JP6878546B2 - 同軸ワイヤアセンブリ - Google Patents
同軸ワイヤアセンブリ Download PDFInfo
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- JP6878546B2 JP6878546B2 JP2019190035A JP2019190035A JP6878546B2 JP 6878546 B2 JP6878546 B2 JP 6878546B2 JP 2019190035 A JP2019190035 A JP 2019190035A JP 2019190035 A JP2019190035 A JP 2019190035A JP 6878546 B2 JP6878546 B2 JP 6878546B2
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- ultrasonic transducer
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
- A61B8/445—Details of catheter construction
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/515—Terminal blocks providing connections to wires or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Heart & Thoracic Surgery (AREA)
- Surgery (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Biomedical Technology (AREA)
- Physics & Mathematics (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Biophysics (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Gynecology & Obstetrics (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Cable Accessories (AREA)
Description
Claims (2)
- 超音波トランスデューサアセンブリと直接嵌合される同軸ワイヤアセンブリであって、
それぞれが電気絶縁スリーブによって被覆された導電性コアを有する複数の同軸ワイヤと、
第1の主表面と、第2の主表面と、それぞれが第1の主表面から第2の主表面まで延びる複数のスルーホールであって、前記スルーホールのそれぞれが電気伝導性部材で被覆されている、複数のスルーホールと、を有する電気絶縁本体と、を含み、
各同軸ワイヤが、前記第1の主表面から前記スルーホールの1つに取り付けられている、露出した末端コア部を含み、各スルーホールは前記第2の主表面上の半田バンプによって密封され、前記末端コア部は、前記スルーホール内で前記電気伝導性部材に電気的に接続されるように、前記スルーホール内に半田で固定され、前記半田バンプは、前記半田の一部で形成されている、同軸ワイヤアセンブリ。 - 前記同軸ワイヤを収容する可撓性管状本体を更に含み、前記電気絶縁本体は前記可撓性管状本体の端部部分に取り付けられている、請求項1に記載の同軸ワイヤアセンブリ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021075645A JP2021129996A (ja) | 2014-07-17 | 2021-04-28 | 超音波トランスデューサ装置及びアセンブリ、同軸ワイヤアセンブリ、超音波プローブ並びに超音波イメージングシステム |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14177454 | 2014-07-17 | ||
EP14177454.7 | 2014-07-17 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017501646A Division JP6670292B2 (ja) | 2014-07-17 | 2015-06-25 | 超音波トランスデューサアセンブリ、超音波プローブ及び超音波イメージングシステム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021075645A Division JP2021129996A (ja) | 2014-07-17 | 2021-04-28 | 超音波トランスデューサ装置及びアセンブリ、同軸ワイヤアセンブリ、超音波プローブ並びに超音波イメージングシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020032199A JP2020032199A (ja) | 2020-03-05 |
JP6878546B2 true JP6878546B2 (ja) | 2021-05-26 |
Family
ID=51211086
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017501646A Active JP6670292B2 (ja) | 2014-07-17 | 2015-06-25 | 超音波トランスデューサアセンブリ、超音波プローブ及び超音波イメージングシステム |
JP2019190035A Active JP6878546B2 (ja) | 2014-07-17 | 2019-10-17 | 同軸ワイヤアセンブリ |
JP2021075645A Pending JP2021129996A (ja) | 2014-07-17 | 2021-04-28 | 超音波トランスデューサ装置及びアセンブリ、同軸ワイヤアセンブリ、超音波プローブ並びに超音波イメージングシステム |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017501646A Active JP6670292B2 (ja) | 2014-07-17 | 2015-06-25 | 超音波トランスデューサアセンブリ、超音波プローブ及び超音波イメージングシステム |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021075645A Pending JP2021129996A (ja) | 2014-07-17 | 2021-04-28 | 超音波トランスデューサ装置及びアセンブリ、同軸ワイヤアセンブリ、超音波プローブ並びに超音波イメージングシステム |
Country Status (5)
Country | Link |
---|---|
US (2) | US10828673B2 (ja) |
EP (2) | EP3169448A1 (ja) |
JP (3) | JP6670292B2 (ja) |
CN (1) | CN106536068B (ja) |
WO (1) | WO2016008690A1 (ja) |
Families Citing this family (22)
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US11325828B2 (en) * | 2013-02-22 | 2022-05-10 | Vibrant Composites Inc. | High-volume millimeter scale manufacturing |
US10814352B2 (en) * | 2014-05-06 | 2020-10-27 | Koninklijke Philips N.V. | Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods |
EP3169448A1 (en) * | 2014-07-17 | 2017-05-24 | Koninklijke Philips N.V. | Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system |
US20170055948A1 (en) * | 2015-08-27 | 2017-03-02 | Tyco Electronics Corporation | Probe assembly and system including a modular device and a cable assembly |
WO2017182344A1 (en) * | 2016-04-19 | 2017-10-26 | Koninklijke Philips N.V. | Ultrasound transducer positioning |
WO2018060061A1 (en) * | 2016-09-29 | 2018-04-05 | Koninklijke Philips N.V. | Guide member for electrical cable alignment and attachment and associated intraluminal devices, systems, and methods |
US11963823B2 (en) | 2016-10-03 | 2024-04-23 | Koninklijke Philips N.V. | Radiopaque arrangement of electronic components in intra-cardiac echocardiography (ICE) catheter |
US10088642B2 (en) | 2016-11-09 | 2018-10-02 | International Business Machines Corporation | Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture |
GB2555835B (en) * | 2016-11-11 | 2018-11-28 | Novosound Ltd | Ultrasound transducer |
WO2018132443A1 (en) * | 2017-01-10 | 2018-07-19 | The Regents Of The University Of California | Stretchable ultrasonic transducer devices |
EP3369383A1 (en) | 2017-03-02 | 2018-09-05 | Koninklijke Philips N.V. | Ultrasound device |
US10504843B2 (en) | 2017-05-02 | 2019-12-10 | L. Pierre de Rochemont | High speed semiconductor chip stack |
WO2019002231A1 (en) * | 2017-06-30 | 2019-01-03 | Koninklijke Philips N.V. | INTRALUMINAL ULTRASONIC IMAGING DEVICE COMPRISING A SUBSTRATE SEPARATED IN A PLURALITY OF SPACED SEGMENTS, INTRALUMINAL ULTRASONIC IMAGING DEVICE COMPRISING A TRENCH, AND METHOD OF MANUFACTURING |
CN111447878B (zh) * | 2017-12-08 | 2024-01-02 | 皇家飞利浦有限公司 | 用于腔内超声成像装置的具有集成窗口的卷式柔性衬底 |
EP3749213B1 (en) * | 2018-02-09 | 2023-11-08 | Koninklijke Philips N.V. | Flexible support member for intraluminal imaging device and associated devices, systems, and methods |
CN109031259A (zh) * | 2018-07-24 | 2018-12-18 | 常州波速传感器有限公司 | 超声波探头 |
CN111447533B (zh) * | 2019-01-16 | 2021-05-18 | 昆山康龙电子科技有限公司 | 利用金属料带成型的内部模块 |
US11679975B2 (en) | 2019-07-24 | 2023-06-20 | Vermon Sa | Panel transducer scale package and method of manufacturing the same |
CA3153080A1 (en) * | 2019-10-10 | 2021-04-15 | Sunnybrook Research Institute | SYSTEMS AND METHODS FOR COOLING ULTRASOUND TRANSDUCERS AND ULTRASOUND TRANSDUCER ARRAYS |
US11207140B2 (en) * | 2019-12-18 | 2021-12-28 | GE Precision Healthcare LLC | Ultrasound-enabled invasive medical device and method of manufacturing an ultrasound-enabled invasive medical device |
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2015
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CN106536068A (zh) | 2017-03-22 |
US10828673B2 (en) | 2020-11-10 |
US20210031234A1 (en) | 2021-02-04 |
EP3169448A1 (en) | 2017-05-24 |
US20170209898A1 (en) | 2017-07-27 |
JP2020032199A (ja) | 2020-03-05 |
CN106536068B (zh) | 2020-06-05 |
JP6670292B2 (ja) | 2020-03-18 |
WO2016008690A1 (en) | 2016-01-21 |
JP2021129996A (ja) | 2021-09-09 |
JP2017528178A (ja) | 2017-09-28 |
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