JP2018006620A - コンデンサの製造方法 - Google Patents
コンデンサの製造方法 Download PDFInfo
- Publication number
- JP2018006620A JP2018006620A JP2016133404A JP2016133404A JP2018006620A JP 2018006620 A JP2018006620 A JP 2018006620A JP 2016133404 A JP2016133404 A JP 2016133404A JP 2016133404 A JP2016133404 A JP 2016133404A JP 2018006620 A JP2018006620 A JP 2018006620A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- insulating film
- conductive layer
- capacitor
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 182
- 239000002184 metal Substances 0.000 claims description 182
- 230000008018 melting Effects 0.000 claims description 29
- 238000002844 melting Methods 0.000 claims description 29
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 237
- 239000004065 semiconductor Substances 0.000 description 26
- 239000000758 substrate Substances 0.000 description 21
- 239000010931 gold Substances 0.000 description 14
- 230000005012 migration Effects 0.000 description 10
- 238000013508 migration Methods 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
- H01L21/76834—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers formation of thin insulating films on the sidewalls or on top of conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/7687—Thin films associated with contacts of capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
【解決手段】コンデンサの製造方法は、第1の導電層上にコンデンサの誘電体を構成する第1の絶縁膜を形成する第1工程と、真空蒸着法により、第1の絶縁膜上に選択的に第2の導電層を形成する第2工程と、第2の導電層の表面に液体あるいは気流による圧力を付与する処理をなす第3工程と、第3工程の後、真空蒸着法により、第2の導電層に接する第3の導電層を形成する第4工程と、を含む。
【選択図】図1
Description
最初に本願発明の実施形態の内容を列記して説明する。本願発明の一実施形態は、第1の導電層上にコンデンサの誘電体を構成する第1の絶縁膜を形成する第1工程と、真空蒸着法により、第1の絶縁膜上に選択的に第2の導電層を形成する第2工程と、第2の導電層の表面に液体あるいは気流による圧力を付与する処理をなす第3工程と、第3工程の後、真空蒸着法により、第2の導電層に接する第3の導電層を形成する第4工程と、を含むコンデンサの製造方法である。
以下、添付図面を参照して、本発明の好適な実施形態について詳細に説明する。なお、以下の説明において、同一要素又は同一機能を有する要素には、同一符号を用いることとし、重複する説明は省略する。なお、以下にて説明する本実施形態の半導体装置は、必ずしも半導体を含まなくてもよく、例えば半導体基板上に設けられるキャパシタ等でもよい。
Claims (6)
- 第1の導電層上にコンデンサの誘電体を構成する第1の絶縁膜を形成する第1工程と、
真空蒸着法により、前記第1の絶縁膜上に選択的に第2の導電層を形成する第2工程と、
前記第2の導電層の表面に液体あるいは気流による圧力を付与する処理をなす第3工程と、
前記第3工程の後、真空蒸着法により、前記第2の導電層に接する第3の導電層を形成する第4工程と、
を含むコンデンサの製造方法。 - 前記第2工程は、第1の開口部を有する第1のマスクを形成した後に、真空蒸着法により第2の導電層を形成する工程を含み、
前記第3工程は、前記第1のマスクを除去する工程である、請求項1に記載のコンデンサの製造方法。 - 前記第4工程の後、前記第3の導電層上に第2の絶縁膜を形成する工程と、
前記第2の絶縁膜上に第2の開口部が設けられる第2のマスクを形成する工程と、
前記第2のマスクを用い、前記第2の開口部によって露出する前記第2の絶縁膜を除去する工程と、
前記第2の絶縁膜が除去されることによって露出した前記第3の導電層上に配線を形成する工程と、をさらに備える請求項1又は2に記載のコンデンサの製造方法。 - 前記第2の導電層の厚さは、200nm〜400nmである、請求項1〜3のいずれか一項に記載のコンデンサの製造方法。
- 前記第2工程では、前記第1の絶縁膜上に設けられる第1の金属層と、前記第1の金属層上に設けられる第2の金属層とを順に形成し、
前記第4工程では、前記第2の金属層上に第3の金属層を形成し、
前記第2の金属層の融点は、前記第1の金属層の融点及び前記第3の金属層の融点よりも高い、請求項1〜4のいずれか一項に記載のコンデンサの製造方法。 - 前記第2の金属層は、チタン、白金、タンタル、モリブデン、及びタングステンの少なくとも何れかを含む、請求項5に記載のコンデンサの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016133404A JP6717520B2 (ja) | 2016-07-05 | 2016-07-05 | コンデンサの製造方法 |
US15/641,681 US10283585B2 (en) | 2016-07-05 | 2017-07-05 | Process of forming capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016133404A JP6717520B2 (ja) | 2016-07-05 | 2016-07-05 | コンデンサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018006620A true JP2018006620A (ja) | 2018-01-11 |
JP6717520B2 JP6717520B2 (ja) | 2020-07-01 |
Family
ID=60911097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016133404A Active JP6717520B2 (ja) | 2016-07-05 | 2016-07-05 | コンデンサの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10283585B2 (ja) |
JP (1) | JP6717520B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI685980B (zh) * | 2017-04-25 | 2020-02-21 | 聯華電子股份有限公司 | 導體-絕緣體-導體電容器及其製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07335840A (ja) * | 1994-06-09 | 1995-12-22 | Internatl Business Mach Corp <Ibm> | 高誘電率材料を使用する記憶キャパシタの製造方法 |
JP2005333104A (ja) * | 2004-05-19 | 2005-12-02 | Samsung Electronics Co Ltd | 半導体基板用洗浄液組成物、半導体基板の洗浄方法、及び半導体装置の製造方法 |
JP2009509355A (ja) * | 2005-09-22 | 2009-03-05 | アジャイル アールエフ,インク. | 強誘電性薄膜素子用の不動態化構造 |
JP2011199062A (ja) * | 2010-03-19 | 2011-10-06 | Fujitsu Ltd | キャパシタ及び半導体装置 |
JP2014056887A (ja) * | 2012-09-11 | 2014-03-27 | Sumitomo Electric Device Innovations Inc | キャパシタの製造方法 |
JP2015133424A (ja) * | 2014-01-14 | 2015-07-23 | 住友電工デバイス・イノベーション株式会社 | 電子部品の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022457A (ja) * | 1996-07-03 | 1998-01-23 | Mitsubishi Electric Corp | 容量装置及び半導体装置並びにそれらの製造方法 |
US6297527B1 (en) * | 1999-05-12 | 2001-10-02 | Micron Technology, Inc. | Multilayer electrode for ferroelectric and high dielectric constant capacitors |
JP2010080780A (ja) | 2008-09-26 | 2010-04-08 | Fujitsu Microelectronics Ltd | 半導体装置の製造方法及び容量素子の製造方法 |
JP2013115371A (ja) | 2011-11-30 | 2013-06-10 | Sumitomo Electric Device Innovations Inc | 容量素子 |
WO2015009768A1 (en) * | 2013-07-15 | 2015-01-22 | Polyera Corporation | Photopatternable materials and related electronic devices and methods |
JP6400970B2 (ja) * | 2014-07-25 | 2018-10-03 | 太陽誘電株式会社 | フィルタおよびデュプレクサ |
-
2016
- 2016-07-05 JP JP2016133404A patent/JP6717520B2/ja active Active
-
2017
- 2017-07-05 US US15/641,681 patent/US10283585B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07335840A (ja) * | 1994-06-09 | 1995-12-22 | Internatl Business Mach Corp <Ibm> | 高誘電率材料を使用する記憶キャパシタの製造方法 |
JP2005333104A (ja) * | 2004-05-19 | 2005-12-02 | Samsung Electronics Co Ltd | 半導体基板用洗浄液組成物、半導体基板の洗浄方法、及び半導体装置の製造方法 |
JP2009509355A (ja) * | 2005-09-22 | 2009-03-05 | アジャイル アールエフ,インク. | 強誘電性薄膜素子用の不動態化構造 |
JP2011199062A (ja) * | 2010-03-19 | 2011-10-06 | Fujitsu Ltd | キャパシタ及び半導体装置 |
JP2014056887A (ja) * | 2012-09-11 | 2014-03-27 | Sumitomo Electric Device Innovations Inc | キャパシタの製造方法 |
JP2015133424A (ja) * | 2014-01-14 | 2015-07-23 | 住友電工デバイス・イノベーション株式会社 | 電子部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6717520B2 (ja) | 2020-07-01 |
US10283585B2 (en) | 2019-05-07 |
US20180012954A1 (en) | 2018-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6518092B2 (en) | Semiconductor device and method for manufacturing | |
WO2011151970A1 (ja) | 薄膜トランジスタ、コンタクト構造、基板、表示装置及びこれらの製造方法 | |
JP6665776B2 (ja) | スイッチング素子及びスイッチング素子の製造方法 | |
US11476055B2 (en) | Thin film capacitor and method of manufacturing the same | |
CN109727942B (zh) | 半导体装置以及半导体装置的制造方法 | |
CN108336052B (zh) | 金属再布线结构、芯片封装器件及芯片封装器件制作工艺 | |
JP6717520B2 (ja) | コンデンサの製造方法 | |
JP2013157540A (ja) | 半導体装置およびその製造方法 | |
JP6978151B2 (ja) | 半導体装置の製造方法および半導体装置 | |
US20220254871A1 (en) | Titanium layer as getter layer for hydrogen in a mim device | |
JP2019033154A (ja) | キャパシタ構造の作製方法 | |
US8551854B2 (en) | Method of manufacturing a semiconductor device | |
JP6451601B2 (ja) | 半導体装置 | |
JP2009070966A (ja) | 半導体装置とその製造方法 | |
US9786592B2 (en) | Integrated circuit structure and method of forming the same | |
JP2005191182A (ja) | 半導体装置及びその製造方法 | |
CN110223970B (zh) | 一种孔槽式的电容结构及制作方法 | |
US7105451B2 (en) | Method for manufacturing semiconductor device | |
US7960835B2 (en) | Fabrication of metal film stacks having improved bottom critical dimension | |
JP4741549B2 (ja) | 半導体装置の製造方法 | |
TWI392070B (zh) | 半導體元件暨嵌埋有半導體元件之封裝基板及其製法 | |
JP2023129809A (ja) | キャパシタおよびその製造方法 | |
JP2023129808A (ja) | キャパシタおよびその製造方法 | |
US20100230786A1 (en) | Production of integrated circuits comprising semiconductor incompatible materials | |
CN110676380A (zh) | 一种提高抗击穿能力的mim电容结构及制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A625 | Written request for application examination (by other person) |
Free format text: JAPANESE INTERMEDIATE CODE: A625 Effective date: 20190521 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200217 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200225 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200331 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200512 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200605 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6717520 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |