JP2018053360A5 - - Google Patents

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Publication number
JP2018053360A5
JP2018053360A5 JP2017174450A JP2017174450A JP2018053360A5 JP 2018053360 A5 JP2018053360 A5 JP 2018053360A5 JP 2017174450 A JP2017174450 A JP 2017174450A JP 2017174450 A JP2017174450 A JP 2017174450A JP 2018053360 A5 JP2018053360 A5 JP 2018053360A5
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JP
Japan
Prior art keywords
unsubstituted
alkyl
substituted
polymer
linear
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Application number
JP2017174450A
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English (en)
Japanese (ja)
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JP6525387B2 (ja
JP2018053360A (ja
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Priority claimed from US15/263,645 external-priority patent/US9850578B1/en
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Publication of JP2018053360A publication Critical patent/JP2018053360A/ja
Publication of JP2018053360A5 publication Critical patent/JP2018053360A5/ja
Application granted granted Critical
Publication of JP6525387B2 publication Critical patent/JP6525387B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017174450A 2016-09-13 2017-09-12 選択的な金属被覆のための遮断コーティング Expired - Fee Related JP6525387B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/263,645 US9850578B1 (en) 2016-09-13 2016-09-13 Shielding coating for selective metallization
US15/263,645 2016-09-13

Publications (3)

Publication Number Publication Date
JP2018053360A JP2018053360A (ja) 2018-04-05
JP2018053360A5 true JP2018053360A5 (https=) 2018-12-20
JP6525387B2 JP6525387B2 (ja) 2019-06-05

Family

ID=59982239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017174450A Expired - Fee Related JP6525387B2 (ja) 2016-09-13 2017-09-12 選択的な金属被覆のための遮断コーティング

Country Status (6)

Country Link
US (1) US9850578B1 (https=)
EP (1) EP3293286A1 (https=)
JP (1) JP6525387B2 (https=)
KR (1) KR102025107B1 (https=)
CN (1) CN107815670B (https=)
TW (1) TWI632252B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9970114B2 (en) * 2016-09-13 2018-05-15 Rohm And Haas Electronic Materials Llc Shielding coating for selective metallization
EP3892469B1 (en) * 2020-04-10 2023-11-08 Eco3 Bv Lithographic printing plate precursor

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3770896D1 (de) * 1986-09-15 1991-07-25 Gen Electric Verfahren zur photoselektiven metallisierung.
DE69430318T2 (de) * 1994-12-19 2002-11-14 John F. Bohland Jun. Verfahren zur selektiven Metallisierung
US6909018B1 (en) 1996-05-20 2005-06-21 Basf Aktiengesellschaft Preparation of polyalkeneamines
JP4463345B2 (ja) 1999-06-18 2010-05-19 関西ペイント株式会社 塗料組成物
US6899829B2 (en) * 2000-11-30 2005-05-31 Shipley Company, L.L.C. Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
JP3541360B2 (ja) * 2002-05-17 2004-07-07 独立行政法人 科学技術振興機構 多層回路構造の形成方法及び多層回路構造を有する基体
US6911400B2 (en) * 2002-11-05 2005-06-28 International Business Machines Corporation Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same
CN100590149C (zh) * 2003-07-18 2010-02-17 小西株式会社 固化性树脂组合物及常温固化性粘结剂
US6946232B2 (en) * 2003-11-17 2005-09-20 Polaroid Corporation Image-receiving element
DE102004017440A1 (de) 2004-04-08 2005-11-03 Enthone Inc., West Haven Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen
US7291380B2 (en) * 2004-07-09 2007-11-06 Hewlett-Packard Development Company, L.P. Laser enhanced plating for forming wiring patterns
JP4850487B2 (ja) * 2005-11-07 2012-01-11 富士フイルム株式会社 プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
DE102007011553A1 (de) * 2007-03-09 2008-09-11 Chemetall Gmbh Verfahren zur Beschichtung von metallischen Oberflächen mit einer wässerigen, Polymere enthaltenden Zusammensetzung, die wässerige Zusammensetzung und Verwendung der beschichteten Substrate
US7972655B2 (en) 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
CA2709134C (en) 2007-12-18 2014-08-12 Colgate-Palmolive Company Alkaline cleaning compositions
CN101654564B (zh) * 2008-08-23 2012-05-30 比亚迪股份有限公司 一种塑料组合物及其表面选择性金属化工艺
US8506751B2 (en) * 2009-04-21 2013-08-13 The Hong Kong University Of Science And Technology Implementing self-assembly nanometer-sized structures within metal—polymer interface
US8974869B2 (en) 2010-01-26 2015-03-10 Robert Hamilton Method for improving plating on non-conductive substrates
JP5022501B2 (ja) 2010-11-04 2012-09-12 株式会社日本表面処理研究所 成形回路部品の製造方法
CN104039752B (zh) 2012-01-11 2017-03-08 巴斯夫欧洲公司 在液相中制备仲胺的方法
US9405198B2 (en) * 2014-05-20 2016-08-02 Eastman Kodak Company Method for providing conductive silver film elements
JP5902853B2 (ja) 2014-07-24 2016-04-13 日立マクセル株式会社 メッキ部品の製造方法
JP2016079439A (ja) * 2014-10-14 2016-05-16 四国化成工業株式会社 銅被膜形成剤およびその利用
CN105848422B (zh) * 2016-06-08 2017-03-22 上海安费诺永亿通讯电子有限公司 一种电路制作方法

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