JP2017528908A5 - - Google Patents
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- Publication number
- JP2017528908A5 JP2017528908A5 JP2017505210A JP2017505210A JP2017528908A5 JP 2017528908 A5 JP2017528908 A5 JP 2017528908A5 JP 2017505210 A JP2017505210 A JP 2017505210A JP 2017505210 A JP2017505210 A JP 2017505210A JP 2017528908 A5 JP2017528908 A5 JP 2017528908A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- flexible integrated
- flexible
- bonding wire
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- -1 polyethylene terephthalate Polymers 0.000 claims 8
- 239000004020 conductor Substances 0.000 claims 5
- 239000004698 Polyethylene Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 229920000573 polyethylene Polymers 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- 229920001971 elastomer Polymers 0.000 claims 2
- 239000012777 electrically insulating material Substances 0.000 claims 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims 2
- 229920003023 plastic Polymers 0.000 claims 2
- 239000004033 plastic Substances 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 1
- 239000004677 Nylon Substances 0.000 claims 1
- 239000004962 Polyamide-imide Substances 0.000 claims 1
- 239000004693 Polybenzimidazole Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920000265 Polyparaphenylene Polymers 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 239000004954 Polyphthalamide Substances 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229920002988 biodegradable polymer Polymers 0.000 claims 1
- 239000004621 biodegradable polymer Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 229920002457 flexible plastic Polymers 0.000 claims 1
- 239000004811 fluoropolymer Substances 0.000 claims 1
- 229920002313 fluoropolymer Polymers 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229920001778 nylon Polymers 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000002985 plastic film Substances 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 1
- 229920002239 polyacrylonitrile Polymers 0.000 claims 1
- 229920002312 polyamide-imide Polymers 0.000 claims 1
- 229920001230 polyarylate Polymers 0.000 claims 1
- 229920002480 polybenzimidazole Polymers 0.000 claims 1
- 229920001748 polybutylene Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 229920001470 polyketone Polymers 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims 1
- 229920000306 polymethylpentene Polymers 0.000 claims 1
- 239000011116 polymethylpentene Substances 0.000 claims 1
- 229920006324 polyoxymethylene Polymers 0.000 claims 1
- 229920006380 polyphenylene oxide Polymers 0.000 claims 1
- 229920006375 polyphtalamide Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000005060 rubber Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 150000003457 sulfones Chemical class 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 229920002725 thermoplastic elastomer Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052723 transition metal Inorganic materials 0.000 claims 1
- 150000003624 transition metals Chemical class 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462053641P | 2014-09-22 | 2014-09-22 | |
| US62/053,641 | 2014-09-22 | ||
| PCT/US2015/051210 WO2016048888A1 (en) | 2014-09-22 | 2015-09-21 | Methods and apparatuses for shaping and looping bonding wires that serve as stretchable and bendable interconnects |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017528908A JP2017528908A (ja) | 2017-09-28 |
| JP2017528908A5 true JP2017528908A5 (cg-RX-API-DMAC7.html) | 2018-11-01 |
Family
ID=55526453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017505210A Pending JP2017528908A (ja) | 2014-09-22 | 2015-09-21 | 伸張かつ屈曲可能な相互接続として機能するボンディング・ワイヤを、整形しかつルーピングするための方法および装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160086909A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3198638A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2017528908A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20170058968A (cg-RX-API-DMAC7.html) |
| CN (1) | CN107004665A (cg-RX-API-DMAC7.html) |
| CA (1) | CA2957044A1 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2016048888A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| KR20150072415A (ko) | 2012-10-09 | 2015-06-29 | 엠씨10, 인크 | 의류에 집적되는 컨포멀 전자기기 |
| US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
| KR20160040670A (ko) | 2013-08-05 | 2016-04-14 | 엠씨10, 인크 | 곡면부착형 전자기기를 포함하는 유연한 온도 센서 |
| KR20160065948A (ko) | 2013-10-07 | 2016-06-09 | 엠씨10, 인크 | 감지 및 분석용 등각 센서 시스템 |
| US9949691B2 (en) | 2013-11-22 | 2018-04-24 | Mc10, Inc. | Conformal sensor systems for sensing and analysis of cardiac activity |
| KR102396850B1 (ko) | 2014-01-06 | 2022-05-11 | 메디데이타 솔루션즈, 인코포레이티드 | 봉지형 컨포멀 전자 시스템 및 디바이스, 및 이의 제조 및 사용 방법 |
| JP6637896B2 (ja) | 2014-03-04 | 2020-01-29 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 電子デバイス用の可撓性を有するマルチパート封止ハウジングを備えるコンフォーマルなｉｃデバイス |
| USD781270S1 (en) * | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
| WO2016134306A1 (en) | 2015-02-20 | 2016-08-25 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
| US10653332B2 (en) | 2015-07-17 | 2020-05-19 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
| WO2017031129A1 (en) | 2015-08-19 | 2017-02-23 | Mc10, Inc. | Wearable heat flux devices and methods of use |
| US10300371B2 (en) | 2015-10-01 | 2019-05-28 | Mc10, Inc. | Method and system for interacting with a virtual environment |
| CN108289630A (zh) | 2015-10-05 | 2018-07-17 | Mc10股份有限公司 | 用于神经调节和刺激的方法和系统 |
| WO2017147053A1 (en) | 2016-02-22 | 2017-08-31 | Mc10, Inc. | System, device, and method for coupled hub and sensor node on-body acquisition of sensor information |
| WO2017147052A1 (en) | 2016-02-22 | 2017-08-31 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
| CN109310340A (zh) | 2016-04-19 | 2019-02-05 | Mc10股份有限公司 | 用于测量汗液的方法和系统 |
| US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
| DE102016224631B4 (de) * | 2016-12-09 | 2020-06-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Elektrisch leitende Verbindung zwischen mindestens zwei elektrischen Komponenten an einem mit elektronischen und/oder elektrischen Bauelementen bestücktem Träger, die mit einem Bonddraht ausgebildet ist |
| US11123011B1 (en) | 2020-03-23 | 2021-09-21 | Nix, Inc. | Wearable systems, devices, and methods for measurement and analysis of body fluids |
| US12404598B2 (en) * | 2021-02-05 | 2025-09-02 | Heraeus Electronics Gmbh & Co. Kg | Coated wire |
| WO2022259328A1 (ja) * | 2021-06-07 | 2022-12-15 | 株式会社新川 | ワイヤボンディング装置及びワイヤボンディング方法 |
| CN121001480A (zh) * | 2025-10-24 | 2025-11-21 | 深圳循光科技有限公司 | 一种键合线和发光器件 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3838240A (en) * | 1973-04-04 | 1974-09-24 | Rca Corp | Bonding tool and method of bonding therewith |
| US5438305A (en) * | 1991-08-12 | 1995-08-01 | Hitachi, Ltd. | High frequency module including a flexible substrate |
| JPH05102228A (ja) * | 1991-10-07 | 1993-04-23 | Seiko Epson Corp | 半導体装置の製造方法 |
| JP3218797B2 (ja) * | 1993-05-20 | 2001-10-15 | 株式会社日立製作所 | 高周波回路モジュールの製造方法 |
| JPH11288961A (ja) * | 1998-04-03 | 1999-10-19 | Kaijo Corp | 導線の接続方法、導線の配線方法およびワイヤボンディング方法 |
| KR100713319B1 (ko) * | 1999-05-07 | 2007-05-04 | 후루카와 덴키 고교 가부시키가이샤 | 배선 방법 및 배선 장치 |
| US6743982B2 (en) * | 2000-11-29 | 2004-06-01 | Xerox Corporation | Stretchable interconnects using stress gradient films |
| JP4255442B2 (ja) * | 2002-09-10 | 2009-04-15 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | ワイヤ・ボンド・インダクタを有する半導体装置および方法 |
| US7227240B2 (en) * | 2002-09-10 | 2007-06-05 | Semiconductor Components Industries, L.L.C. | Semiconductor device with wire bond inductor and method |
| US7192863B2 (en) * | 2004-07-30 | 2007-03-20 | Texas Instruments Incorporated | Method of eliminating etch ridges in a dual damascene process |
| JP4137061B2 (ja) * | 2005-01-11 | 2008-08-20 | 株式会社カイジョー | ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法 |
| JP2009064966A (ja) * | 2007-09-06 | 2009-03-26 | Shinko Electric Ind Co Ltd | 多層配線基板及びその製造方法ならびに半導体装置 |
| JP2009158839A (ja) * | 2007-12-27 | 2009-07-16 | Sharp Corp | 半導体パッケージ、半導体装置、およびワイヤボンディング方法 |
| KR101013557B1 (ko) * | 2008-11-06 | 2011-02-14 | 주식회사 하이닉스반도체 | 플랙시블 반도체 패키지 및 이를 제조하기 위한 와이어 본딩 장치 |
| US8836136B2 (en) * | 2011-10-17 | 2014-09-16 | Invensas Corporation | Package-on-package assembly with wire bond vias |
| US9263411B2 (en) * | 2012-07-13 | 2016-02-16 | Advanced Photonics, Inc. | Submount, encapsulated semiconductor element, and methods of manufacturing the same |
| US9706647B2 (en) * | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
| JP5737452B2 (ja) * | 2014-04-16 | 2015-06-17 | セイコーエプソン株式会社 | 温度計及び温度計測方法 |
-
2015
- 2015-09-21 EP EP15843188.2A patent/EP3198638A4/en not_active Withdrawn
- 2015-09-21 US US14/859,680 patent/US20160086909A1/en not_active Abandoned
- 2015-09-21 JP JP2017505210A patent/JP2017528908A/ja active Pending
- 2015-09-21 KR KR1020177009973A patent/KR20170058968A/ko not_active Withdrawn
- 2015-09-21 CA CA2957044A patent/CA2957044A1/en not_active Abandoned
- 2015-09-21 CN CN201580044924.4A patent/CN107004665A/zh active Pending
- 2015-09-21 WO PCT/US2015/051210 patent/WO2016048888A1/en not_active Ceased
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