JP2017514556A - Icダイ、超音波プローブ、超音波診断システム及び方法 - Google Patents
Icダイ、超音波プローブ、超音波診断システム及び方法 Download PDFInfo
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- JP2017514556A JP2017514556A JP2016559408A JP2016559408A JP2017514556A JP 2017514556 A JP2017514556 A JP 2017514556A JP 2016559408 A JP2016559408 A JP 2016559408A JP 2016559408 A JP2016559408 A JP 2016559408A JP 2017514556 A JP2017514556 A JP 2017514556A
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Abstract
Description
Claims (15)
- ICダイの少なくとも1つの縁部によって画定された主面を有する当該ICダイであって、前記主面が、キャビティ内に前記ICダイを懸架するための複数の導電性コンタクトプレートを担持し、各導電性コンタクトプレートが、本体の少なくとも1つの更なる縁部にある更なる導電性接触面部分と対合するため前記少なくとも1つの縁部によって画定された露出された接触面部分を含むように、前記複数の導電性コンタクトプレートは、前記少なくとも1つの縁部を越えて前記主面から延び、前記少なくとも1つの更なる縁部が、前記ICダイを受けるための前記キャビティを画定する、ICダイ。
- 前記主面が超音波検知領域を更に備える、請求項1に記載のICダイ。
- 前記超音波検知領域は、複数の微細加工された静電容量型トランスデューサ(CMUT)要素によって画定される、請求項2に記載のICダイ。
- 前記主面は、複数のボンドパッドを備え、前記各導電性コンタクトプレートが前記ボンドパッドの1つから延びる、請求項1乃至3の何れか一項に記載のICダイ。
- 前記導電性コンタクトプレートは、金属又は金属合金から形成される、請求項1乃至4の何れか一項に記載のICダイ。
- 前記金属又は前記金属合金は、反磁性である、請求項5に記載のICダイ。
- 前記導電性コンタクトプレートは、少なくとも20ミクロンの厚さを有する、請求項1乃至6の何れか一項に記載のICダイ。
- 請求項2乃至7の何れか一項に記載のICダイを含む先端と、前記ICダイを備える前記キャビティを画定する少なくとも1つの更なる縁部を有する本体とを備える超音波プローブであって、前記少なくとも1つの更なる縁部が、複数の第1の更なる導電性接触面を備え、各第1の更なる導電性接触面が、前記導電性コンタクトプレートの1つの接触面部分に導電結合される、超音波プローブ。
- 前記各第1の更なる導電性接触面が、導電性はんだ又は導電性接着剤によって前記導電性コンタクトプレートの1つの接触面部分に導電結合される、請求項8に記載の超音波プローブ。
- 前記本体がフレックスフォイル上に複数の導電性トラックを含む当該フレックスフォイルを備え、各導電性トラックが、前記第1の更なる接触面の1つを含む、請求項8又は9に記載の超音波プローブ。
- 前記先端は、信号処理回路構成入力に導電結合された複数の回路基板コンタクトを担持するプリント回路基板上に当該信号処理回路構成を更に収容し、前記フレックスフォイルは、前記ICダイを収容する環状区域と、前記環状区域から延びる弧状区域とを備え、前記弧状区域は、対向する縁部の対を備え、各縁部が、複数の第2の更なる導電性接触面を備え、各第2の更なる導電性接触面が、前記導電性トラックの1つの一部を形成し、前記各第2の更なる導電性接触面が、前記回路基板コンタクトの1つに導電結合される、請求項10に記載の超音波プローブ。
- 請求項8乃至11の何れか一項に記載の超音波プローブを備える、超音波診断システム。
- ICダイにコンタクトを提供する方法であって、当該方法は、
複数のICダイを備えるウェハを提供するステップであって、各ICダイが、複数の導電性コンタクトを担持する主面を備え、前記ICダイが、犠牲領域によって互いから空間的に分離される、ステップと、
それぞれの前記主面のキャビティ内に前記ICダイを懸架するための導電性コンタクトプレートを形成するステップであって、前記導電性コンタクトプレートのそれぞれが、前記導電性コンタクトの1つから前記犠牲領域の1つに延在する、ステップと、
前記各ICダイの前記主面が前記ICダイの少なくとも1つの縁部によって画定されるように、前記犠牲領域を除去することによって前記ICダイをシンギュレーションするステップとを含み、
各導電性コンタクトプレートが、本体の少なくとも1つの更なる縁部にある更なる導電性接触面部分と対合するため前記少なくとも1つの縁部によって画定された露出された接触面部分を含むように、前記導電性コンタクトプレートが、前記主面から前記少なくとも1つの縁部を越えて延在し、前記少なくとも1つの更なる縁部が、前記ICダイを受けるための前記キャビティを画定する、方法。 - 前記導電性コンタクトプレートを前記それぞれの主面上に形成するステップは、前記それぞれの主面上に導電性材料をめっきすることによって、少なくとも20ミクロンの厚さに導電性コンタクトプレートを形成するステップを含む、請求項13に記載の方法。
- 前記それぞれの主面に複数のトレンチを形成するステップを更に含み、各トレンチは、前記導電性コンタクトの1つから前記犠牲領域の1つに延在し、前記導電性コンタクトプレートを前記それぞれの主面上に形成するステップは、前記トレンチに導電性材料を充填するステップを含む、請求項13又は14に記載の方法。
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PCT/EP2015/057030 WO2015150385A2 (en) | 2014-03-31 | 2015-03-31 | Ic die, ultrasound probe, ultrasonic diagnostic system and method |
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EP3519109B1 (en) * | 2016-10-03 | 2023-12-06 | Koninklijke Philips N.V. | Intra-cardiac echocardiography interposer |
WO2018065254A1 (en) * | 2016-10-03 | 2018-04-12 | Koninklijke Philips N.V. | Intraluminal imaging devices with a reduced number of signal channels |
US11864947B2 (en) * | 2016-12-22 | 2024-01-09 | Koninklijke Philips N.V. | Systems and methods of operation of capacitive radio frequency micro-electromechanical switches |
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