JP2018044242A5 - - Google Patents

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Publication number
JP2018044242A5
JP2018044242A5 JP2017172733A JP2017172733A JP2018044242A5 JP 2018044242 A5 JP2018044242 A5 JP 2018044242A5 JP 2017172733 A JP2017172733 A JP 2017172733A JP 2017172733 A JP2017172733 A JP 2017172733A JP 2018044242 A5 JP2018044242 A5 JP 2018044242A5
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JP
Japan
Prior art keywords
copper
plating
term
polymer
deposition
Prior art date
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Granted
Application number
JP2017172733A
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English (en)
Japanese (ja)
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JP6525386B2 (ja
JP2018044242A (ja
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Publication date
Priority claimed from US15/263,655 external-priority patent/US9970114B2/en
Application filed filed Critical
Publication of JP2018044242A publication Critical patent/JP2018044242A/ja
Publication of JP2018044242A5 publication Critical patent/JP2018044242A5/ja
Application granted granted Critical
Publication of JP6525386B2 publication Critical patent/JP6525386B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017172733A 2016-09-13 2017-09-08 選択的な金属被覆のための遮断コーティング Expired - Fee Related JP6525386B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/263,655 2016-09-13
US15/263,655 US9970114B2 (en) 2016-09-13 2016-09-13 Shielding coating for selective metallization

Publications (3)

Publication Number Publication Date
JP2018044242A JP2018044242A (ja) 2018-03-22
JP2018044242A5 true JP2018044242A5 (https=) 2018-12-13
JP6525386B2 JP6525386B2 (ja) 2019-06-05

Family

ID=59846447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017172733A Expired - Fee Related JP6525386B2 (ja) 2016-09-13 2017-09-08 選択的な金属被覆のための遮断コーティング

Country Status (6)

Country Link
US (1) US9970114B2 (https=)
EP (1) EP3296429B1 (https=)
JP (1) JP6525386B2 (https=)
KR (1) KR101975218B1 (https=)
CN (1) CN107814961A (https=)
TW (1) TWI627306B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018104739A (ja) * 2016-12-22 2018-07-05 ローム・アンド・ハース電子材料株式会社 無電解めっき方法
JP7381232B2 (ja) * 2019-07-16 2023-11-15 Ｍｃｐｐイノベーション合同会社 レーザーダイレクトストラクチャリング用熱可塑性樹脂組成物及び成形体
SE543833C2 (en) * 2020-01-24 2021-08-03 Mercene Coatings Ab Coating including primer
US12528949B2 (en) 2020-01-24 2026-01-20 Mercene Coatings Ab Coating including primer
EP4211292A4 (en) * 2020-09-08 2024-09-11 Nanyang Technological University SURFACE CONDITIONING PRODUCT FOR AUTOCATALYTIC DEPOSITION
KR102499773B1 (ko) 2020-10-08 2023-02-15 한국과학기술연구원 발 특성 정보 및 균형 특성 정보를 이용한 노인성 질환 예측 방법 및 시스템

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3770896D1 (de) * 1986-09-15 1991-07-25 Gen Electric Verfahren zur photoselektiven metallisierung.
DE69430318T2 (de) * 1994-12-19 2002-11-14 John F. Bohland Jun. Verfahren zur selektiven Metallisierung
US6909018B1 (en) 1996-05-20 2005-06-21 Basf Aktiengesellschaft Preparation of polyalkeneamines
JP4463345B2 (ja) 1999-06-18 2010-05-19 関西ペイント株式会社 塗料組成物
US6899829B2 (en) * 2000-11-30 2005-05-31 Shipley Company, L.L.C. Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
JP3541360B2 (ja) * 2002-05-17 2004-07-07 独立行政法人 科学技術振興機構 多層回路構造の形成方法及び多層回路構造を有する基体
CN100590149C (zh) * 2003-07-18 2010-02-17 小西株式会社 固化性树脂组合物及常温固化性粘结剂
US6946232B2 (en) * 2003-11-17 2005-09-20 Polaroid Corporation Image-receiving element
DE102004017440A1 (de) 2004-04-08 2005-11-03 Enthone Inc., West Haven Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen
US7291380B2 (en) * 2004-07-09 2007-11-06 Hewlett-Packard Development Company, L.P. Laser enhanced plating for forming wiring patterns
JP4850487B2 (ja) * 2005-11-07 2012-01-11 富士フイルム株式会社 プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
US7972655B2 (en) 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
CA2709134C (en) 2007-12-18 2014-08-12 Colgate-Palmolive Company Alkaline cleaning compositions
US8974869B2 (en) 2010-01-26 2015-03-10 Robert Hamilton Method for improving plating on non-conductive substrates
JP5022501B2 (ja) 2010-11-04 2012-09-12 株式会社日本表面処理研究所 成形回路部品の製造方法
CN104039752B (zh) 2012-01-11 2017-03-08 巴斯夫欧洲公司 在液相中制备仲胺的方法
JP5902853B2 (ja) 2014-07-24 2016-04-13 日立マクセル株式会社 メッキ部品の製造方法
US9797043B1 (en) * 2016-09-13 2017-10-24 Rohm And Haas Electronic Materials Llc Shielding coating for selective metallization
US9850578B1 (en) * 2016-09-13 2017-12-26 Rohm And Haas Electronic Materials Llc Shielding coating for selective metallization

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