JP2018081745A - 基板とコネクタとの接続構造、基板および基板とコネクタとの接続方法 - Google Patents
基板とコネクタとの接続構造、基板および基板とコネクタとの接続方法 Download PDFInfo
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
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- H01R12/70—Coupling devices
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- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
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- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
- H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
- H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
Abstract
Description
図1は本発明の第1の実施形態の基板とコネクタとの接続構造を示している。以下、説明の便宜上、図1、図2等の右下に描いた矢印Fの方向を手前、矢印Bの方向を奥、矢印Lの方向を左、矢印Rの方向を右、矢印Uの方向を上、矢印Dの方向を下とする。
図10は、本発明の第2の実施形態の基板とコネクタとの接続構造における基板51を図3と同様の位置から見た図である。図11は図10中の矢示XI−XI方向から見た基板51の断面を示している。図10または図11に示すように、基板51は、図3または図4に示す第1の実施形態の基板11と比較して層数が少ない。基板51は、誘電体層52と、誘電体層52の上面に形成された信号パターン53と、誘電体層52の上面において信号パターン53の左右両側に形成された一対のグランドパターン54と、誘電体層52の下側に誘電体層52を隣接して設けられたグランド層55とを備えている。グランド層55の下側には層が形成されていない。
11、51、61、71 基板
11A、51A、61A、71A 端面
12、53 信号パターン
14、52 第1の誘電体層
15 第1のグランド層
16 第2の誘電体層
17 第2のグランド層
21、56、62、72 めっき膜(端面導電膜)
23 挿通孔(第1の穴部)
31 コネクタ
32 中心導体
35 絶縁体
36 外部導体
41 下側端部
42 上側端部
43 段差面
45 固定部
46 挿通孔(第2の穴部)
49 ねじ(締着部材)
55 グランド層
Claims (10)
- 基板と前記基板の端部に固定されるコネクタとを備えた、基板とコネクタとの接続構造であって、
前記基板は、
第1の誘電体層と、
前記第1の誘電体層の上面に設けられた信号パターンと、
前記第1の誘電体層よりも下側に設けられ、前記信号パターンと共に信号伝送回路を形成する第1のグランド層と、
前記基板の前記端部の端面において、当該端面と対向する位置から見て前記信号パターンの直下に位置し、かつ前記信号パターンから離れ、前記第1のグランド層の端面を含む領域に形成された端面導電膜とを備え、
前記コネクタは、
中心導体と、
前記中心導体の外周側に絶縁体を介して設けられた外部導体と、
前記外部導体に設けられ、当該コネクタを前記基板の前記端部に固定する固定部とを備え、
前記固定部により前記コネクタが前記基板の前記端部に固定されたとき、前記中心導体が前記信号パターンと接触し、かつ前記端面導電膜が前記外部導体に接触することを特徴とする基板とコネクタとの接続構造。 - 前記基板は、前記第1のグランド層よりも下側に設けられた1層以上の層をさらに備えた多層基板であることを特徴とする請求項1に記載の基板とコネクタとの接続構造。
- 前記基板は、
前記第1のグランド層の下側に当該第1のグランド層と隣接して設けられた第2の誘電体層と、
前記第2の誘電体層の下側に当該第2の誘電体層と隣接して設けられた第2のグランド層とを備え、
前記端面導電膜は、前記基板の前記端部の端面において、当該端面と対向する位置から見て前記信号パターンの直下であって前記第1のグランド層の端面から前記第2のグランド層の端面にかけての領域に形成されていることを特徴とする請求項2に記載の基板とコネクタとの接続構造。 - 前記端面導電膜は前記基板に部分めっきを施すことにより形成されためっき膜であることを特徴とする請求項1ないし3のいずれかに記載の基板とコネクタとの接続構造。
- 筒状に形成された前記外部導体の前記基板と向かい合う側の端部において、径方向下側に位置する下側端部が径方向上側に位置する上側端部よりも軸方向に後退し、前記下側端部と前記上側端部との間には前記下側端部と前記上側端部との間を接続する段差面が形成され、
前記固定部により前記コネクタが前記基板の前記端部に固定されたときには、前記基板の前記端部の端面が前記下側端部の端面に対向し、前記基板の前記端部の上面が前記段差面に対向することを特徴とする請求項1ないし4のいずれかに記載の基板とコネクタとの接続構造。 - 前記固定部は、前記外部導体の前記基板と向かい合う側の端部から前記基板の上面上へ突出し、当該固定部は前記基板の上面に締着部材を介して固定されることを特徴とする請求項1ないし5のいずれかに記載の基板とコネクタとの接続構造。
- 前記基板には前記固定部を当該基板の上面に固定するために前記締着部材を通す第1の穴部が形成され、前記固定部には当該固定部を前記基板の上面に固定するために前記締着部材を通す第2の穴部が形成され、前記基板の前記端部の端面から前記第1の穴部までの距離は、前記外部導体の端面において前記基板の前記端部の端面が対向する部分から前記第2の穴部までの距離よりも長いことを特徴とする請求項6に記載の基板とコネクタとの接続構造。
- 信号伝送回路を形成する基板であって、
誘電体層と、
前記誘電体層の上面に設けられた信号パターンと、
前記誘電体層よりも下側に設けられ、前記信号パターンと共に前記信号伝送回路を形成するグランド層と、
当該基板の端部の端面において、当該端面と対向する位置から見て前記信号パターンの直下に位置し、かつ前記信号パターンから離れ、前記グランド層の端面を含む領域に形成された端面導電膜とを備え、
中心導体および前記中心導体の外周側に絶縁体を介して設けられた外部導体を有する基板端部実装型のコネクタが当該基板の前記端部に固定されたとき、前記中心導体が前記信号パターンと接触し、かつ前記端面導電膜が前記外部導体に接触することを特徴とする基板。 - 誘電体層、前記誘電体層の上面に設けられた信号パターン、および前記誘電体層よりも下側に設けられ、前記信号パターンと共に信号伝送回路を形成するグランド層を備えた基板と、
中心導体、前記中心導体の外周側に絶縁体を介して設けられた外部導体、および前記外部導体に設けられ、当該コネクタを前記基板の前記端部に固定する固定部を備えたコネクタとを接続する基板とコネクタとの接続方法であって、
前記基板の前記端部の端面において、当該端面と対向する位置から見て前記信号パターンの直下に位置し、かつ前記信号パターンから離れ、前記グランド層の端面を含む領域に端面導電膜を形成し、
前記中心導体を前記信号パターンと接触させ、かつ前記端面導電膜を前記外部導体に接触させつつ、前記コネクタを前記基板の前記端部に前記固定部を介して固定することを特徴とする基板とコネクタとの接続方法。 - 前記端面導電膜の形成は前記基板に部分めっきを施すことにより行うことを特徴とする請求項9に記載の基板とコネクタとの接続方法。
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JP2016221169A JP6853655B2 (ja) | 2016-11-14 | 2016-11-14 | 基板とコネクタとの接続構造および基板 |
CN201711115905.3A CN108075261B (zh) | 2016-11-14 | 2017-11-13 | 基板和连接器的连接结构、基板以及基板和连接器的连接方法 |
US15/812,765 US10148027B2 (en) | 2016-11-14 | 2017-11-14 | Structure for connecting board and connector, board, and method for connecting board and connector |
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Cited By (3)
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JP2021064444A (ja) * | 2019-10-10 | 2021-04-22 | ヒロセ電機株式会社 | 同軸電気コネクタ |
CN113013615A (zh) * | 2021-02-22 | 2021-06-22 | 常熟市泓博通讯技术股份有限公司 | 配合紧密组装的天线模块 |
JP2021164131A (ja) * | 2020-04-03 | 2021-10-11 | アンリツ株式会社 | 伝送線路変換構造 |
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US20210168950A1 (en) * | 2018-05-14 | 2021-06-03 | Mitsubishi Electric Corporation | Electronic device and electric power steering apparatus having electronic device mounted thereto |
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US10971838B1 (en) * | 2019-11-14 | 2021-04-06 | Chun-Te Lee | Combination structure of clamping member and circuit board for signal connector |
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JP2021164131A (ja) * | 2020-04-03 | 2021-10-11 | アンリツ株式会社 | 伝送線路変換構造 |
JP7303773B2 (ja) | 2020-04-03 | 2023-07-05 | アンリツ株式会社 | 伝送線路変換構造 |
CN113013615A (zh) * | 2021-02-22 | 2021-06-22 | 常熟市泓博通讯技术股份有限公司 | 配合紧密组装的天线模块 |
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CN108075261B (zh) | 2020-11-27 |
JP6853655B2 (ja) | 2021-03-31 |
US10148027B2 (en) | 2018-12-04 |
US20180138615A1 (en) | 2018-05-17 |
CN108075261A (zh) | 2018-05-25 |
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