JP2015230990A5 - - Google Patents

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Publication number
JP2015230990A5
JP2015230990A5 JP2014117042A JP2014117042A JP2015230990A5 JP 2015230990 A5 JP2015230990 A5 JP 2015230990A5 JP 2014117042 A JP2014117042 A JP 2014117042A JP 2014117042 A JP2014117042 A JP 2014117042A JP 2015230990 A5 JP2015230990 A5 JP 2015230990A5
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JP
Japan
Prior art keywords
chip
main surface
connection member
semiconductor device
conductive connection
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JP2014117042A
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English (en)
Japanese (ja)
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JP2015230990A (ja
JP6371122B2 (ja
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Priority to JP2014117042A priority Critical patent/JP6371122B2/ja
Priority claimed from JP2014117042A external-priority patent/JP6371122B2/ja
Publication of JP2015230990A publication Critical patent/JP2015230990A/ja
Publication of JP2015230990A5 publication Critical patent/JP2015230990A5/ja
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Publication of JP6371122B2 publication Critical patent/JP6371122B2/ja
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JP2014117042A 2014-06-05 2014-06-05 パワー半導体装置および樹脂封止型モータ Active JP6371122B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014117042A JP6371122B2 (ja) 2014-06-05 2014-06-05 パワー半導体装置および樹脂封止型モータ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014117042A JP6371122B2 (ja) 2014-06-05 2014-06-05 パワー半導体装置および樹脂封止型モータ

Publications (3)

Publication Number Publication Date
JP2015230990A JP2015230990A (ja) 2015-12-21
JP2015230990A5 true JP2015230990A5 (cg-RX-API-DMAC7.html) 2017-04-13
JP6371122B2 JP6371122B2 (ja) 2018-08-08

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ID=54887621

Family Applications (1)

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JP2014117042A Active JP6371122B2 (ja) 2014-06-05 2014-06-05 パワー半導体装置および樹脂封止型モータ

Country Status (1)

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JP (1) JP6371122B2 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7290960B2 (ja) * 2019-03-11 2023-06-14 ローム株式会社 半導体装置
WO2021079846A1 (ja) * 2019-10-24 2021-04-29 ローム株式会社 半導体装置
JP7725884B2 (ja) 2021-06-16 2025-08-20 富士電機株式会社 抵抗素子及びその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04134862U (ja) * 1991-06-04 1992-12-15 沖電気工業株式会社 混成集積回路装置
JPH06181286A (ja) * 1992-12-14 1994-06-28 Toshiba Corp 半導体装置
US5977640A (en) * 1998-06-26 1999-11-02 International Business Machines Corporation Highly integrated chip-on-chip packaging
JP3503133B2 (ja) * 1999-12-10 2004-03-02 日本電気株式会社 電子デバイス集合体と電子デバイスの接続方法
JP3815933B2 (ja) * 1999-12-10 2006-08-30 ローム株式会社 半導体装置及びその製造方法
JP2002170920A (ja) * 2000-12-04 2002-06-14 Nec Eng Ltd フリップチップ装置
JP3723869B2 (ja) * 2001-03-30 2005-12-07 株式会社日立製作所 半導体装置
JP2003152158A (ja) * 2001-11-09 2003-05-23 Matsushita Electric Ind Co Ltd 半導体素子を実装した電子部品及びその製造方法
JP2003258197A (ja) * 2002-03-07 2003-09-12 Seiko Instruments Inc 半導体装置
JP2003319615A (ja) * 2002-04-23 2003-11-07 Matsushita Electric Ind Co Ltd モールド型モータ
JP2004146728A (ja) * 2002-10-28 2004-05-20 Sony Corp 半導体装置とその製造方法
JP5966287B2 (ja) * 2011-09-15 2016-08-10 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法

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