JP2017527460A5 - - Google Patents

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Publication number
JP2017527460A5
JP2017527460A5 JP2017500850A JP2017500850A JP2017527460A5 JP 2017527460 A5 JP2017527460 A5 JP 2017527460A5 JP 2017500850 A JP2017500850 A JP 2017500850A JP 2017500850 A JP2017500850 A JP 2017500850A JP 2017527460 A5 JP2017527460 A5 JP 2017527460A5
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JP
Japan
Prior art keywords
vol
core layer
reinforcing material
flow rate
melt flow
Prior art date
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Pending
Application number
JP2017500850A
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English (en)
Japanese (ja)
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JP2017527460A (ja
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Publication date
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Priority claimed from PCT/IB2015/055211 external-priority patent/WO2016005942A1/en
Publication of JP2017527460A publication Critical patent/JP2017527460A/ja
Publication of JP2017527460A5 publication Critical patent/JP2017527460A5/ja
Pending legal-status Critical Current

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JP2017500850A 2014-07-09 2015-07-09 電子筐体および他の装置のための薄壁複合物 Pending JP2017527460A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462022333P 2014-07-09 2014-07-09
US62/022,333 2014-07-09
PCT/IB2015/055211 WO2016005942A1 (en) 2014-07-09 2015-07-09 Thinwall composites for electronic enclosures and other devices

Publications (2)

Publication Number Publication Date
JP2017527460A JP2017527460A (ja) 2017-09-21
JP2017527460A5 true JP2017527460A5 (enExample) 2018-08-16

Family

ID=54065392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017500850A Pending JP2017527460A (ja) 2014-07-09 2015-07-09 電子筐体および他の装置のための薄壁複合物

Country Status (6)

Country Link
US (2) US10549512B2 (enExample)
EP (1) EP3166787B1 (enExample)
JP (1) JP2017527460A (enExample)
KR (1) KR20170028946A (enExample)
CN (2) CN109927377A (enExample)
WO (1) WO2016005942A1 (enExample)

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US20190070839A1 (en) * 2016-04-06 2019-03-07 Sabic Global Technologies B.V. Filler-reinforced solid resin multilayered structure
JP6059841B1 (ja) * 2016-05-16 2017-01-11 則之 加納 ２次元スチール製織物と一体化した樹脂構造体の成形方法
ES2793280T3 (es) 2017-03-15 2020-11-13 Samsonite Ip Holdings Sarl Películas laminadas de polímero termoplástico orientado biaxialmente para artículos para equipaje y métodos para fabricarlas
CN107379394A (zh) * 2017-04-07 2017-11-24 通达（厦门）精密橡塑有限公司 一种超薄型网布+塑胶的双射注塑成型方法
CN107283977B (zh) * 2017-07-12 2019-03-26 合肥东恒锐电子科技有限公司 一种用于电脑外壳的复合材料
EP3552814B1 (en) * 2018-04-09 2021-03-03 SHPP Global Technologies B.V. Fiber-reinforced composites including and/or formed in part from fibrous non-woven layers
AU2019393078A1 (en) * 2018-12-07 2021-07-08 TekModo OZ Holdings, LLC Composite laminate resin and fiberglass structure
EP3999304B1 (en) 2019-07-15 2025-12-10 Covestro Deutschland AG Housing parts, housings and processes for preparing the same
EP3771959A1 (en) * 2019-07-31 2021-02-03 SHPP Global Technologies B.V. Portable electronic device housings having hybrid laminate sidewalls and methods of making the same
CN111016361A (zh) * 2019-12-20 2020-04-17 无锡赢同新材料科技有限公司 一种具有多层结构的pc/pok复合材料及其制备方法
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CN114449792A (zh) * 2020-10-30 2022-05-06 Oppo广东移动通信有限公司 壳体及其制作方法、电子设备
CN112571715A (zh) * 2020-12-18 2021-03-30 昆山市杰尔电子科技股份有限公司 一种笔记本电脑壳体环保型成型工艺
WO2023009165A1 (en) * 2021-07-30 2023-02-02 Hewlett-Packard Development Company, L.P. Electronic device housing layers
WO2023108614A1 (en) * 2021-12-17 2023-06-22 Sabic Global Technologies B.V. Article comprising a layer with dispersed glass fibers and a layer with continuous glass fibers
CN114350056B (zh) * 2022-01-17 2023-02-14 茂泰(福建)鞋材有限公司 一种耐寒eva发泡材料及其制备方法
CN118700676A (zh) * 2024-06-14 2024-09-27 荣耀终端有限公司 电子设备的壳体及其制作方法、电子设备

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CN104290372B (zh) * 2014-07-25 2016-02-24 北京化工大学 一种连续纤维增强热塑性聚合物调温板

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