JP2017514556A5 - - Google Patents

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Publication number
JP2017514556A5
JP2017514556A5 JP2016559408A JP2016559408A JP2017514556A5 JP 2017514556 A5 JP2017514556 A5 JP 2017514556A5 JP 2016559408 A JP2016559408 A JP 2016559408A JP 2016559408 A JP2016559408 A JP 2016559408A JP 2017514556 A5 JP2017514556 A5 JP 2017514556A5
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JP
Japan
Prior art keywords
conductive contact
conductive
die
edge
contact plate
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JP2016559408A
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English (en)
Japanese (ja)
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JP6495322B2 (ja
JP2017514556A (ja
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Priority claimed from PCT/EP2015/057030 external-priority patent/WO2015150385A2/en
Publication of JP2017514556A publication Critical patent/JP2017514556A/ja
Publication of JP2017514556A5 publication Critical patent/JP2017514556A5/ja
Application granted granted Critical
Publication of JP6495322B2 publication Critical patent/JP6495322B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016559408A 2014-03-31 2015-03-31 Ｉｃダイ、超音波プローブ、超音波診断システム及び方法 Expired - Fee Related JP6495322B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14162615 2014-03-31
EP14162615.0 2014-03-31
PCT/EP2015/057030 WO2015150385A2 (en) 2014-03-31 2015-03-31 Ic die, ultrasound probe, ultrasonic diagnostic system and method

Publications (3)

Publication Number Publication Date
JP2017514556A JP2017514556A (ja) 2017-06-08
JP2017514556A5 true JP2017514556A5 (cg-RX-API-DMAC7.html) 2018-05-17
JP6495322B2 JP6495322B2 (ja) 2019-04-03

Family

ID=50439183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016559408A Expired - Fee Related JP6495322B2 (ja) 2014-03-31 2015-03-31 Ｉｃダイ、超音波プローブ、超音波診断システム及び方法

Country Status (4)

Country Link
US (1) US10586753B2 (cg-RX-API-DMAC7.html)
EP (1) EP3126065B1 (cg-RX-API-DMAC7.html)
JP (1) JP6495322B2 (cg-RX-API-DMAC7.html)
WO (1) WO2015150385A2 (cg-RX-API-DMAC7.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
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EP3519109B1 (en) * 2016-10-03 2023-12-06 Koninklijke Philips N.V. Intra-cardiac echocardiography interposer
EP3518774B1 (en) * 2016-10-03 2021-09-01 Koninklijke Philips N.V. Intraluminal imaging devices with a reduced number of signal channels
WO2018115226A1 (en) * 2016-12-22 2018-06-28 Koninklijke Philips N.V. Systems and methods of operation of capacitive radio frequency micro-electromechanical switches
US11109909B1 (en) * 2017-06-26 2021-09-07 Andreas Hadjicostis Image guided intravascular therapy catheter utilizing a thin ablation electrode
CN107172812B (zh) * 2017-07-13 2023-08-11 杭州士兰微电子股份有限公司 超声波传感器组件及制造方法
CN109472182B (zh) * 2017-09-08 2020-09-22 茂丞科技(深圳)有限公司 晶圆级超声波芯片规模制造及封装方法
EP3703874B1 (en) * 2017-10-31 2022-05-18 Koninklijke Philips N.V. Ultrasound scanner assembly
WO2021092416A1 (en) 2019-11-07 2021-05-14 Cornell University Conformal, non-occluding sensor array for cardiac mapping and ablation
US11540776B2 (en) 2020-03-20 2023-01-03 Xenter, Inc. Catheter for imaging and measurement of pressure and other physiologic parameters
EP4140263A4 (en) 2020-04-24 2024-06-26 Cornell University CATHETER-DEPLOYABLE SOFT ROBOTIC SENSOR NETWORKS AND FLEXIBLE CIRCUIT PROCESSING
IT202300014343A1 (it) * 2023-07-10 2025-01-10 St Microelectronics Int Nv Dispositivo trasduttore ultrasonico microlavorato ad elevato fattore di merito

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US3747202A (en) 1971-11-22 1973-07-24 Honeywell Inf Systems Method of making beam leads on substrates
WO1990015438A1 (en) 1989-06-08 1990-12-13 Unistructure, Inc. Beam lead and semiconductor device structure and method for fabricating integrated structure
US6283919B1 (en) 1996-11-26 2001-09-04 Atl Ultrasound Ultrasonic diagnostic imaging with blended tissue harmonic signals
US6458083B1 (en) 1996-11-26 2002-10-01 Koninklijke Philips Electronics N.V. Ultrasonic harmonic imaging with adaptive image formation
EP0901164A2 (en) * 1997-09-05 1999-03-10 Lsi Logic Corporation Integrated circuit packaging method, packaging apparatus, and package
US6013032A (en) 1998-03-13 2000-01-11 Hewlett-Packard Company Beamforming methods and apparatus for three-dimensional ultrasound imaging using two-dimensional transducer array
US5997479A (en) 1998-05-28 1999-12-07 Hewlett-Packard Company Phased array acoustic systems with intra-group processors
JP4651153B2 (ja) 1999-10-28 2011-03-16 ローム株式会社 半導体装置
FR2801971B1 (fr) * 1999-12-07 2002-02-15 St Microelectronics Sa Emetteur et recepteur acoustiques integres, et procede de fabrication correspondant
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