed by the imprint process, is formed on a processed film 41 .
- RIE reactive ion etching
- the post-process information includes such a characteristic of the post process.
- the post-process information is previously obtained by an experiment.
- the fourth creation unit 114 creates the second correction information indicating such droplet positions of the imprint material as to correct variations (distribution) in processing size in the post-process processing.
- the fourth creation unit 114 creates the second correction information that corrects the droplet positions of the imprint material such that the thickness of the residual film decreases as its position gets farther away from the center of the wafer.
- the variations in processed size due to the post-process (RIE) can be corrected so as to obtain a uniform processing pattern inside the wafer surface, as shown in FIG. 12 .
- Steps S 102 , S 103 , S 104 may be performed in any order.
- the fifth creation unit 115 creates the second inside-wafer-surface information by use of the first inside-wafer-surface information, the first correction information and the second correction information.
- the first inside-wafer-surface information is information indicating droplet positions of the imprint material across the wafer surface.
- the first correction information is information indicating such droplet positions of the imprint material as to correct unevenness generated on the substrate by the process before the imprint process.
- the second correction information is information indicating such droplet positions of the imprint material as to correct variations (distribution) in processing size inside the wafer surface, generated by the processing process after the imprint process.
- the fifth creation unit 115 synthesizes (adds) the first inside-wafer-surface information, the first correction information and the second correction information, to create the second inside-wafer-surface information
- the second inside-wafer-surface information is information indicating droplet positions of the imprint material across the wafer surface in view of the correction of the unevenness of the substrate, generated before the imprinting, and the correction of variation in processed size, generated after the imprinting.
- the sixth creation unit 116 creates an imprint recipe by use of the second inside-wafer-surface information, the shot size information and the shot position information.
- the shot size information is information indicating a size of one shot, namely a size of the template.
- the shot position information is information indicating a position at which a shot of imprinting is performed on the wafer. Therefore, the sixth creation unit 116 can obtain a range of each shot area on the wafer based on the shot size information and the shot position information.
- the sixth creation unit 116 can carve the second inside-wafer-surface information by use of the range of each shot area, so as to collectively create an imprint recipe with regard to every shot inside the wafer surface.
- the imprint recipe created by the imprint recipe creating device 100 is given to an imprint device 200 (see FIG. 3 ).
- the imprint device 200 can, for example, receive the imprint recipe from the imprint recipe creating device 100 through a cable or wireless network.
- the imprint device 200 applies the imprint material based on the imprint recipe, brings the template into contact therewith, applies light and releases the template, to form a pattern (see FIGS. 1A to 1D ).
- the present embodiment it is possible to collectively create the imprint recipe with regard to every shot inside the wafer surface by use of the filling amount information, the residual film thickness information, the shot position information, the edge information, the unevenness information, the unevenness distribution information, the post-process information, and the shot size information in view of the unevenness of the substrate, generated before the imprinting, and the variations in processed size, generated after the imprinting. Since there is no need for creating the imprint recipe with respect to each shot, the time for creating the imprint recipe can be reduced.
- the unevenness information may further be used in addition to the inside-standard-shot information, the shot position information and the edge information.
- the first inside-wafer-surface information is created in view of the unevenness of the substrate.
- the first correction information is information created based on the unevenness distribution information and indicates an applied position of the imprint material for correcting variations in unevenness.
- Steps S 101 to S 105 of the flowchart shown in FIG. 5 may be performed in the imprint recipe creating device 100 , and the second inside-wafer-surface information, the shot size information and the shot position information may be passed to the imprint device 200 provided with the function of the sixth creation unit 116 , so that the processing of Step S 106 may be performed in the imprint device 200 .
- FIG. 13 shows a hardware configuration of an imprint recipe creating device 100 according to a second embodiment of the present invention. Since the hardware configuration is as in the above first embodiment shown in FIG. 3 , a description thereof will not be repeated here. Further, since after-mentioned filling amount information, residual film thickness information, shot position information, edge information, unevenness information, unevenness distribution information, post-process information, and inside-standard-shot information are as in the above first embodiment, descriptions thereof will not be repeated here.
- FIG. 14 is a function block diagram realized by a CPU 110 executing an imprint recipe creating program.
- a first creation unit 151 which creates inside-standard-shot information
- a second creation unit 152 which creates a standard imprint recipe
- a third creation unit 153 which creates a correction map are realized.
- the standard imprint recipe and the correction map will be described later.
- the first creation unit 151 creates the inside-standard-shot information by use of the filling amount information and the residual film thickness information, as does the first creation unit 111 in the above first embodiment.
- the second creation unit 152 creates the standard imprint recipe by use of the inside-standard-shot information and the unevenness information.
- the standard imprint recipe is information (imprint recipe) indicating droplet positions of the imprint material as being a reference (being standard) in view of ones for correcting the unevenness of the substrate.
- the third creation unit 153 creates the correction map by use of the unevenness distribution information and the post-process information.
- the correction map includes correction information indicating a corrected amount (droplet positions for correction) of the imprint material for correcting variations in unevenness of the substrate inside the wafer surface and variations in processed size in the post-process inside the wafer surface.
- an imprint device 200 receives the standard imprint recipe, the correction map, the shot position information and the edge information from the imprint recipe creating device 100 .
- the imprint device 200 may previously hold the shot position information and the edge information in a storage unit (not shown).
- the imprint device 200 acquires a corrected amount corresponding to the shot position from the correction map, and adds the corrected amount to the standard imprint recipe, to correct the standard imprint recipe. The imprint device 200 then drops the imprint material based on the imprint recipe after the correction. Based on the edge information, the imprint device 200 adjusts the droplet positions in accordance with the shot position such that the imprint material is not dropped to the outside of the edge of the wafer.
- the imprint recipe with respect to one shot, the correction map, the shot position information and the edge information are inputted into the imprint device 200 , as compared with the above first embodiment where the imprint recipe with respect to every shot is inputted into the imprint device 200 , it is possible to reduce an amount of data inputted into the imprint device 200 , so as to cut an overhead of the imprint process.
- the correction map created by the third creation unit 153 may be a function defining a relation between the shot position and a corrected amount of droplet (correction information) of the imprint material. Representing the correction map by means of the function can further reduce the amount of data inputted into the imprint device 200 .
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Priority Applications (1)
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US15/173,516 USRE47271E1 (en) | 2010-08-31 | 2016-06-03 | Imprint recipe creating device and imprint device |
Applications Claiming Priority (4)
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JP2010194231A JP5214683B2 (en) | 2010-08-31 | 2010-08-31 | Imprint recipe creating apparatus and method, and imprint apparatus and method |
JP2010-194231 | 2010-08-31 | ||
US13/177,763 US8740377B2 (en) | 2010-08-31 | 2011-07-07 | Imprint recipe creating device and imprint device |
US15/173,516 USRE47271E1 (en) | 2010-08-31 | 2016-06-03 | Imprint recipe creating device and imprint device |
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US13/177,763 Reissue US8740377B2 (en) | 2010-08-31 | 2011-07-07 | Imprint recipe creating device and imprint device |
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Families Citing this family (20)
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JP5694219B2 (en) * | 2012-03-21 | 2015-04-01 | 株式会社東芝 | Drop position setting program, imprint method, and imprint apparatus |
JP6200135B2 (en) * | 2012-07-24 | 2017-09-20 | キヤノン株式会社 | Imprint apparatus, imprint method, and article manufacturing method |
JP5813603B2 (en) | 2012-09-04 | 2015-11-17 | 株式会社東芝 | Imprint apparatus and imprint method |
JP6333039B2 (en) | 2013-05-16 | 2018-05-30 | キヤノン株式会社 | Imprint apparatus, device manufacturing method, and imprint method |
JP6315904B2 (en) | 2013-06-28 | 2018-04-25 | キヤノン株式会社 | Imprint method, imprint apparatus, and device manufacturing method |
JP6329437B2 (en) * | 2014-06-10 | 2018-05-23 | キヤノン株式会社 | Imprint apparatus, imprint method, and article manufacturing method |
JP6478565B2 (en) | 2014-11-06 | 2019-03-06 | キヤノン株式会社 | Imprint system and article manufacturing method |
JP6438332B2 (en) * | 2015-03-18 | 2018-12-12 | キヤノン株式会社 | Imprint system and article manufacturing method |
JP6602033B2 (en) * | 2015-03-31 | 2019-11-06 | キヤノン株式会社 | Imprint apparatus, supply amount distribution generation method, imprint method, and article manufacturing method |
JP6590667B2 (en) * | 2015-11-30 | 2019-10-16 | キヤノン株式会社 | Imprint apparatus, imprint method, and article manufacturing method |
JP6700777B2 (en) * | 2015-12-24 | 2020-05-27 | キヤノン株式会社 | Imprint apparatus, information processing apparatus, and article manufacturing method |
JP6742177B2 (en) * | 2016-07-15 | 2020-08-19 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
US10481491B2 (en) * | 2016-12-12 | 2019-11-19 | Canon Kabushiki Kaisha | Fluid droplet methodology and apparatus for imprint lithography |
US10468247B2 (en) * | 2016-12-12 | 2019-11-05 | Canon Kabushiki Kaisha | Fluid droplet methodology and apparatus for imprint lithography |
US10634993B2 (en) * | 2016-12-12 | 2020-04-28 | Canon Kabushiki Kaisha | Fluid droplet methodology and apparatus for imprint lithography |
US11366400B2 (en) * | 2017-05-15 | 2022-06-21 | Canon Kabushiki Kaisha | Method of determining drop recipe, imprint apparatus, and article manufacturing method |
JP6938313B2 (en) * | 2017-09-28 | 2021-09-22 | キヤノン株式会社 | Imprint device, imprint method, method of determining the arrangement pattern of imprint material, and method of manufacturing articles |
JP7278828B2 (en) * | 2019-03-26 | 2023-05-22 | キヤノン株式会社 | Molding method, molding apparatus, imprinting method, and article manufacturing method |
JP7286400B2 (en) * | 2019-04-24 | 2023-06-05 | キヤノン株式会社 | Molding Apparatus, Determining Method, and Article Manufacturing Method |
JP7451141B2 (en) * | 2019-10-30 | 2024-03-18 | キヤノン株式会社 | Imprint device, imprint method, and article manufacturing method |
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Also Published As
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JP2012054322A (en) | 2012-03-15 |
JP5214683B2 (en) | 2013-06-19 |
US8740377B2 (en) | 2014-06-03 |
US20120050441A1 (en) | 2012-03-01 |
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