JP2017528908A5 - - Google Patents

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Publication number
JP2017528908A5
JP2017528908A5 JP2017505210A JP2017505210A JP2017528908A5 JP 2017528908 A5 JP2017528908 A5 JP 2017528908A5 JP 2017505210 A JP2017505210 A JP 2017505210A JP 2017505210 A JP2017505210 A JP 2017505210A JP 2017528908 A5 JP2017528908 A5 JP 2017528908A5
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JP
Japan
Prior art keywords
integrated circuit
flexible integrated
flexible
bonding wire
polymer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017505210A
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English (en)
Japanese (ja)
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JP2017528908A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/051210 external-priority patent/WO2016048888A1/en
Publication of JP2017528908A publication Critical patent/JP2017528908A/ja
Publication of JP2017528908A5 publication Critical patent/JP2017528908A5/ja
Pending legal-status Critical Current

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JP2017505210A 2014-09-22 2015-09-21 伸張かつ屈曲可能な相互接続として機能するボンディング・ワイヤを、整形しかつルーピングするための方法および装置 Pending JP2017528908A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462053641P 2014-09-22 2014-09-22
US62/053,641 2014-09-22
PCT/US2015/051210 WO2016048888A1 (en) 2014-09-22 2015-09-21 Methods and apparatuses for shaping and looping bonding wires that serve as stretchable and bendable interconnects

Publications (2)

Publication Number Publication Date
JP2017528908A JP2017528908A (ja) 2017-09-28
JP2017528908A5 true JP2017528908A5 (https=) 2018-11-01

Family

ID=55526453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017505210A Pending JP2017528908A (ja) 2014-09-22 2015-09-21 伸張かつ屈曲可能な相互接続として機能するボンディング・ワイヤを、整形しかつルーピングするための方法および装置

Country Status (7)

Country Link
US (1) US20160086909A1 (https=)
EP (1) EP3198638A4 (https=)
JP (1) JP2017528908A (https=)
KR (1) KR20170058968A (https=)
CN (1) CN107004665A (https=)
CA (1) CA2957044A1 (https=)
WO (1) WO2016048888A1 (https=)

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US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
KR20150072415A (ko) 2012-10-09 2015-06-29 엠씨10, 인크 의류에 집적되는 컨포멀 전자기기
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
WO2015021039A1 (en) 2013-08-05 2015-02-12 Xia Li Flexible temperature sensor including conformable electronics
CA2925387A1 (en) 2013-10-07 2015-04-16 Mc10, Inc. Conformal sensor systems for sensing and analysis
WO2015077559A1 (en) 2013-11-22 2015-05-28 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
EP3092661A4 (en) 2014-01-06 2017-09-27 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
KR20160129007A (ko) 2014-03-04 2016-11-08 엠씨10, 인크 전자 디바이스를 위한 다부분 유연성 봉지 하우징
USD781270S1 (en) * 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
EP3356003A4 (en) 2015-10-01 2019-04-03 Mc10, Inc. METHOD AND SYSTEM FOR INTERACTION WITH A VIRTUAL ENVIRONMENT
WO2017062508A1 (en) 2015-10-05 2017-04-13 Mc10, Inc. Method and System for Neuromodulation and Stimulation
CN108781313B (zh) 2016-02-22 2022-04-08 美谛达解决方案公司 用以贴身获取传感器信息的耦接的集线器和传感器节点的系统、装置和方法
EP3829187A1 (en) 2016-02-22 2021-06-02 Medidata Solutions, Inc. System, devices, and method for on-body data and power transmission
WO2017184705A1 (en) 2016-04-19 2017-10-26 Mc10, Inc. Method and system for measuring perspiration
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
DE102016224631B4 (de) * 2016-12-09 2020-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch leitende Verbindung zwischen mindestens zwei elektrischen Komponenten an einem mit elektronischen und/oder elektrischen Bauelementen bestücktem Träger, die mit einem Bonddraht ausgebildet ist
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
CN116745062A (zh) * 2021-02-05 2023-09-12 新加坡贺利氏材料私人有限公司 经涂覆的线材
WO2022259328A1 (ja) * 2021-06-07 2022-12-15 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
CN121001480B (zh) * 2025-10-24 2026-01-06 深圳循光科技有限公司 一种键合线和发光器件

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