JP7085827B2 - テンプレートの形状を調整する方法、システム、インプリントリソグラフィ方法 - Google Patents

テンプレートの形状を調整する方法、システム、インプリントリソグラフィ方法 Download PDF

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JP7085827B2
JP7085827B2 JP2017237854A JP2017237854A JP7085827B2 JP 7085827 B2 JP7085827 B2 JP 7085827B2 JP 2017237854 A JP2017237854 A JP 2017237854A JP 2017237854 A JP2017237854 A JP 2017237854A JP 7085827 B2 JP7085827 B2 JP 7085827B2
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Prior art keywords
shape
template
active region
adaptive chuck
chuck
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JP2017237854A
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English (en)
Japanese (ja)
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JP2018101779A5 (enExample
JP2018101779A (ja
Inventor
ヨハネル マイスル マリオ
チェララ アンシュマン
チョイ ビュン－ジン
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Canon Inc
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Canon Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017237854A 2016-12-20 2017-12-12 テンプレートの形状を調整する方法、システム、インプリントリソグラフィ方法 Active JP7085827B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/385,189 2016-12-20
US15/385,189 US10578984B2 (en) 2016-12-20 2016-12-20 Adaptive chucking system

Publications (3)

Publication Number Publication Date
JP2018101779A JP2018101779A (ja) 2018-06-28
JP2018101779A5 JP2018101779A5 (enExample) 2021-01-28
JP7085827B2 true JP7085827B2 (ja) 2022-06-17

Family

ID=62556290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017237854A Active JP7085827B2 (ja) 2016-12-20 2017-12-12 テンプレートの形状を調整する方法、システム、インプリントリソグラフィ方法

Country Status (3)

Country Link
US (1) US10578984B2 (enExample)
JP (1) JP7085827B2 (enExample)
KR (1) KR102272038B1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10276455B2 (en) * 2016-07-29 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for measurement of semiconductor device fabrication tool implement
JP7286391B2 (ja) 2019-04-16 2023-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
US11728203B2 (en) 2020-10-13 2023-08-15 Canon Kabushiki Kaisha Chuck assembly, planarization process, apparatus and method of manufacturing an article
US12463081B2 (en) 2023-05-31 2025-11-04 Canon Kabushiki Kaisha Apparatus including a bonding head and a method of using the same
CN118009890B (zh) * 2024-04-09 2024-06-21 佛山市仟安金属制品有限公司 一种五金件手持对比测量装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242893A (ja) 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
JP2011512019A (ja) 2007-12-04 2011-04-14 モレキュラー・インプリンツ・インコーポレーテッド 接触線運動トラッキング制御に基づく高スループット・インプリント
JP2013038365A (ja) 2011-08-11 2013-02-21 Canon Inc インプリント装置、それを用いた物品の製造方法
JP2013110162A (ja) 2011-11-17 2013-06-06 Canon Inc インプリント装置及び物品の製造方法
JP2015050437A (ja) 2013-09-04 2015-03-16 キヤノン株式会社 インプリント装置および物品の製造方法
JP2015536481A (ja) 2012-11-19 2015-12-21 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 半導体加工装置および半導体加工法
JP2016009797A (ja) 2014-06-25 2016-01-18 大日本印刷株式会社 位置精度推定方法及び位置精度保証方法

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US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7019819B2 (en) 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6980282B2 (en) 2002-12-11 2005-12-27 Molecular Imprints, Inc. Method for modulating shapes of substrates
US7179396B2 (en) 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
US7396475B2 (en) 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
WO2005119802A2 (en) 2004-05-28 2005-12-15 Board Of Regents, The University Of Texas System Adaptive shape substrate support system and method
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
US8913230B2 (en) 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
JP6021606B2 (ja) * 2011-11-28 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法、およびインプリント方法
CN105934711B (zh) 2013-11-08 2019-10-25 佳能纳米技术公司 用于改进的覆盖纠正的低接触式压印光刻术模板卡盘系统

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242893A (ja) 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
JP2011512019A (ja) 2007-12-04 2011-04-14 モレキュラー・インプリンツ・インコーポレーテッド 接触線運動トラッキング制御に基づく高スループット・インプリント
JP2013038365A (ja) 2011-08-11 2013-02-21 Canon Inc インプリント装置、それを用いた物品の製造方法
JP2013110162A (ja) 2011-11-17 2013-06-06 Canon Inc インプリント装置及び物品の製造方法
JP2015536481A (ja) 2012-11-19 2015-12-21 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 半導体加工装置および半導体加工法
JP2015050437A (ja) 2013-09-04 2015-03-16 キヤノン株式会社 インプリント装置および物品の製造方法
JP2016009797A (ja) 2014-06-25 2016-01-18 大日本印刷株式会社 位置精度推定方法及び位置精度保証方法

Also Published As

Publication number Publication date
KR20180071970A (ko) 2018-06-28
US20180173119A1 (en) 2018-06-21
JP2018101779A (ja) 2018-06-28
KR102272038B1 (ko) 2021-07-02
US10578984B2 (en) 2020-03-03

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