KR20170058968A - 신축성 및 굴곡성 상호 연결부의 역할을 하는 본딩 와이어를 성형 및 루핑하는 방법 및 장치 - Google Patents

신축성 및 굴곡성 상호 연결부의 역할을 하는 본딩 와이어를 성형 및 루핑하는 방법 및 장치 Download PDF

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KR20170058968A
KR20170058968A KR1020177009973A KR20177009973A KR20170058968A KR 20170058968 A KR20170058968 A KR 20170058968A KR 1020177009973 A KR1020177009973 A KR 1020177009973A KR 20177009973 A KR20177009973 A KR 20177009973A KR 20170058968 A KR20170058968 A KR 20170058968A
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South Korea
Prior art keywords
bonding wire
capillary tool
bond pad
dispensed
shape
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Withdrawn
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KR1020177009973A
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English (en)
Korean (ko)
Inventor
다비드 지. 가록
시아 리
산자 갓타
미툴 달랄
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엠씨10, 인크
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H01L24/48—
    • H01L24/45—
    • H01L24/78—
    • H01L24/85—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H01L2224/45144—
    • H01L2224/45147—
    • H01L2224/4805—
    • H01L2224/48092—
    • H01L2224/4813—
    • H01L2224/48463—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07555—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5368—Shapes of wire connectors the bond wires having helical loops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
KR1020177009973A 2014-09-22 2015-09-21 신축성 및 굴곡성 상호 연결부의 역할을 하는 본딩 와이어를 성형 및 루핑하는 방법 및 장치 Withdrawn KR20170058968A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462053641P 2014-09-22 2014-09-22
US62/053,641 2014-09-22
PCT/US2015/051210 WO2016048888A1 (en) 2014-09-22 2015-09-21 Methods and apparatuses for shaping and looping bonding wires that serve as stretchable and bendable interconnects

Publications (1)

Publication Number Publication Date
KR20170058968A true KR20170058968A (ko) 2017-05-29

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KR1020177009973A Withdrawn KR20170058968A (ko) 2014-09-22 2015-09-21 신축성 및 굴곡성 상호 연결부의 역할을 하는 본딩 와이어를 성형 및 루핑하는 방법 및 장치

Country Status (7)

Country Link
US (1) US20160086909A1 (https=)
EP (1) EP3198638A4 (https=)
JP (1) JP2017528908A (https=)
KR (1) KR20170058968A (https=)
CN (1) CN107004665A (https=)
CA (1) CA2957044A1 (https=)
WO (1) WO2016048888A1 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
WO2014058473A1 (en) 2012-10-09 2014-04-17 Mc10, Inc. Conformal electronics integrated with apparel
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
JP2016527649A (ja) 2013-08-05 2016-09-08 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 適合する電子機器を含む可撓性温度センサ
US10467926B2 (en) 2013-10-07 2019-11-05 Mc10, Inc. Conformal sensor systems for sensing and analysis
JP6711750B2 (ja) 2013-11-22 2020-06-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 心臓活動の検知および分析のためのコンフォーマルセンサシステム
CA2935372C (en) 2014-01-06 2023-08-08 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
US10485118B2 (en) 2014-03-04 2019-11-19 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices and methods of making the same
USD781270S1 (en) * 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
WO2016134306A1 (en) 2015-02-20 2016-08-25 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
US10300371B2 (en) 2015-10-01 2019-05-28 Mc10, Inc. Method and system for interacting with a virtual environment
CN108289630A (zh) 2015-10-05 2018-07-17 Mc10股份有限公司 用于神经调节和刺激的方法和系统
WO2017147053A1 (en) 2016-02-22 2017-08-31 Mc10, Inc. System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
US10277386B2 (en) 2016-02-22 2019-04-30 Mc10, Inc. System, devices, and method for on-body data and power transmission
CN109310340A (zh) 2016-04-19 2019-02-05 Mc10股份有限公司 用于测量汗液的方法和系统
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
DE102016224631B4 (de) * 2016-12-09 2020-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch leitende Verbindung zwischen mindestens zwei elektrischen Komponenten an einem mit elektronischen und/oder elektrischen Bauelementen bestücktem Träger, die mit einem Bonddraht ausgebildet ist
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
WO2022169407A1 (en) * 2021-02-05 2022-08-11 Heraeus Materials Singapore Pte. Ltd. Coated wire
WO2022259328A1 (ja) * 2021-06-07 2022-12-15 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
CN121001480B (zh) * 2025-10-24 2026-01-06 深圳循光科技有限公司 一种键合线和发光器件

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838240A (en) * 1973-04-04 1974-09-24 Rca Corp Bonding tool and method of bonding therewith
US5438305A (en) * 1991-08-12 1995-08-01 Hitachi, Ltd. High frequency module including a flexible substrate
JPH05102228A (ja) * 1991-10-07 1993-04-23 Seiko Epson Corp 半導体装置の製造方法
JP3218797B2 (ja) * 1993-05-20 2001-10-15 株式会社日立製作所 高周波回路モジュールの製造方法
JPH11288961A (ja) * 1998-04-03 1999-10-19 Kaijo Corp 導線の接続方法、導線の配線方法およびワイヤボンディング方法
WO2000069234A1 (en) * 1999-05-07 2000-11-16 The Furukawa Electric Co., Ltd. Wiring method and wiring device
US6743982B2 (en) * 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
US7227240B2 (en) * 2002-09-10 2007-06-05 Semiconductor Components Industries, L.L.C. Semiconductor device with wire bond inductor and method
WO2004025695A2 (en) * 2002-09-10 2004-03-25 Semiconductor Components Industries L.L.C. Semiconductor device with wire bond inductor and method
US7192863B2 (en) * 2004-07-30 2007-03-20 Texas Instruments Incorporated Method of eliminating etch ridges in a dual damascene process
JP4137061B2 (ja) * 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
JP2009064966A (ja) * 2007-09-06 2009-03-26 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法ならびに半導体装置
JP2009158839A (ja) * 2007-12-27 2009-07-16 Sharp Corp 半導体パッケージ、半導体装置、およびワイヤボンディング方法
KR101013557B1 (ko) * 2008-11-06 2011-02-14 주식회사 하이닉스반도체 플랙시블 반도체 패키지 및 이를 제조하기 위한 와이어 본딩 장치
US8404520B1 (en) * 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
CN104380460B (zh) * 2012-07-13 2017-07-28 先端光子公司 基台和密封完毕的半导体元件以及它们的制作方法
US9706647B2 (en) * 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
JP5737452B2 (ja) * 2014-04-16 2015-06-17 セイコーエプソン株式会社 温度計及び温度計測方法

Also Published As

Publication number Publication date
WO2016048888A1 (en) 2016-03-31
CA2957044A1 (en) 2016-03-31
JP2017528908A (ja) 2017-09-28
CN107004665A (zh) 2017-08-01
EP3198638A1 (en) 2017-08-02
EP3198638A4 (en) 2018-05-30
US20160086909A1 (en) 2016-03-24

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