JP2018027604A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2018027604A JP2018027604A JP2016161126A JP2016161126A JP2018027604A JP 2018027604 A JP2018027604 A JP 2018027604A JP 2016161126 A JP2016161126 A JP 2016161126A JP 2016161126 A JP2016161126 A JP 2016161126A JP 2018027604 A JP2018027604 A JP 2018027604A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- plate
- width
- depth
- measuring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 62
- 238000005259 measurement Methods 0.000 claims abstract description 37
- 238000004140 cleaning Methods 0.000 claims description 58
- 238000005406 washing Methods 0.000 abstract description 8
- 238000003754 machining Methods 0.000 abstract description 2
- 238000009966 trimming Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
30 保持テーブル
35 ドレッシング手段
50 切削手段
60 洗浄手段
62 スピンナテーブル
65 回転手段
66 エンコーダ
71 移動手段
72 深さ測定器
73 幅測定器
91 判断手段
P1 待機位置
P2 測定位置
W 板状ワーク
Claims (1)
- 外周に面取り部を形成する板状ワークを保持する保持テーブルと、該保持テーブルが保持した板状ワークの該面取り部を所定の除去領域で除去する切削手段と、回転手段でスピン回転可能なスピンナテーブルで板状ワークを保持し該スピンナテーブルをスピン回転させ該除去領域を洗浄する洗浄手段と、を有する切削装置であって、
該洗浄手段には、該除去領域の深さを測定する深さ測定器と、板状ワークの径方向における該除去領域の幅を測定する幅測定器と、該深さ測定器と該幅測定器とを待機位置と測定位置とに移動させる移動手段とを備え、
該スピンナテーブルを該深さ測定器と該幅測定器とが測定可能な回転速度で回転させる切削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016161126A JP6774263B2 (ja) | 2016-08-19 | 2016-08-19 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016161126A JP6774263B2 (ja) | 2016-08-19 | 2016-08-19 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018027604A true JP2018027604A (ja) | 2018-02-22 |
JP6774263B2 JP6774263B2 (ja) | 2020-10-21 |
Family
ID=61248212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016161126A Active JP6774263B2 (ja) | 2016-08-19 | 2016-08-19 | 切削装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6774263B2 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011235406A (ja) * | 2010-05-11 | 2011-11-24 | Daito Electron Co Ltd | ウェーハの面取り装置 |
JP2014022624A (ja) * | 2012-07-20 | 2014-02-03 | Disco Abrasive Syst Ltd | 切削装置 |
JP2014117782A (ja) * | 2012-12-18 | 2014-06-30 | Daito Electron Co Ltd | ウェーハの面取り加工方法およびウェーハの面取り装置 |
JP2015023239A (ja) * | 2013-07-23 | 2015-02-02 | 株式会社ディスコ | 加工装置 |
-
2016
- 2016-08-19 JP JP2016161126A patent/JP6774263B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011235406A (ja) * | 2010-05-11 | 2011-11-24 | Daito Electron Co Ltd | ウェーハの面取り装置 |
JP2014022624A (ja) * | 2012-07-20 | 2014-02-03 | Disco Abrasive Syst Ltd | 切削装置 |
JP2014117782A (ja) * | 2012-12-18 | 2014-06-30 | Daito Electron Co Ltd | ウェーハの面取り加工方法およびウェーハの面取り装置 |
JP2015023239A (ja) * | 2013-07-23 | 2015-02-02 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6774263B2 (ja) | 2020-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10022838B2 (en) | Cutting apparatus | |
TWI602229B (zh) | Wafer processing methods | |
KR101598657B1 (ko) | 웨이퍼의 모따기 장치 | |
KR102251723B1 (ko) | 절삭 장치 | |
JP6242619B2 (ja) | 加工装置 | |
JP6159549B2 (ja) | ワークの外周加工装置 | |
TWI748082B (zh) | 雷射加工方法 | |
JP2008155292A (ja) | 基板の加工方法および加工装置 | |
JP2008087104A (ja) | 研削加工方法 | |
JP2016187856A (ja) | ワーク加工装置 | |
CN110034020B (zh) | 被加工物的加工方法和加工装置 | |
JP2009160705A (ja) | ウェーハの研削方法および研削加工装置 | |
JP2021121031A (ja) | ウェーハの位置決め装置及びそれを用いた面取り装置 | |
JP2018192603A (ja) | 切削装置の切削ブレード検出機構 | |
KR20210096555A (ko) | 절삭 장치 및 절삭 방법 | |
TWI651163B (zh) | 磨削方法 | |
JP2011235388A (ja) | 研削された被加工物の厚み計測方法および研削装置 | |
JP6205231B2 (ja) | 切削装置 | |
JP6457327B2 (ja) | セットアップ方法 | |
JP2009302369A (ja) | 板状物の加工方法及び加工装置 | |
JP2015093341A (ja) | ドレッサーボード及びドレス方法 | |
JP6774263B2 (ja) | 切削装置 | |
JP2013118325A (ja) | ウエーハの洗浄方法 | |
JP5654365B2 (ja) | 研削装置 | |
JP2011224697A (ja) | 研磨パッドの修正方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190619 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200414 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200512 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200709 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200908 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201002 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6774263 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |