JP2017538854A - 導電性組成物、プロセスおよび用途 - Google Patents
導電性組成物、プロセスおよび用途 Download PDFInfo
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- JP2017538854A JP2017538854A JP2017548515A JP2017548515A JP2017538854A JP 2017538854 A JP2017538854 A JP 2017538854A JP 2017548515 A JP2017548515 A JP 2017548515A JP 2017548515 A JP2017548515 A JP 2017548515A JP 2017538854 A JP2017538854 A JP 2017538854A
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- silver
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Classifications
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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Abstract
Description
本発明による導電性組成物は、1以上、かつ、2.0未満のアスペクト比を有する第1の粒子であって、球状粒子、ファセット粒子、角錐形粒子およびこれらの混合物から選択される第1の粒子;または前記第1の粒子と、第2の粒子であって、2.0より大きいアスペクト比を有する非球状粒子である第2の粒子との混合物から選択される導電性粒子を含む。
一実施形態では、本発明による導電性組成物は、1以上、かつ、2.0未満のアスペクト比を有する第1の導電性粒子を含み、アスペクト比は上述のようにして測定される。第1の粒子は、球状、ファセットまたは角錐形状を有する。第1の粒子は、球状、ファセットまたは角錐形状からただ1種の形状を含んでよい。あるいは、第1の粒子は、いずれか2種の形状の混合物または3種全ての形状の混合物とすることもできる。
一実施形態では、本発明による導電性組成物は、第1の導電性粒子と第2の導電性粒子との混合物を含み、前記第2の粒子は、2.0より大きいアスペクト比を有する非球状粒子である。
本発明による導電性組成物は、樹脂または樹脂の混合物を含む。本発明で使用される樹脂は、組成物に使用される溶媒に良好な溶解度を有する必要がある。さらに、樹脂は、高温での硬化または焼結中に良好な溶媒放出特性を有し、比較的低温で乾燥を確実に完結する必要がある。本発明で使用される樹脂は、選択された粒子と良好な適合性を有する必要がある。樹脂はまた、良好な機械的および流動学的特性を有し、溝充填プロセスを促進する必要がある。粒子間に介在する結合材料として、樹脂は良好な導電率を有する必要がある。最後に、樹脂は、ポリエチレンテレフタレート(PET)のように基材への良好な接着力を有する必要がある。
本発明による導電性組成物は、少なくとも1種の有機溶媒を含む。種々の既知の有機溶媒を本発明で使用できる。本発明で使用される溶媒は、本発明による樹脂および導電性粒子の両方と良好な適合性を有する限りにおいて、特に制限はない。好ましい溶媒は、十分な処理時間を確保するために、室温での比較的小さい蒸発速度および硬化および乾燥中の十分な結合剤収縮を確保するために、治癒温度での比較的大きい蒸発速度を有するべきである。
上記成分に加えて、本発明による導電性組成物は、組成物の総重量の、0.01重量%〜5重量%、好ましくは0.05重量%〜2重量%の添加剤をさらに含んでよい。
−0μmより大きく、かつ、5μmより小さい幅を有する溝からなるメッシュパターンを基材表面上に形成するステップと、
−溝に本発明による導電性組成物を充填するステップと、
−残余組成物を基材表面から洗浄するステップと、
−前記組成物を硬化または焼結するステップと、を含む。
本発明による組成物1〜6
本発明による組成物7〜9
比較例−組成物10
結合剤樹脂ポリ塩化ビニリデン(PVDC)Saran F-310(Dow Chemicals)を、30%の固形分重量パーセントで、DBE-9溶媒に溶解する(30重量%PVDCおよび70重量%DBE-9)。その後、この溶液をマスター樹脂溶液として使用する。使用した銀粒子は、アスペクト比が30より大きい(平均粒径は約0.3μm)非球状粒子(N300(Tokusen))である。銀分散液は、90重量%の銀粒子および10重量%のDBE-9を含む。追加の溶媒(DBE-9)を添加して、最終の固形分重量パーセントおよび粘度をしかるべく調節する。樹脂に対する銀の体積比は、2.43の一定に保持される。
比較例−組成物11〜15
Clariantにより製造されたSavinyl RLSN黒色染料を、組成物の総重量の0.1重量%、0.5重量%、1重量%および2重量%の量で、比較例の組成物7に加える。測定したL*および体積抵抗率を下表に示す。
Claims (15)
- 導電性組成物であって、
a)1以上、かつ、2.0未満のアスペクト比を有する第1の粒子であって、球状粒子、ファセット粒子、角錐形粒子およびこれらの混合物から選択される第1の粒子、または前記第1の粒子と、第2の粒子であって、2.0より大きいアスペクト比を有する非球状粒子である第2の粒子との混合物から選択される導電性粒子、
b)樹脂;および
c)少なくとも1種の有機溶媒
を含む導電性組成物。 - 前記導電性粒子は、金属、金属合金、金属含有複合材料、非金属粒子およびこれらの混合物からなる群から選択され、好ましくは銀、金、白金、銅、ニッケル、アルミニウム、亜鉛、鉄、銅−ニッケル、銀−銅、銀−ニッケル、銅−アルミニウム、銀メッキ銅、銀メッキガラス、銀メッキ黒鉛、銀メッキ繊維、黒鉛、カーボンブラック、カーボンナノチューブおよびこれらの混合物からなる群から選択され、より好ましくは、前記導電性粒子は銀である、請求項1に記載の組成物。
- 前記球状またはファセットまたは角錐形粒子は、5nm〜1μm、好ましくは5nm〜500nm、より好ましくは5nm〜200nmの平均粒径を有する、請求項1または2に記載の組成物。
- 前記非球状粒子は、好ましくは10.0より大きいアスペクト比を有する、請求項1〜3のいずれかに記載の組成物。
- 前記非球状粒子は、10nm〜2μm、好ましくは10nm〜1μmの平均粒径を有する、請求項1〜4のいずれかに記載の組成物。
- 前記組成物は、
−該組成物の総重量の5重量%〜85重量%、好ましくは60重量%〜75重量%の第1の粒子、または
−該組成物の総重量の10重量%〜85重量%、好ましくは30重量%〜70重量%の第2の粒子、および該組成物の総重量の5重量%〜40重量%の第2の粒子
を含む、請求項1〜5のいずれかに記載の組成物。 - 第2の粒子と第1の粒子との重量比は、6:1〜1:2、好ましくは3:1〜1:1である、請求項1〜6のいずれかに記載の組成物。
- 前記樹脂は、好ましくはハロゲン化熱可塑性樹脂、フェノキシ樹脂、ポリエステル樹脂、熱可塑性ポリウレタン、ポリアクリレート、シリコーンおよびこれらの混合物からなる群から選択され;より好ましくはPVDCポリマー、PVDCコポリマー、フェノキシ樹脂、ポリアクリレートおよびこれらの混合物からなる群から選択され;最も好ましくはPVDCポリマーおよびPVDCコポリマーおよびこれらの混合物からなる群から選択される、請求項1〜7のいずれかに記載の組成物。
- 前記組成物の総重量の、1重量%〜10重量%、好ましくは1重量%〜8重量%、より好ましくは2重量%〜6重量%の樹脂を含む、請求項1〜8のいずれかに記載の組成物。
- 粒子と樹脂の体積比は、1.5〜3.5、好ましくは2.0〜3.0である、請求項1〜9のいずれかに記載の組成物。
- 少なくとも1種の有機溶媒は、好ましくは、ジプロピレングリコールメチルエーテル(DPM)、3−メトキシ−3−メチル−1−ブタノール(MMB)、ブチルグリコールアセテート(BGA)、ジエチレングリコール、エチレングリコールモノブチルエーテル、DBE、DBE-9、DBE-3、DBE-4、DBE-5、DBE-6、プロピレングリコールメチルアセテート(PMA)、ブチルカルビトール(BC)、ブチルカルビトールアセテート(BCA)およびこれらの混合物からなる群から選択される、請求項1〜10のいずれかに記載の組成物。
- 導電性メッシュを調製する方法であって、
−0μmより大きく、かつ、5μmより小さい幅を有する溝からなるメッシュパターンを基材表面上に形成するステップと、
−該溝に請求項1〜11のいずれかに記載の組成物を充填するステップと、
−残余組成物を該基材表面から洗浄するステップと、
−該組成物を硬化または焼結するステップと
を含む、方法。 - 前記硬化または焼結は、150℃未満の温度で実施される、請求項12に記載の方法。
- 請求項12または13に記載の方法により調製された導電性メッシュ。
- 基材上の導電性メッシュを含み、前記メッシュは請求項1〜11のいずれかに記載の硬化または焼結組成物を含む、タッチパネルディスプレイ。
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