JP2018041955A - 磁性粉末及びこれを含むインダクタ - Google Patents
磁性粉末及びこれを含むインダクタ Download PDFInfo
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- 239000006247 magnetic powder Substances 0.000 title claims abstract description 65
- 239000000843 powder Substances 0.000 claims abstract description 95
- 239000010410 layer Substances 0.000 claims abstract description 71
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000011159 matrix material Substances 0.000 claims abstract description 6
- 239000002356 single layer Substances 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims description 22
- 239000000956 alloy Substances 0.000 claims description 22
- 239000002861 polymer material Substances 0.000 claims description 19
- 239000011230 binding agent Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims description 3
- 229910019819 Cr—Si Inorganic materials 0.000 claims description 2
- 229910017082 Fe-Si Inorganic materials 0.000 claims description 2
- 229910017133 Fe—Si Inorganic materials 0.000 claims description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 2
- 229910001199 N alloy Inorganic materials 0.000 claims description 2
- 229910003962 NiZn Inorganic materials 0.000 claims description 2
- 229910002796 Si–Al Inorganic materials 0.000 claims description 2
- 230000005484 gravity Effects 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000002159 nanocrystal Substances 0.000 claims description 2
- 229910017061 Fe Co Inorganic materials 0.000 claims 1
- 230000035699 permeability Effects 0.000 abstract description 14
- 230000001747 exhibiting effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 235000012245 magnesium oxide Nutrition 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
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Abstract
Description
図2は本発明の一例による磁性粉末の概略的な断面図である。図2を参照すると、磁性粉末1は、磁性特性を有するコア粉末1aと、そのコア粉末1aの表面上に直接配置される絶縁層1bと、を含む。上記絶縁層1bがコア粉末1aの表面上に直接配置されるとは、コア粉末の表面に追加のコーティング層を介せずに直ちに高分子材料の絶縁層1bが被覆されることを意味する。
次に、本発明の他の一例として、上記磁性粉末を含むインダクタについて説明する。
1a コア粉末
1b 絶縁層
10 本体
21、22 第1及び第2外部電極
100 インダクタ
Claims (20)
- 磁性特性を有するコア粉末と、前記コア粉末の表面上に配置される絶縁層と、を含み、
前記絶縁層は高分子材料を含み、
前記絶縁層の内面は前記コア粉末の表面と接するように配置される、磁性粉末。 - 前記コア粉末の全表面は前記絶縁層によって被覆され、前記絶縁層は単一層である、請求項1に記載の磁性粉末。
- 前記絶縁層は熱硬化性エポキシ樹脂を含む、請求項1または2に記載の磁性粉末。
- 前記コア粉末は、Fe、Fe−Ni系合金、Fe−Si系合金、Fe−Si−Al系合金、Fe−Cr−Si系合金、Fe系アモルファス合金、Fe系ナノ結晶形成合金、Co系アモルファス合金、Fe−Co系合金、Fe−N系合金、MnZn系フェライト、NiZn系フェライトなどから選択された1種以上を含む、請求項1から3のいずれか一項に記載の磁性粉末。
- 前記絶縁層は、前記コア粉末100wt%を基準に、1wt%以上5.0wt%以下の高分子材料を含む、請求項1から4のいずれか一項に記載の磁性粉末。
- 前記コア粉末の重心から表面まで延長する直線上において、前記コア粉末の前記表面から前記絶縁層の表面に至るまでの距離は1.0nm以上5.0μm以下である、請求項1から5のいずれか一項に記載の磁性粉末。
- 前記コア粉末は中心部及び表面部において同一の組成物を含み、前記絶縁層は前記コア粉末の表面部上に直接配置される、請求項1から6のいずれか一項に記載の磁性粉末。
- コイルを含む本体と、前記本体の外部面に配置される外部電極と、を含み、
前記本体は高分子材料のマトリックス(matrix)内に磁性特性を有するコア粉末を含み、
前記コア粉末は前記高分子材料によってそれに隣接するコア粉末と絶縁される、インダクタ。 - 前記マトリックス内の前記高分子材料は、前記コア粉末の表面と直接接触する、請求項8に記載のインダクタ。
- 前記高分子材料は熱硬化性エポキシを含む、請求項8または9に記載のインダクタ。
- 前記本体内の前記コア粉末の体積を100vol%としたとき、前記高分子材料のマトリックスの体積比は3vol%以上15vol%以下である、請求項8から10のいずれか一項に記載のインダクタ。
- 前記コア粉末の中央部及び表面部は同一の組成を有し、前記コア粉末の境界である前記表面部は、前記コア粉末の組成と異なる組成を有する追加の無機物層を含まない、請求項8から11のいずれか一項に記載のインダクタ。
- それぞれの前記コア粉末の全表面は高分子材料の絶縁層でコーティングされる、請求項8から12のいずれか一項に記載のインダクタ。
- それぞれの前記コア粉末は前記コア粉末上にコーティングされた単一の絶縁層のみを含む、請求項13に記載のインダクタ。
- 前記マトリックス内に含まれる高分子材料以外の残留硬化剤または残留バインダの含有量は0wt%である、請求項8から14のいずれか一項に記載のインダクタ。
- 磁性特性を有し、中心部及び表面部において同一の組成物を含むコア粉末と、
高分子材料を含み、前記コア粉末の表面上に直接配置されて前記コア粉末の表面部と接触する絶縁層と、を含む、磁性粉末。 - 前記コア粉末の全表面は前記絶縁層でコーティングされる、請求項16に記載の磁性粉末。
- 単一の絶縁層のみが前記コア粉末上に配置される、請求項16または17に記載の磁性粉末。
- 前記コア粉末はいかなる酸化層も含まない、請求項16から18のいずれか一項に記載の磁性粉末。
- 前記絶縁層は前記コア粉末上において均一な厚さを有する、請求項16から19のいずれか一項に記載の磁性粉末。
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US11551853B2 (en) | 2019-12-27 | 2023-01-10 | Taiyo Yuden Co., Ltd. | Coil component, circuit board, and electronic device |
US11823834B2 (en) | 2019-09-27 | 2023-11-21 | Taiyo Yuden Co., Ltd. | Coil component, circuit board, and electronic device |
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