JP2018026580A - 光起電デバイス - Google Patents
光起電デバイス Download PDFInfo
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- JP2018026580A JP2018026580A JP2017198245A JP2017198245A JP2018026580A JP 2018026580 A JP2018026580 A JP 2018026580A JP 2017198245 A JP2017198245 A JP 2017198245A JP 2017198245 A JP2017198245 A JP 2017198245A JP 2018026580 A JP2018026580 A JP 2018026580A
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- 239000000463 material Substances 0.000 claims abstract description 97
- 239000004065 semiconductor Substances 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 79
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 74
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 49
- KAJBHOLJPAFYGK-UHFFFAOYSA-N [Sn].[Ge].[Si] Chemical compound [Sn].[Ge].[Si] KAJBHOLJPAFYGK-UHFFFAOYSA-N 0.000 claims description 16
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 13
- 229910005540 GaP Inorganic materials 0.000 claims description 7
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 7
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 claims description 7
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 55
- 239000010703 silicon Substances 0.000 abstract description 54
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 48
- 230000004888 barrier function Effects 0.000 abstract description 36
- 238000009792 diffusion process Methods 0.000 abstract description 29
- 239000010410 layer Substances 0.000 description 249
- 229910052732 germanium Inorganic materials 0.000 description 20
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 20
- 238000000151 deposition Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 230000006911 nucleation Effects 0.000 description 8
- 238000010899 nucleation Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 150000003376 silicon Chemical class 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 5
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 4
- 238000003776 cleavage reaction Methods 0.000 description 4
- 238000000407 epitaxy Methods 0.000 description 4
- 230000007017 scission Effects 0.000 description 4
- 229910052720 vanadium Inorganic materials 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- -1 AlGaAsP Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000002500 ions Chemical group 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011066 ex-situ storage Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical group [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
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- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03044—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds comprising a nitride compounds, e.g. GaN
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- H01L29/267—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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Abstract
【解決手段】III−V族半導体材料層3とIV族半導体材料基板1との間に界面8を備え、IV族半導体材料の層には界面近傍に薄いシリコン拡散バリヤ6が設けられている。このシリコン拡散バリヤは、V族原子のIV族半導体材料層への拡散を制御し、IV族半導体材料層はn型にドープされる。n型ドープ領域4は、上記のIV族半導体材料層において、優れた太陽電池特性を有するp−n接合部となる。
【選択図】図2
Description
−シリコン以外のIV族半導体材料層を準備するステップ。
−少なくとも1種類のIII族の原子と少なくとも1種類のV族の原子とから生成され、IV族半導体層との界面を有するIII−V族半導体材料層を設けるステップ。
−III−V族半導体層とIV族半導体層との間の界面か、または、この界面から離間した、IV族半導体層か、またはIII−V族半導体層においてシリコン層を設けるステップ。
−III−V材料層からのV族原子をシリコン層を通ってIV族材料にドープし、界面と接するIV族半導体層において、V族でドープされたn型領域を形成するステップ。
−これらの材料で形成された太陽電池セルを準備するステップ。
−この太陽電池に太陽光を照射するステップ。この方法は太陽電電池に照射するための太陽光を集光するステップを備えてよい。
−シリコンゲルマニウムまたはシリコンゲルマニウム錫の材料からなる第1のセル。
−シリコンゲルマニウム錫からなる第2のセル。
ここで第1のセルのシリコンゲルマニウムまたはシリコン−ゲルマニウム錫、および第2のセルのシリコンゲルマニウム錫は、ガリウム砒素に格子整合されている。
−ガリウム砒素の基板またはガリウム砒素に格子整合された他の材料を準備するステップ。
−シリコンゲルマニウムまたは上記基板に格子整合されたシリコンゲルマニウム錫からなる第1のセルを成長させるステップ。
−この第1の光吸収セルに格子整合されたシリコンゲルマニウム錫からなる第2のセルを成長させるステップ。
(なお、図3の実施例に関し、通常p−n接合部2は、シリコンバリヤ6のIII−V層側と反対の側にあり、本発明は通常バリヤ6がV族原子の拡散を制限するが、このバリヤを通過してIV族材料をn型に変換するには十分でない場合を含むものであり、このp−n接合部は、このバリヤかまたはこのバリヤの近傍*にある。(*p−n接合部はもちろん数単原子層のバリヤより大きい領域を有している。))
Claims (17)
- 半導体層(複数)から形成された光を吸収する2つ以上のセルを有する多接合光起電デバイスであって、
シリコンゲルマニウムまたはシリコンゲルマニウム錫の材料からなる第1のセルと、
シリコンゲルマニウム錫からなる第2のセルと、を備え、
前記第1のセルのシリコンゲルマニウムまたはシリコンゲルマニウム錫、および前記第2のセルのシリコンゲルマニウム錫は、ガリウム砒素に格子整合されていることを特徴とする多接合光起電デバイス。 - 請求項1に記載の多接合光起電デバイスにおいて、
ガリウム砒素からなるセルをさらに備えることを特徴とする多接合光起電デバイス。 - 請求項1または2に記載の多接合光起電デバイスにおいて、
ガリウム砒素に格子整合されたインジウムガリウム燐からなるセルをさらに備えることを特徴とする、多接合光起電デバイス。 - 請求項1乃至3のいずれか1項に記載の多接合光起電デバイスにおいて、
ガリウム砒素に格子整合されたアルミニウムガリウム砒素からなるセルをさらに備えることを特徴とする多接合光起電デバイス。 - 請求項1乃至4のいずれか1項に記載の多接合光起電デバイスにおいて、
ガリウム砒素に格子整合されたアルミニウムインジウムガリウム砒素からなるセルをさらに備えることを特徴とする多接合光起電デバイス。 - 請求項1乃至5のいずれか1項に記載の多接合光起電デバイスにおいて、
ガリウム砒素の基板を備え、前記セルの前記半導体層(複数)は、前記基板の上に格子整合されていることを特徴とする多接合光起電デバイス。 - 請求項1乃至6のいずれか1項に記載の多接合光起電デバイスにおいて、
ガリウム砒素に格子整合された基板を備え、前記半導体層(複数)は、前記基板の上にあって前記基板に格子整合されていることを特徴とする多接合光起電デバイス。 - 請求項1乃至7のいずれか1項に記載の多接合光起電デバイスにおいて、
前記第1のセルはシリコンゲルマニウムからなることを特徴とする多接合光起電デバイス。 - 請求項1乃至8のいずれか1項に記載の多接合光起電デバイスにおいて、
前記光起電デバイスは、太陽電池セルであることを特徴とする多接合光起電デバイス - 多接合光起電デバイスを製造する方法であって、
ガリウム砒素の基板またはガリウム砒素に格子整合された他の材料を準備するステップと、
シリコンゲルマニウムまたは前記基板に格子整合されたシリコンゲルマニウム錫からなる第1のセルを成長させるステップと、
前記第1の光吸収セルに格子整合されたシリコンゲルマニウム錫からなる第2のセルを成長させるステップと、
を備えることを特徴とする方法。 - 請求項10に記載の方法において、
ガリウム砒素からなるセルを成長させるステップを備えることを特徴とする方法。 - 請求項10または11に記載の方法において、
ガリウム砒素に格子整合されたインジウムガリウム燐からなるセルを成長させるステップを備えることを特徴とする方法。 - 請求項10乃至12のいずれか1項に記載の方法において、
ガリウム砒素に格子整合されたアルミニウムガリウム砒素からなるセルを成長させるステップを備えることを特徴とする方法。 - 請求項10乃至12のいずれか1項に記載の方法において、
ガリウム砒素に格子整合されたアルミニウムインジウムガリウム燐からなるセルを成長させるステップを備えることを特徴とする方法。 - 請求項10乃至14のいずれか1項に記載の方法において、
2つの隣接する前記セルの間に少なくともさらにもう1つの層を設けるステップを備え、当該少なくともさらにもう1つの層は、ガリウム砒素に格子整合されていることを特徴とする方法。 - 請求項10乃至15のいずれか1項に記載の方法において、
前記基板を除去するステップを備えることを特徴とする方法。 - 請求項10乃至16のいずれか1項に記載の方法において、
前記第1のセルはシリコンゲルマニウム材料からなることを特徴とする方法。
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US20140326301A1 (en) | 2014-11-06 |
EP2745330A1 (en) | 2014-06-25 |
CN103875079A (zh) | 2014-06-18 |
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EP2745328A1 (en) | 2014-06-25 |
AU2012300694C1 (en) | 2016-04-21 |
WO2013030529A1 (en) | 2013-03-07 |
EP2745329A1 (en) | 2014-06-25 |
EP2745329B1 (en) | 2018-09-19 |
ES2813938T3 (es) | 2021-03-25 |
AU2016200282B2 (en) | 2017-08-31 |
JP2014527725A (ja) | 2014-10-16 |
AU2012300694A8 (en) | 2014-04-03 |
US20150041863A1 (en) | 2015-02-12 |
CN107845690B (zh) | 2020-09-08 |
CN107845690A (zh) | 2018-03-27 |
WO2013030530A1 (en) | 2013-03-07 |
US10263129B2 (en) | 2019-04-16 |
JP6228119B2 (ja) | 2017-11-08 |
JP2019216249A (ja) | 2019-12-19 |
US20140345679A1 (en) | 2014-11-27 |
AU2012300694B2 (en) | 2015-10-22 |
US10367107B2 (en) | 2019-07-30 |
CN103875079B (zh) | 2017-12-12 |
WO2013030531A1 (en) | 2013-03-07 |
US20170117429A1 (en) | 2017-04-27 |
AU2016200282A1 (en) | 2016-02-11 |
AU2012300694A1 (en) | 2014-03-20 |
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