JP2018101684A - センサモジュールおよびその製造方法 - Google Patents
センサモジュールおよびその製造方法 Download PDFInfo
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- JP2018101684A JP2018101684A JP2016246523A JP2016246523A JP2018101684A JP 2018101684 A JP2018101684 A JP 2018101684A JP 2016246523 A JP2016246523 A JP 2016246523A JP 2016246523 A JP2016246523 A JP 2016246523A JP 2018101684 A JP2018101684 A JP 2018101684A
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Abstract
Description
図1〜図9に基づき、本発明の第1実施形態にかかるセンサモジュールA1について説明する。図1は、センサモジュールA1を示す斜視図である。図2は、センサモジュールA1を示す平面図である。図3は、図1のIII−III線に沿う断面図である。図4は、図2のIV−IV線に沿う要部拡大断面図である。図5は、センサモジュールA1の他の実施例であり、図4に相当する図である。図6は、図2のVI−VI線に沿う要部拡大断面図である。図7は、センサモジュールA1のブロック図である。なお、理解の便宜上、図1および図2は、後述するカバー6の記載を省略しており、図2および図3は、後述する保護部材5を透過させて記載している。また、図3においては、電極パッドおよびボンディングワイヤの一部を省略している。また、図6においては、後述する保護部材5の記載を省略している。これらの図において、センサモジュールA1の厚さ方向(平面視方向)をz方向(z1−z2方向)とし、z方向に直交するセンサモジュールA1の一方の辺に沿う方向をx方向(x1−x2方向)、z方向およびx方向に直交する方向をy方向(y1―y2方向)として説明する(以下の図においても同様)。本実施形態においては、センサモジュールA1は、x方向およびy方向寸法が例えば2mm程度、z方向寸法が0.8〜1mm程度とされる。
図16は、本発明の第2実施形態にかかるセンサモジュールA2を示す平面図である。なお、理解の便宜上、図16においては、カバー6の記載を省略している(図17,図23〜図25についても同様)。
図17は、本発明の第3実施形態にかかるセンサモジュールA3を示す平面図である。
図18は、本発明の第4実施形態にかかるセンサモジュールA4を示す断面図である。図18は、第1実施形態にかかるセンサモジュールA1における図3に相当する断面図である(図22についても同様)。
図22は、本発明の第5実施形態にかかるセンサモジュールA5を示す断面図である。
図23は、本発明の第6実施形態にかかるセンサモジュールA6を示す平面図である。
図24は、本発明の第7実施形態にかかるセンサモジュールA7を示す平面図である。
図25は、本発明の第8実施形態にかかるセンサモジュールA8を示す平面図である。
1 :基板
1a :搭載面
1b :実装面
1c :側面
11 :電極パッド
12 :電極パッド
13 :配線パターン
14 :貫通配線
15 :中層配線
16 :配線パターン
17 :保護膜
2 :電子部品
2a :搭載面
2b :実装面
2c :側面
21 :電極パッド
22 :温度センサ
23 :マルチプレクサ
24 :アナログ/デジタル変換回路
25 :信号処理部
26 :クロック
27 :記憶部
28 :インターフェイス
3 :気圧センサ
3a :主面
3b :実装面
3c :側面
31 :シリコン基板
311 :ダイアフラム
312 :支持層
31a :シリコン層
31b :酸化層
31c :シリコン層
32 :ガラス基板
33 :キャビティ
34,34a〜34d :電極パッド
35 :金属配線
36 :拡散配線
37,37a〜37d :拡散抵抗
4 :ボンディングワイヤ
5 :保護部材
5a :山形部
6 :カバー
61 :開口部
7 :ダイアタッチフィルム
81 :シート状基板
82 :シリコーンペースト
83 :ノズル
Claims (27)
- 互いに反対側を向く基板主面および基板裏面を有し、前記基板主面に電極が設けられた基板と、
互いに反対側を向くセンサ主面およびセンサ裏面と、前記センサ主面およびセンサ裏面を繋ぐセンサ側面とを有し、前記センサ裏面を前記基板側に向けて、前記基板主面に搭載されたセンサと、
前記電極に接続されるボンディングワイヤと、
前記電極を覆う保護部材と、
を備えており、
前記保護部材は、前記ボンディングワイヤの一部を露出させており、かつ、前記センサ側面に接している、
ことを特徴とするセンサモジュール。 - 前記保護部材は、前記電極から、前記ボンディングワイヤの曲率が最大となる部位まで連続的に覆っている、
請求項1に記載のセンサモジュール。 - 前記センサは、凹部を有する支持部と、前記支持部の開口を塞ぐカバーとを備えている、
請求項1または2に記載のセンサモジュール。 - 前記保護部材は、前記支持部と前記カバーとの境界の少なくとも一部を覆っている、
請求項3に記載のセンサモジュール。 - 前記保護部材は、前記センサ主面の少なくとも一部を露出させている、
請求項1ないし4のいずれかに記載のセンサモジュール。 - 前記センサは、前記センサ主面に形成された回路を備えており、
前記保護部材は、前記回路を露出させている、
請求項1ないし5のいずれかに記載のセンサモジュール。 - 前記センサは、中空部分を備えており、
前記保護部材は、前記センサ主面の、平面視において前記中空部分が位置する領域を露出させている、
請求項1ないし6のいずれかに記載のセンサモジュール。 - 前記保護部材は、前記基板主面と前記センサ裏面との間に位置する部分を有する、
請求項1ないし7のいずれかに記載のセンサモジュール。 - 前記センサ側面は複数あり、
前記保護部材は、前記複数のセンサ側面のうち、連続する少なくとも2つのセンサ側面のそれぞれの一部を覆っている、
請求項1ないし8のいずれかに記載のセンサモジュール。 - 前記保護部材は、前記基板の前記電極から離れる方向に向かって前記ボンディングワイヤに沿って突出する山形部を有する、
請求項1ないし9のいずれかに記載のセンサモジュール。 - 前記基板は、前記基板主面および基板裏面を繋ぐ4つの基板側面を有し、
前記センサは、前記基板主面の中央に対して、連続する2つの基板側面寄りに搭載されており、
前記電極は、前記基板主面の、前記2つの基板側面とは異なる連続する2つの基板側面側の電極配置領域に複数設けられており、
前記保護部材は、前記電極配置領域を覆っている、
請求項1ないし10のいずれかに記載のセンサモジュール。 - 前記保護部材は、シリコーン樹脂である、
請求項1ないし11のいずれかに記載のセンサモジュール。 - 前記基板と前記センサとを接合する接合部材をさらに備えており、
前記保護部材は、前記接合部材と同じ素材である、
請求項1ないし12のいずれかに記載のセンサモジュール。 - 前記電極は、Alまたはアルミ合金からなる、
請求項1ないし13のいずれかに記載のセンサモジュール。 - 前記基板は電子部品である、
請求項1ないし14のいずれかに記載のセンサモジュール。 - 互いに反対側を向く第2基板主面および第2基板裏面を有し、前記第2基板主面に第2電極が設けられた第2基板をさらに備えており、
前記基板は、前記第2基板主面に搭載されている、
請求項1ないし15のいずれかに記載のセンサモジュール。 - 前記第2基板は、前記第2基板主面および第2基板裏面を繋ぐ4つの第2基板側面を有し、
前記基板は、前記第2基板主面の中央に対して、連続する2つの第2基板側面寄りに搭載されており、
前記第2電極は、前記第2基板主面の、前記2つの第2基板側面とは異なる連続する2つの第2基板側面側の第2電極配置領域に複数設けられている、
請求項16に記載のセンサモジュール。 - 前記保護部材は、前記第2基板主面まで連続的に覆っている、
請求項16または17に記載のセンサモジュール。 - 前記第2電極を覆う第2保護部材をさらに備えている、
請求項16ないし18のいずれかに記載のセンサモジュール。 - 前記基板主面に搭載される電子部品をさらに備えている、
請求項1ないし14のいずれかに記載のセンサモジュール。 - 前記センサは、前記センサ主面に形成された第3電極を備えており、
前記第3電極を覆う第3保護部材をさらに備えている、
請求項1ないし20のいずれかに記載のセンサモジュール。 - 箱形状をなし、前記センサ、前記ボンディングワイヤおよび前記保護部材を囲うように配置される第2のカバーをさらに備えている、
請求項1ないし21のいずれかに記載のセンサモジュール。 - 前記第2のカバーには、開口部が設けられている、
請求項22に記載のセンサモジュール。 - 前記電極は複数設けられており、
少なくとも、平面視において前記開口部に対して最も近い位置に設けられている電極は、前記保護部材によって覆われている、
請求項23に記載のセンサモジュール。 - 前記第2のカバーは金属製である、
請求項22ないし24のいずれかに記載のセンサモジュール。 - 前記センサは気圧センサである、
請求項1ないし25のいずれかに記載のセンサモジュール。 - 互いに反対側を向く主面および裏面を有し、前記主面に基板電極が設けられたシート状基板を用意する第1の工程と、
前記シート状基板の主面に、電子部品電極が設けられた電子部品を搭載する第2の工程と、
前記基板電極と前記電子部品電極とをボンディングワイヤで接続する第3の工程と、
前記電子部品の前記シート状基板とは反対側の面に、互いに反対側を向くセンサ主面およびセンサ裏面と、前記センサ主面およびセンサ裏面を繋ぐセンサ側面とを有し、前記センサ主面にセンサ電極が設けられたセンサを搭載する第4の工程と、
前記電子部品電極を覆い、かつ、前記センサ側面に接するように、シリコーンペーストを塗布し、硬化させることで保護部材を形成する第5の工程と、
前記センサ電極と前記基板電極とをボンディングワイヤで接続する第6の工程と、
箱形状をなすカバーを、前記電子部品、センサ、ボンディングワイヤおよび保護部材を囲うようにして、前記シート状基板の主面に固着する第7の工程と、
を備えていることを特徴とする、センサモジュールの製造方法。
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