JP2017521702A - 蛍光体変換ledのための反射カップアレイを含むフラッシュモジュール - Google Patents
蛍光体変換ledのための反射カップアレイを含むフラッシュモジュール Download PDFInfo
- Publication number
- JP2017521702A JP2017521702A JP2016573842A JP2016573842A JP2017521702A JP 2017521702 A JP2017521702 A JP 2017521702A JP 2016573842 A JP2016573842 A JP 2016573842A JP 2016573842 A JP2016573842 A JP 2016573842A JP 2017521702 A JP2017521702 A JP 2017521702A
- Authority
- JP
- Japan
- Prior art keywords
- camera
- array
- cup
- lead frame
- leds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 12
- 239000004033 plastic Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000003491 array Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 241000450412 Nierembergia repens Species 0.000 description 1
- 241001085205 Prenanthella exigua Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0503—Built-in units
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0564—Combinations of cameras with electronic flash units characterised by the type of light source
- G03B2215/0567—Solid-state light source, e.g. LED, laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0582—Reflectors
- G03B2215/0585—Movable reflectors, e.g. change of illumination angle or direction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0589—Diffusors, filters or refraction means
- G03B2215/0592—Diffusors, filters or refraction means installed in front of light emitter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Stroboscope Apparatuses (AREA)
- Studio Devices (AREA)
Abstract
Description
本発明は、パッケージされた発光ダイオード(LEDs)に関し、特に、薄型カメラフラッシュのためのコリメーティング反射カップ又はレンズのアレイ内に取り付けられた蛍光体変換LEDダイのアレイに関する。
Claims (15)
- フラッシュモジュールを組み込んだカメラであって、
単一リードフレーム上に取り付けられた複数の発光ダイオード(LEDs)の長方形アレイと、
複数の反射性カップのアレイであり、各カップが、関連するLEDを包囲する反射性壁を有し、実質的に長方形の光出口開口部を有する、反射性カップのアレイと、
関連するLEDを覆い、各カップ内部に位置される蛍光体と、
LEDのアレイとカップのアレイとを収容するカメラであり、カップのアレイのアスペクト比が当該カメラの視野のアスペクト比にほぼ整合する、カメラと、
リードフレームへ電流のパルスを提供して、写真撮影中にLEDのアレイを照射させる駆動回路と、
を有するカメラ。 - 請求項1に記載のカメラであり、
前記各カップが、実質的に正方形の開口部を有する、
カメラ。 - 請求項1に記載のカメラであり、
前記反射性カップのアレイのアスペクト比が約16:9である、
カメラ。 - 請求項1に記載のカメラであり、
前記反射性カップのアレイのアスペクト比が約5:3である、
カメラ。 - 請求項1に記載のカメラであり、
前記反射性カップのアレイのアスペクト比が約4:3である、
カメラ。 - 請求項1に記載のカメラであり、
蛍光体がバインダーと蛍光体粉末との混合物を含み、該混合物が各カップ内部のLEDを封止している、
カメラ。 - 請求項1に記載のカメラであり、
前記反射性カップのアレイが、リードフレーム上に成型されたカップの単一アレイとして形成されている、
カメラ。 - 請求項1に記載のカメラであり、
前記反射性カップのアレイが、スタンピングされた金属シートで形成され、リードフレームに固着されている、
カメラ。 - 請求項1に記載のカメラであり、
各前記LEDが、0.25mm未満の側部を有する、
カメラ。 - 請求項1に記載のカメラであり、
前記各カップが、3mm未満の高さを有する、
カメラ。 - 請求項1に記載のカメラであり、
前記LEDの上に、光をコリメーティングするための成型レンズが存在しない、
カメラ。 - 請求項1に記載のカメラであり、
前記リードフレームが、少なくともいくつかのLEDを直列に接続している、
カメラ。 - フラッシュモジュールを組み込んだカメラであって、
単一リードフレーム上に取り付けられた複数の発光ダイオード(LEDs)の長方形アレイと、
関連するLEDを包囲する、リードフレーム上で成型されたコリメーティングレンズのアレイであり、
関連するLEDを覆い、各レンズ内部に位置される蛍光体と、
LEDのアレイとレンズのアレイとを収容するカメラであり、レンズのアレイのアスペクト比が当該カメラの視野のアスペクト比にほぼ整合する、カメラと、
リードフレームへ電流のパルスを提供して、写真撮影中にLEDのアレイを照射させる駆動回路と、
を有するカメラ。 - 請求項13に記載のカメラであり、
各前記LEDが、0.25mm未満の側部を有し、前記LEDの長方形アレイが約16:9のアスペクト比を有する、
カメラ。 - 請求項14に記載のカメラであり、
前記LEDの長方形アレイが5:3アレイ又は4:3アレイの一つを形成する、
カメラ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021063895A JP2021114614A (ja) | 2014-06-17 | 2021-04-05 | 蛍光体変換ledのための反射カップアレイを含むフラッシュモジュール |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462013010P | 2014-06-17 | 2014-06-17 | |
US62/013,010 | 2014-06-17 | ||
PCT/IB2015/054539 WO2015193807A1 (en) | 2014-06-17 | 2015-06-16 | A flash module containing an array of reflector cups for phosphor-converted leds |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021063895A Division JP2021114614A (ja) | 2014-06-17 | 2021-04-05 | 蛍光体変換ledのための反射カップアレイを含むフラッシュモジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017521702A true JP2017521702A (ja) | 2017-08-03 |
Family
ID=53773471
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016573842A Pending JP2017521702A (ja) | 2014-06-17 | 2015-06-16 | 蛍光体変換ledのための反射カップアレイを含むフラッシュモジュール |
JP2021063895A Pending JP2021114614A (ja) | 2014-06-17 | 2021-04-05 | 蛍光体変換ledのための反射カップアレイを含むフラッシュモジュール |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021063895A Pending JP2021114614A (ja) | 2014-06-17 | 2021-04-05 | 蛍光体変換ledのための反射カップアレイを含むフラッシュモジュール |
Country Status (7)
Country | Link |
---|---|
US (2) | US10649315B2 (ja) |
EP (1) | EP3158393B1 (ja) |
JP (2) | JP2017521702A (ja) |
KR (1) | KR102244461B1 (ja) |
CN (2) | CN106462033A (ja) |
TW (3) | TWI698694B (ja) |
WO (1) | WO2015193807A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11649945B2 (en) | 2020-01-23 | 2023-05-16 | Nichia Corporation | Light source device |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015193807A1 (en) | 2014-06-17 | 2015-12-23 | Koninklijke Philips N.V. | A flash module containing an array of reflector cups for phosphor-converted leds |
US10403792B2 (en) | 2016-03-07 | 2019-09-03 | Rayvio Corporation | Package for ultraviolet emitting devices |
US20180006203A1 (en) * | 2016-07-01 | 2018-01-04 | Rayvio Corporation | Ultraviolet emitting device |
EP3555928B1 (en) * | 2016-12-15 | 2020-10-07 | Lumileds Holding B.V. | Led module with high near field contrast ratio |
US10420177B2 (en) | 2016-12-19 | 2019-09-17 | Whelen Engineering Company, Inc. | LED illumination module with fixed optic and variable emission pattern |
KR102486428B1 (ko) | 2016-12-21 | 2023-01-10 | 루미리즈 홀딩 비.브이. | Led 어레이 모듈 |
US10924647B2 (en) | 2019-06-11 | 2021-02-16 | Google Llc | Flash module with LED-covering substrate having different diameters |
CN112216774A (zh) * | 2019-07-11 | 2021-01-12 | 成都辰显光电有限公司 | 色彩转换组件、显示面板及制作方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005091675A (ja) * | 2003-09-17 | 2005-04-07 | Pentax Corp | 発光装置 |
JP2005114924A (ja) * | 2003-10-06 | 2005-04-28 | Pentax Corp | 撮影用照明装置 |
JP2005164990A (ja) * | 2003-12-03 | 2005-06-23 | Pentax Corp | 照明機能付き撮影装置 |
JP2007180520A (ja) * | 2005-10-25 | 2007-07-12 | Philips Lumileds Lightng Co Llc | 異なる補助光学素子を有する複合発光ダイオード |
JP2007266358A (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corp | 発光装置および照明装置 |
JP2008513983A (ja) * | 2004-09-22 | 2008-05-01 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクスデバイス用ケーシング、オプトエレクトロニクスデバイスおよびオプトエレクトロニクスデバイスの製造方法 |
JP2011114096A (ja) * | 2009-11-25 | 2011-06-09 | Panasonic Electric Works Co Ltd | 照明装置 |
WO2013122722A1 (en) * | 2012-02-16 | 2013-08-22 | Qualcomm Mems Technologies, Inc. | Flash illumination system |
JP2014011359A (ja) * | 2012-06-29 | 2014-01-20 | Sharp Corp | 発光装置、照明装置および表示装置用バックライト |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7091653B2 (en) | 2003-01-27 | 2006-08-15 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar long pass reflector |
US7118438B2 (en) * | 2003-01-27 | 2006-10-10 | 3M Innovative Properties Company | Methods of making phosphor based light sources having an interference reflector |
JP3910171B2 (ja) * | 2003-02-18 | 2007-04-25 | シャープ株式会社 | 半導体発光装置、その製造方法および電子撮像装置 |
JP2005019675A (ja) | 2003-06-26 | 2005-01-20 | Toshiba Corp | ウエット処理装置 |
US20050225222A1 (en) * | 2004-04-09 | 2005-10-13 | Joseph Mazzochette | Light emitting diode arrays with improved light extraction |
DE102004031689A1 (de) | 2004-06-30 | 2006-02-16 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung |
JP2006298404A (ja) * | 2005-04-18 | 2006-11-02 | Gifu Plast Ind Co Ltd | パレット |
US7284871B2 (en) | 2005-08-08 | 2007-10-23 | Avago Technologies Ecb4 Ip (Singapore) Pte Ltd | Light-emitting diode module for flash and auto-focus application |
US7519287B2 (en) * | 2005-08-19 | 2009-04-14 | Avago Technologies Ecbu Ip (Singapore) Pte, Ltd. | Electronic flash, imaging device and method for producing a flash of light having a rectangular radiation pattern |
US20070127005A1 (en) | 2005-12-02 | 2007-06-07 | Asml Holding N.V. | Illumination system |
JP4828248B2 (ja) * | 2006-02-16 | 2011-11-30 | 新光電気工業株式会社 | 発光装置及びその製造方法 |
KR100930171B1 (ko) * | 2006-12-05 | 2009-12-07 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 백색 광원 모듈 |
US7940341B2 (en) * | 2007-08-23 | 2011-05-10 | Philips Lumileds Lighting Company | Light source for a projector |
US9086213B2 (en) * | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
CN101459163B (zh) * | 2007-12-12 | 2011-07-06 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管 |
CN101252163A (zh) * | 2008-03-27 | 2008-08-27 | 潮州三环(集团)股份有限公司 | 一种smd高功率led陶瓷封装基座 |
JP5320560B2 (ja) * | 2008-05-20 | 2013-10-23 | 東芝ライテック株式会社 | 光源ユニット及び照明装置 |
US20100181582A1 (en) * | 2009-01-22 | 2010-07-22 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof |
ES2625049T3 (es) * | 2010-03-31 | 2017-07-18 | Koninklijke Philips N.V. | Sistema de iluminación y unidad de fuente de luz para dicho sistema |
CN202004043U (zh) * | 2010-09-09 | 2011-10-05 | 张涛 | 贴片式白光led器件 |
JP2012094611A (ja) | 2010-10-26 | 2012-05-17 | Panasonic Corp | 照明装置 |
JP5548153B2 (ja) * | 2011-03-01 | 2014-07-16 | 株式会社ユーテクノロジー | 発光ダイオード照明装置および発光ダイオード照明用部材 |
US20140078378A1 (en) * | 2011-05-25 | 2014-03-20 | Obzerv Technologies Unc. | Active Imaging Device Having Field of View and Field of Illumination With Corresponding Rectangular Aspect Ratios |
JP5940878B2 (ja) * | 2012-04-27 | 2016-06-29 | ローム株式会社 | Ledフラッシュモジュール |
CN103000789B (zh) * | 2012-11-30 | 2015-08-19 | 惠州雷曼光电科技有限公司 | 贴片式led支架、贴片式led及贴片式led支架的成型方法 |
US9761765B2 (en) * | 2013-04-08 | 2017-09-12 | Koninklijke Philips N.V. | LED with high thermal conductivity particles in phosphor conversion layer |
CN105706529B (zh) * | 2013-10-02 | 2018-02-16 | 飞利浦灯具控股公司 | 照明系统和控制照明系统的方法 |
KR102020760B1 (ko) * | 2014-01-29 | 2019-09-11 | 루미리즈 홀딩 비.브이. | 캡슐화제로 채워지는 형광체-변환형 led 용의 얕은 반사기 컵 |
WO2015193807A1 (en) | 2014-06-17 | 2015-12-23 | Koninklijke Philips N.V. | A flash module containing an array of reflector cups for phosphor-converted leds |
-
2015
- 2015-06-16 WO PCT/IB2015/054539 patent/WO2015193807A1/en active Application Filing
- 2015-06-16 KR KR1020177001379A patent/KR102244461B1/ko active IP Right Grant
- 2015-06-16 CN CN201580032616.XA patent/CN106462033A/zh active Pending
- 2015-06-16 US US15/312,608 patent/US10649315B2/en active Active
- 2015-06-16 JP JP2016573842A patent/JP2017521702A/ja active Pending
- 2015-06-16 EP EP15745244.2A patent/EP3158393B1/en active Active
- 2015-06-16 CN CN201911309631.0A patent/CN111123620A/zh active Pending
- 2015-06-17 TW TW108112157A patent/TWI698694B/zh active
- 2015-06-17 TW TW109119210A patent/TWI751578B/zh active
- 2015-06-17 TW TW104119627A patent/TWI665505B/zh active
-
2020
- 2020-04-15 US US16/849,741 patent/US11320722B2/en active Active
-
2021
- 2021-04-05 JP JP2021063895A patent/JP2021114614A/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005091675A (ja) * | 2003-09-17 | 2005-04-07 | Pentax Corp | 発光装置 |
JP2005114924A (ja) * | 2003-10-06 | 2005-04-28 | Pentax Corp | 撮影用照明装置 |
JP2005164990A (ja) * | 2003-12-03 | 2005-06-23 | Pentax Corp | 照明機能付き撮影装置 |
JP2008513983A (ja) * | 2004-09-22 | 2008-05-01 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクスデバイス用ケーシング、オプトエレクトロニクスデバイスおよびオプトエレクトロニクスデバイスの製造方法 |
JP2007180520A (ja) * | 2005-10-25 | 2007-07-12 | Philips Lumileds Lightng Co Llc | 異なる補助光学素子を有する複合発光ダイオード |
JP2007266358A (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corp | 発光装置および照明装置 |
JP2011114096A (ja) * | 2009-11-25 | 2011-06-09 | Panasonic Electric Works Co Ltd | 照明装置 |
WO2013122722A1 (en) * | 2012-02-16 | 2013-08-22 | Qualcomm Mems Technologies, Inc. | Flash illumination system |
JP2014011359A (ja) * | 2012-06-29 | 2014-01-20 | Sharp Corp | 発光装置、照明装置および表示装置用バックライト |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11649945B2 (en) | 2020-01-23 | 2023-05-16 | Nichia Corporation | Light source device |
US11846412B2 (en) | 2020-01-23 | 2023-12-19 | Nichia Corporation | Light source device |
Also Published As
Publication number | Publication date |
---|---|
JP2021114614A (ja) | 2021-08-05 |
KR102244461B1 (ko) | 2021-04-26 |
US20200241391A1 (en) | 2020-07-30 |
TWI665505B (zh) | 2019-07-11 |
US11320722B2 (en) | 2022-05-03 |
TWI751578B (zh) | 2022-01-01 |
TWI698694B (zh) | 2020-07-11 |
CN111123620A (zh) | 2020-05-08 |
TW201947309A (zh) | 2019-12-16 |
US10649315B2 (en) | 2020-05-12 |
TW201614356A (en) | 2016-04-16 |
WO2015193807A1 (en) | 2015-12-23 |
EP3158393B1 (en) | 2021-02-24 |
CN106462033A (zh) | 2017-02-22 |
EP3158393A1 (en) | 2017-04-26 |
US20170184944A1 (en) | 2017-06-29 |
KR20170019446A (ko) | 2017-02-21 |
TW202034054A (zh) | 2020-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11320722B2 (en) | Flash module containing an array of reflector cups for phosphor-converted LEDs | |
US10564520B2 (en) | Thin LED flash for camera | |
US10062819B2 (en) | Shallow reflector cup for phosphor-converted LED filled with encapsulant | |
US20220102599A1 (en) | Deep molded reflector cup used as complete led package | |
JP6566791B2 (ja) | 発光装置 | |
JP2017050108A (ja) | 発光装置 | |
JP2017050343A (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170217 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180613 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20190307 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190425 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190514 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190813 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191119 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200217 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200402 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200512 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200722 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20201222 |