JP2017517137A - グラフェン系熱管理システム - Google Patents

グラフェン系熱管理システム Download PDF

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Publication number
JP2017517137A
JP2017517137A JP2016556314A JP2016556314A JP2017517137A JP 2017517137 A JP2017517137 A JP 2017517137A JP 2016556314 A JP2016556314 A JP 2016556314A JP 2016556314 A JP2016556314 A JP 2016556314A JP 2017517137 A JP2017517137 A JP 2017517137A
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Japan
Prior art keywords
electronic component
graphene
layer
coating layer
carbon nanoparticles
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Pending
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JP2016556314A
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English (en)
Japanese (ja)
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JP2017517137A5 (enExample
Inventor
アンジェラ ダブリュ． リー，
アンジェラ ダブリュ． リー，
ジェフリー エイチ． ハント，
ジェフリー エイチ． ハント，
ウェイン アール． ハウ，
ウェイン アール． ハウ，
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Boeing Co
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Boeing Co
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Publication date
Application filed by Boeing Co filed Critical Boeing Co
Publication of JP2017517137A publication Critical patent/JP2017517137A/ja
Publication of JP2017517137A5 publication Critical patent/JP2017517137A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2016556314A 2014-03-10 2015-02-23 グラフェン系熱管理システム Pending JP2017517137A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/202,451 US9930808B2 (en) 2014-03-10 2014-03-10 Graphene-based thermal management systems
US14/202,451 2014-03-10
PCT/US2015/017043 WO2015138110A1 (en) 2014-03-10 2015-02-23 Graphene-based thermal management systems

Publications (2)

Publication Number Publication Date
JP2017517137A true JP2017517137A (ja) 2017-06-22
JP2017517137A5 JP2017517137A5 (enExample) 2019-04-04

Family

ID=52633665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016556314A Pending JP2017517137A (ja) 2014-03-10 2015-02-23 グラフェン系熱管理システム

Country Status (4)

Country Link
US (1) US9930808B2 (enExample)
JP (1) JP2017517137A (enExample)
KR (1) KR20160130985A (enExample)
WO (1) WO2015138110A1 (enExample)

Cited By (1)

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WO2024024753A1 (ja) * 2022-07-26 2024-02-01 国立大学法人東海国立大学機構 蓄電デバイス用電極、二次電池、および、蓄電デバイス用電極の製造方法

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CN108347820B (zh) * 2017-01-25 2020-09-15 奥特斯(中国)有限公司 容纳部件的基底结构上的高导热涂层
US10814600B2 (en) 2017-11-16 2020-10-27 The Boeing Company Methods of and systems for forming coatings that comprise non-carbon-based topological insulators
US10405465B2 (en) * 2017-11-16 2019-09-03 The Boeing Company Topological insulator thermal management systems
US10987825B2 (en) 2017-11-16 2021-04-27 The Boeing Company Topological insulator nanotube device and methods of employing the nanotube device
US10887996B2 (en) 2017-11-16 2021-01-05 The Boeing Company Electronic components coated with a topological insulator
US10444883B2 (en) 2017-11-16 2019-10-15 The Boeing Company Touch screen display including topological insulators
US10845506B2 (en) 2017-11-16 2020-11-24 The Boeing Company Topological insulator protected optical elements
US10186351B1 (en) 2017-11-16 2019-01-22 The Boeing Company Topological insulator tubes applied to signal transmission systems
CN108298496B (zh) * 2018-03-13 2023-06-13 长春师范大学 一种基于光介电泳的石墨烯批量化装配方法
US12022642B2 (en) 2018-08-21 2024-06-25 Laird Technologies, Inc. Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes
US11181323B2 (en) * 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements
CN110143645B (zh) * 2019-05-17 2024-08-02 浙江大学 一种太阳能光热膜蒸馏装置
US11054592B2 (en) * 2019-11-24 2021-07-06 Applied Optoelectronics, Inc. Heatsink with graphene coating and an optical transmitter or transceiver implementing same
CN213862058U (zh) * 2020-04-09 2021-08-03 莱尔德技术股份有限公司 电磁干扰emi吸收体、雷达支架、汽车和汽车部件
WO2022061100A1 (en) * 2020-09-18 2022-03-24 Arris Enterprises Llc Method and system for small scale structures to improve thermal efficiency
US11940233B2 (en) 2021-01-21 2024-03-26 Cisco Technology, Inc. Graphene and carbon nanotube based thermal management device
CN119284827B (zh) * 2023-09-06 2025-07-08 浙江大学 纳米管阵列制备方法、纳米管阵列及器件

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JP2004067413A (ja) * 2002-08-02 2004-03-04 Nec Corp 触媒担持基板およびそれを用いたカーボンナノチューブの成長方法ならびにカーボンナノチューブを用いたトランジスタ
WO2009069684A1 (ja) * 2007-11-29 2009-06-04 Sumitomo Electric Industries, Ltd. 放熱構造、該放熱構造の製造方法及び該放熱構造を用いた放熱装置、ダイヤモンドヒートシンク、該ダイヤモンドヒートシンクの製造方法及び該ダイヤモンドヒートシンクを用いた放熱装置、並びに放熱方法
US20090213551A1 (en) * 2004-11-04 2009-08-27 Chris Wyland Integrated circuit nanotube-based structure
JP2009260238A (ja) * 2008-03-18 2009-11-05 Fujitsu Ltd シート状構造体及びその製造方法、並びに電子機器及びその製造方法
JP2010062333A (ja) * 2008-09-03 2010-03-18 Fujitsu Ltd 集積回路装置及びその製造方法
JP2010192780A (ja) * 2009-02-20 2010-09-02 Fujitsu Ltd 熱電変換素子
JP2011035046A (ja) * 2009-07-30 2011-02-17 Fujitsu Ltd シート状構造体及びその製造方法
JP2012502427A (ja) * 2008-09-08 2012-01-26 ナンヤン テクノロジカル ユニヴァーシティー 金属空気電池、燃料電池および超コンデンサー用の電極材料
JP2013232683A (ja) * 2013-07-24 2013-11-14 Fujitsu Ltd シート状構造体及びその製造方法
JP2013239623A (ja) * 2012-05-16 2013-11-28 Fujitsu Ltd シート状構造体、シート状構造体の製造方法、電子機器及び電子機器の製造方法

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WO2009107229A1 (ja) 2008-02-29 2009-09-03 富士通株式会社 シート状構造体、半導体装置及び炭素構造体の成長方法
US8106510B2 (en) 2009-08-04 2012-01-31 Raytheon Company Nano-tube thermal interface structure
US8263843B2 (en) 2009-11-06 2012-09-11 The Boeing Company Graphene nanoplatelet metal matrix
WO2011087301A2 (ko) 2010-01-15 2011-07-21 성균관대학교산학협력단 기체 및 수분 차단용 그래핀 보호막, 이의 형성 방법 및 그의 용도
US20110205688A1 (en) 2010-02-19 2011-08-25 Nthdegree Technologies Worldwide Inc. Multilayer Carbon Nanotube Capacitor
JP2012212706A (ja) 2011-03-30 2012-11-01 Tohoku Univ 半導体装置及びその製法において用いられるアモルファスカーボン膜の製造法
CN102794945B (zh) * 2011-05-27 2014-08-20 清华大学 石墨烯碳纳米管复合膜结构的制备方法
KR20130001705A (ko) 2011-06-27 2013-01-04 에스케이이노베이션 주식회사 그래핀/고분자 복합 보호막, 이의 제조 방법, 및 이의 용도
US9388513B2 (en) * 2011-07-01 2016-07-12 The University Of Kentucky Research Foundation Crystallographically-oriented carbon nanotubes grown on few-layer graphene films
JP2012136022A (ja) * 2012-01-04 2012-07-19 Jnc Corp 放熱部材、電子デバイスおよびバッテリー
CN102627003A (zh) 2012-02-13 2012-08-08 京东方科技集团股份有限公司 一种静电保护膜、显示装置和静电保护膜的制备方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004067413A (ja) * 2002-08-02 2004-03-04 Nec Corp 触媒担持基板およびそれを用いたカーボンナノチューブの成長方法ならびにカーボンナノチューブを用いたトランジスタ
US20090213551A1 (en) * 2004-11-04 2009-08-27 Chris Wyland Integrated circuit nanotube-based structure
WO2009069684A1 (ja) * 2007-11-29 2009-06-04 Sumitomo Electric Industries, Ltd. 放熱構造、該放熱構造の製造方法及び該放熱構造を用いた放熱装置、ダイヤモンドヒートシンク、該ダイヤモンドヒートシンクの製造方法及び該ダイヤモンドヒートシンクを用いた放熱装置、並びに放熱方法
JP2009260238A (ja) * 2008-03-18 2009-11-05 Fujitsu Ltd シート状構造体及びその製造方法、並びに電子機器及びその製造方法
JP2010062333A (ja) * 2008-09-03 2010-03-18 Fujitsu Ltd 集積回路装置及びその製造方法
JP2012502427A (ja) * 2008-09-08 2012-01-26 ナンヤン テクノロジカル ユニヴァーシティー 金属空気電池、燃料電池および超コンデンサー用の電極材料
JP2010192780A (ja) * 2009-02-20 2010-09-02 Fujitsu Ltd 熱電変換素子
JP2011035046A (ja) * 2009-07-30 2011-02-17 Fujitsu Ltd シート状構造体及びその製造方法
JP2013239623A (ja) * 2012-05-16 2013-11-28 Fujitsu Ltd シート状構造体、シート状構造体の製造方法、電子機器及び電子機器の製造方法
JP2013232683A (ja) * 2013-07-24 2013-11-14 Fujitsu Ltd シート状構造体及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024024753A1 (ja) * 2022-07-26 2024-02-01 国立大学法人東海国立大学機構 蓄電デバイス用電極、二次電池、および、蓄電デバイス用電極の製造方法

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Publication number Publication date
KR20160130985A (ko) 2016-11-15
WO2015138110A1 (en) 2015-09-17
US9930808B2 (en) 2018-03-27
US20150257308A1 (en) 2015-09-10

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