CN106660339B - 用于电子外壳及其他设备的薄壁复合物 - Google Patents

用于电子外壳及其他设备的薄壁复合物 Download PDF

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Publication number
CN106660339B
CN106660339B CN201580037088.7A CN201580037088A CN106660339B CN 106660339 B CN106660339 B CN 106660339B CN 201580037088 A CN201580037088 A CN 201580037088A CN 106660339 B CN106660339 B CN 106660339B
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China
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equal
core layer
core
outer layer
thermoplastic material
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Expired - Fee Related
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CN201580037088.7A
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English (en)
Chinese (zh)
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CN106660339A (zh
Inventor
斯科特·迈克尔·戴维斯
丹尼尔·索尔
克雷格·劳伦斯·米尔恩
克里斯托弗·沃尔
埃米莉·霍姆西
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SABIC Global Technologies BV
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SABIC Global Technologies BV
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Priority to CN201910120362.7A priority Critical patent/CN109927377A/zh
Publication of CN106660339A publication Critical patent/CN106660339A/zh
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    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/12Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467Joining articles or parts of a single article
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    • B32B7/02Physical, chemical or physicochemical properties
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29K2069/00Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2713/00Use of textile products or fabrics for preformed parts, e.g. for inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
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    • BPERFORMING OPERATIONS; TRANSPORTING
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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
CN201580037088.7A 2014-07-09 2015-07-09 用于电子外壳及其他设备的薄壁复合物 Expired - Fee Related CN106660339B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910120362.7A CN109927377A (zh) 2014-07-09 2015-07-09 用于电子外壳及其他设备的薄壁复合物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462022333P 2014-07-09 2014-07-09
US62/022,333 2014-07-09
PCT/IB2015/055211 WO2016005942A1 (en) 2014-07-09 2015-07-09 Thinwall composites for electronic enclosures and other devices

Related Child Applications (1)

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CN201910120362.7A Division CN109927377A (zh) 2014-07-09 2015-07-09 用于电子外壳及其他设备的薄壁复合物

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Publication Number Publication Date
CN106660339A CN106660339A (zh) 2017-05-10
CN106660339B true CN106660339B (zh) 2019-03-15

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CN201910120362.7A Pending CN109927377A (zh) 2014-07-09 2015-07-09 用于电子外壳及其他设备的薄壁复合物
CN201580037088.7A Expired - Fee Related CN106660339B (zh) 2014-07-09 2015-07-09 用于电子外壳及其他设备的薄壁复合物

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US (2) US10549512B2 (enExample)
EP (1) EP3166787B1 (enExample)
JP (1) JP2017527460A (enExample)
KR (1) KR20170028946A (enExample)
CN (2) CN109927377A (enExample)
WO (1) WO2016005942A1 (enExample)

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EP3890950A4 (en) * 2018-12-07 2022-08-31 Tekmodo oz Holdings, LLC COMPOSITE LAMINATED RESIN AND FIBERGLASS STRUCTURE
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EP3771959A1 (en) * 2019-07-31 2021-02-03 SHPP Global Technologies B.V. Portable electronic device housings having hybrid laminate sidewalls and methods of making the same
CN111016361A (zh) * 2019-12-20 2020-04-17 无锡赢同新材料科技有限公司 一种具有多层结构的pc/pok复合材料及其制备方法
US11749585B2 (en) * 2020-02-28 2023-09-05 Intel Corporation High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package
CN112799230A (zh) * 2020-09-30 2021-05-14 歌尔光学科技有限公司 一种壳体制备方法、壳体以及头戴显示设备
CN114449792A (zh) * 2020-10-30 2022-05-06 Oppo广东移动通信有限公司 壳体及其制作方法、电子设备
CN112571715A (zh) * 2020-12-18 2021-03-30 昆山市杰尔电子科技股份有限公司 一种笔记本电脑壳体环保型成型工艺
WO2023009165A1 (en) * 2021-07-30 2023-02-02 Hewlett-Packard Development Company, L.P. Electronic device housing layers
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CN114350056B (zh) * 2022-01-17 2023-02-14 茂泰(福建)鞋材有限公司 一种耐寒eva发泡材料及其制备方法
CN118700676A (zh) * 2024-06-14 2024-09-27 荣耀终端有限公司 电子设备的壳体及其制作方法、电子设备

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