JP2017528922A - ファイバーレーザーによってアモルファスシリコン基板を均一に結晶化させるための方法及びシステム - Google Patents

ファイバーレーザーによってアモルファスシリコン基板を均一に結晶化させるための方法及びシステム Download PDF

Info

Publication number
JP2017528922A
JP2017528922A JP2017521034A JP2017521034A JP2017528922A JP 2017528922 A JP2017528922 A JP 2017528922A JP 2017521034 A JP2017521034 A JP 2017521034A JP 2017521034 A JP2017521034 A JP 2017521034A JP 2017528922 A JP2017528922 A JP 2017528922A
Authority
JP
Japan
Prior art keywords
packet
light
amorphous silicon
pulse
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017521034A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017528922A5 (https=
Inventor
ユーリ・エロキン
イゴール・サマルツェフ
Original Assignee
アイピージー フォトニクス コーポレーション
アイピージー フォトニクス コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アイピージー フォトニクス コーポレーション, アイピージー フォトニクス コーポレーション filed Critical アイピージー フォトニクス コーポレーション
Publication of JP2017528922A publication Critical patent/JP2017528922A/ja
Publication of JP2017528922A5 publication Critical patent/JP2017528922A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H10P14/3808Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H10P14/3816Pulsed laser beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/063Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067Fibre lasers
    • H01S3/06708Constructional details of the fibre, e.g. compositions, cross-section, shape or tapering
    • H01S3/06745Tapering of the fibre, core or active region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/063Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067Fibre lasers
    • H01S3/06754Fibre amplifiers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • H01S3/091Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/094003Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light the pumped medium being a fibre
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16Solid materials
    • H01S3/1601Solid materials characterised by an active (lasing) ion
    • H01S3/1603Solid materials characterised by an active (lasing) ion rare earth
    • H01S3/1618Solid materials characterised by an active (lasing) ion rare earth ytterbium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Recrystallisation Techniques (AREA)
  • Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Glass Compositions (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
JP2017521034A 2014-07-03 2015-07-01 ファイバーレーザーによってアモルファスシリコン基板を均一に結晶化させるための方法及びシステム Pending JP2017528922A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462020501P 2014-07-03 2014-07-03
US62/020,501 2014-07-03
PCT/US2015/038785 WO2016004175A1 (en) 2014-07-03 2015-07-01 Process and system for uniformly recrystallizing amorphous silicon substrate by fiber laser

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020148871A Division JP7111783B2 (ja) 2014-07-03 2020-09-04 ファイバーレーザーによってアモルファスシリコン基板を均一に結晶化させるための方法及びシステム

Publications (2)

Publication Number Publication Date
JP2017528922A true JP2017528922A (ja) 2017-09-28
JP2017528922A5 JP2017528922A5 (https=) 2019-12-05

Family

ID=55019961

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017521034A Pending JP2017528922A (ja) 2014-07-03 2015-07-01 ファイバーレーザーによってアモルファスシリコン基板を均一に結晶化させるための方法及びシステム
JP2020148871A Active JP7111783B2 (ja) 2014-07-03 2020-09-04 ファイバーレーザーによってアモルファスシリコン基板を均一に結晶化させるための方法及びシステム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020148871A Active JP7111783B2 (ja) 2014-07-03 2020-09-04 ファイバーレーザーによってアモルファスシリコン基板を均一に結晶化させるための方法及びシステム

Country Status (6)

Country Link
US (2) US9941120B2 (https=)
EP (1) EP3164885B1 (https=)
JP (2) JP2017528922A (https=)
KR (1) KR102439093B1 (https=)
CN (2) CN106663655B (https=)
WO (2) WO2016004174A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106663655B (zh) * 2014-07-03 2019-05-07 Ipg光子公司 通过光纤激光器使非晶硅衬底均匀再结晶的工艺和系统
JP2019521321A (ja) * 2016-05-11 2019-07-25 アイピージー フォトニクス コーポレーション フラットパネルディスプレイのための、ファイバーレーザーアニーリングされた多結晶シリコンフィルムの形態学的特徴を測定するためのプロセス及びシステム
US10234765B2 (en) * 2017-06-05 2019-03-19 Coherent Lasersystems Gmbh & Co. Kg Energy controller for excimer-laser silicon crystallization
US11673208B2 (en) 2017-07-31 2023-06-13 Ipg Photonics Corporation Fiber laser apparatus and method for processing workpiece
EP3646419A4 (en) * 2017-07-31 2021-06-02 IPG Photonics Corporation FIBER LASER DEVICE AND METHOD FOR MACHINING A WORKPIECE
US11600491B2 (en) * 2017-07-31 2023-03-07 Ipg Photonics Corporation Laser apparatus and method of processing thin films
JP7335236B2 (ja) * 2017-10-13 2023-08-29 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク スポットビーム及びラインビーム結晶化のためのシステムおよび方法
CN108550580B (zh) * 2018-04-27 2019-10-11 武汉华星光电技术有限公司 Tft阵列基板
CN108615680B (zh) * 2018-04-28 2020-03-10 京东方科技集团股份有限公司 多晶硅层及其制造方法、薄膜晶体管及阵列基板的制造方法
US10802120B1 (en) 2019-08-20 2020-10-13 Luminar Technologies, Inc. Coherent pulsed lidar system
US12228650B2 (en) 2020-08-10 2025-02-18 Luminar Technologies, Inc. Master-oscillator power-amplifier (MOPA) light source with optical isolator
US12481034B2 (en) 2020-08-10 2025-11-25 Luminar Technologies, Inc. Lidar system with input optical element

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645272A (ja) * 1992-07-21 1994-02-18 Hitachi Ltd レーザアニール装置
JP2002280324A (ja) * 2001-03-16 2002-09-27 Sony Corp レーザ装置
WO2003043070A1 (fr) * 2001-11-12 2003-05-22 Sony Corporation Dispositif de recuit laser et procede de fabrication d'un transistor a couches minces
JP2006086447A (ja) * 2004-09-17 2006-03-30 Sharp Corp 半導体薄膜の製造方法および半導体薄膜の製造装置
JP2007508694A (ja) * 2003-10-10 2007-04-05 ジーエスアイ ルモニクス コーポレイション ピコ秒レーザでのメモリリンク処理のためのレーザに基づくシステム
JP2008085316A (ja) * 2006-08-31 2008-04-10 Semiconductor Energy Lab Co Ltd 薄膜トランジスタ及びその作製方法、並びに半導体装置
JP2010532587A (ja) * 2007-07-05 2010-10-07 モビアス フォトニクス, インク. 誘導ビリルアン散乱を使用しないファイバmopaシステム
JP2011515588A (ja) * 2008-03-27 2011-05-19 イムラ アメリカ インコーポレイテッド 薄膜製作方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2395353B (en) * 2002-02-18 2004-10-13 Univ Southampton Pulsed light sources
JP2004063924A (ja) * 2002-07-31 2004-02-26 Mitsubishi Heavy Ind Ltd レーザアニール方法及び装置
US6925216B2 (en) * 2003-05-30 2005-08-02 The Regents Of The University Of California Direct-patterned optical waveguides on amorphous silicon films
JP5072197B2 (ja) * 2004-06-18 2012-11-14 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法
KR101354162B1 (ko) * 2004-10-20 2014-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 레이저 조사방법, 레이저 조사장치, 및 반도체장치 제조방법
US7508853B2 (en) * 2004-12-07 2009-03-24 Imra, America, Inc. Yb: and Nd: mode-locked oscillators and fiber systems incorporated in solid-state short pulse laser systems
US7700463B2 (en) * 2005-09-02 2010-04-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7715459B2 (en) * 2005-11-01 2010-05-11 Cymer, Inc. Laser system
EP1974422A4 (en) * 2005-12-15 2011-12-07 Laser Abrasive Technologies Llc METHOD AND DEVICE FOR TREATING SOLID MATERIALS USING HARD FIBER
KR100740124B1 (ko) * 2006-10-13 2007-07-16 삼성에스디아이 주식회사 다결정 실리콘 박막 트랜지스터 및 그 제조방법
US8630320B2 (en) * 2007-08-31 2014-01-14 Deep Photonics Corporation Method and apparatus for a hybrid mode-locked fiber laser
US20090246530A1 (en) * 2008-03-27 2009-10-01 Imra America, Inc. Method For Fabricating Thin Films
CN102057467B (zh) * 2008-06-12 2013-02-13 株式会社Ihi 激光退火方法以及激光退火装置
WO2010057290A1 (en) * 2008-11-21 2010-05-27 Institut National Optique Spectrally tailored pulsed fiber laser oscillator
US8372667B2 (en) * 2009-04-20 2013-02-12 Applied Materials, Inc. Fiber laser substrate processing
US8068705B2 (en) * 2009-09-14 2011-11-29 Gapontsev Valentin P Single-mode high-power fiber laser system
US20110133129A1 (en) * 2009-12-07 2011-06-09 Imra America, Inc. Method of tuning properties of thin films
JP5678333B2 (ja) * 2010-05-27 2015-03-04 株式会社ブイ・テクノロジー レーザアニール方法及び装置
US9316545B2 (en) 2011-07-11 2016-04-19 California Institute Of Technology Scanning measurement of Seebeck coefficient of a heated sample
US8774236B2 (en) * 2011-08-17 2014-07-08 Veralas, Inc. Ultraviolet fiber laser system
US8817827B2 (en) 2011-08-17 2014-08-26 Veralas, Inc. Ultraviolet fiber laser system
GB2505409B (en) * 2012-08-27 2016-08-03 V-Gen Ltd Generation of narrow line width high power optical pulses
US9413137B2 (en) * 2013-03-15 2016-08-09 Nlight, Inc. Pulsed line beam device processing systems using laser diodes
US10069271B2 (en) * 2014-06-02 2018-09-04 Nlight, Inc. Scalable high power fiber laser
CN106663655B (zh) * 2014-07-03 2019-05-07 Ipg光子公司 通过光纤激光器使非晶硅衬底均匀再结晶的工艺和系统
US9246303B1 (en) * 2014-10-31 2016-01-26 Raytheon Company Method and apparatus for temporally concentrating pump power to support generation of high peak-power pulse bursts or other time-varying laser output waveforms

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645272A (ja) * 1992-07-21 1994-02-18 Hitachi Ltd レーザアニール装置
JP2002280324A (ja) * 2001-03-16 2002-09-27 Sony Corp レーザ装置
WO2003043070A1 (fr) * 2001-11-12 2003-05-22 Sony Corporation Dispositif de recuit laser et procede de fabrication d'un transistor a couches minces
JP2007508694A (ja) * 2003-10-10 2007-04-05 ジーエスアイ ルモニクス コーポレイション ピコ秒レーザでのメモリリンク処理のためのレーザに基づくシステム
JP2006086447A (ja) * 2004-09-17 2006-03-30 Sharp Corp 半導体薄膜の製造方法および半導体薄膜の製造装置
JP2008085316A (ja) * 2006-08-31 2008-04-10 Semiconductor Energy Lab Co Ltd 薄膜トランジスタ及びその作製方法、並びに半導体装置
JP2010532587A (ja) * 2007-07-05 2010-10-07 モビアス フォトニクス, インク. 誘導ビリルアン散乱を使用しないファイバmopaシステム
JP2011515588A (ja) * 2008-03-27 2011-05-19 イムラ アメリカ インコーポレイテッド 薄膜製作方法

Also Published As

Publication number Publication date
EP3164885B1 (en) 2021-08-25
KR20170029537A (ko) 2017-03-15
US9941120B2 (en) 2018-04-10
WO2016004175A1 (en) 2016-01-07
CN106663655B (zh) 2019-05-07
USRE48398E1 (en) 2021-01-19
KR102439093B1 (ko) 2022-08-31
WO2016004174A1 (en) 2016-01-07
US20160013057A1 (en) 2016-01-14
CN109979805B (zh) 2023-02-21
JP2020205439A (ja) 2020-12-24
CN109979805A (zh) 2019-07-05
EP3164885A1 (en) 2017-05-10
CN106663655A (zh) 2017-05-10
JP7111783B2 (ja) 2022-08-02
EP3164885A4 (en) 2018-03-07

Similar Documents

Publication Publication Date Title
JP7111783B2 (ja) ファイバーレーザーによってアモルファスシリコン基板を均一に結晶化させるための方法及びシステム
KR100860114B1 (ko) 레이져 장치
CN104956466B (zh) 用于低温多晶硅结晶的短脉冲光纤激光器
US9044829B2 (en) Fiber laser systems for cold ablation
JP5506402B2 (ja) レーザビーム空間強度プロファイルの最適化のためのシステムおよび方法
TWI816674B (zh) 用於準分子雷射矽結晶之能量控制器
JP2001185504A (ja) レーザアニール方法及び装置
KR100810633B1 (ko) 레이저 조사장치, 레이저 결정화 장치 및 그를 이용한결정화 방법
KR100683662B1 (ko) 레이저 가공 장치
JP2013004597A (ja) レーザ装置、該レーザ装置を備えた露光装置及び検査装置
KR100814821B1 (ko) 실리콘 박막의 결정화 장치 및 방법
KR100603330B1 (ko) 레이저 결정화 장치
Paetzel et al. Laser annealing of LTPS
JP2007088050A (ja) レーザアニール方法およびその装置
KR20080040995A (ko) 레이저 결정화 장치 및 이를 이용한 실리콘 결정화 방법
Rowen et al. Multi-mJ bursts of green light obtained by frequency doubling the output of a fiber based MOPA
KR20050052603A (ko) 레이저 가공 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180618

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190314

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190422

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20190722

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20191023

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200406

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20200706

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20201102