JP6495322B2 - Icダイ、超音波プローブ、超音波診断システム及び方法 - Google Patents
Icダイ、超音波プローブ、超音波診断システム及び方法 Download PDFInfo
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- JP6495322B2 JP6495322B2 JP2016559408A JP2016559408A JP6495322B2 JP 6495322 B2 JP6495322 B2 JP 6495322B2 JP 2016559408 A JP2016559408 A JP 2016559408A JP 2016559408 A JP2016559408 A JP 2016559408A JP 6495322 B2 JP6495322 B2 JP 6495322B2
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- H01L23/4821—Bridge structure with air gap
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
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- A—HUMAN NECESSITIES
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
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- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
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- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
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- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/05666—Titanium [Ti] as principal constituent
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/05686—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2224/05687—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/0614—Circular array, i.e. array with radial symmetry
- H01L2224/06141—Circular array, i.e. array with radial symmetry being uniform, i.e. having a uniform pitch across the array
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/206—Length ranges
- H01L2924/2064—Length ranges larger or equal to 1 micron less than 100 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/206—Length ranges
- H01L2924/20641—Length ranges larger or equal to 100 microns less than 200 microns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Medical Informatics (AREA)
- Veterinary Medicine (AREA)
- Heart & Thoracic Surgery (AREA)
- Radiology & Medical Imaging (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
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- Public Health (AREA)
- Biomedical Technology (AREA)
- Pathology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Biophysics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Gynecology & Obstetrics (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14162615 | 2014-03-31 | ||
| EP14162615.0 | 2014-03-31 | ||
| PCT/EP2015/057030 WO2015150385A2 (en) | 2014-03-31 | 2015-03-31 | Ic die, ultrasound probe, ultrasonic diagnostic system and method |
Publications (3)
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| JP2017514556A JP2017514556A (ja) | 2017-06-08 |
| JP2017514556A5 JP2017514556A5 (cg-RX-API-DMAC7.html) | 2018-05-17 |
| JP6495322B2 true JP6495322B2 (ja) | 2019-04-03 |
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| JP7096237B2 (ja) * | 2016-10-03 | 2022-07-05 | コーニンクレッカ フィリップス エヌ ヴェ | 信号チャネル数が少ない管腔内撮像デバイス |
| WO2018065425A1 (en) * | 2016-10-03 | 2018-04-12 | Koninklijke Philips N.V. | Intra-cardiac echocardiography interposer |
| US11864947B2 (en) * | 2016-12-22 | 2024-01-09 | Koninklijke Philips N.V. | Systems and methods of operation of capacitive radio frequency micro-electromechanical switches |
| US11109909B1 (en) * | 2017-06-26 | 2021-09-07 | Andreas Hadjicostis | Image guided intravascular therapy catheter utilizing a thin ablation electrode |
| CN107172812B (zh) * | 2017-07-13 | 2023-08-11 | 杭州士兰微电子股份有限公司 | 超声波传感器组件及制造方法 |
| CN109472182B (zh) * | 2017-09-08 | 2020-09-22 | 茂丞科技(深圳)有限公司 | 晶圆级超声波芯片规模制造及封装方法 |
| WO2019086496A1 (en) * | 2017-10-31 | 2019-05-09 | Koninklijke Philips N.V. | Ultrasound scanner assembly |
| US12005159B2 (en) | 2019-11-07 | 2024-06-11 | Cornell University | Conformal, non-occluding sensor array for cardiac mapping and ablation |
| US11540776B2 (en) | 2020-03-20 | 2023-01-03 | Xenter, Inc. | Catheter for imaging and measurement of pressure and other physiologic parameters |
| US12285260B2 (en) | 2020-04-24 | 2025-04-29 | Cornell University | Catheter-deployable soft robotic sensor arrays and processing of flexible circuits |
| IT202300014343A1 (it) * | 2023-07-10 | 2025-01-10 | St Microelectronics Int Nv | Dispositivo trasduttore ultrasonico microlavorato ad elevato fattore di merito |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3747202A (en) * | 1971-11-22 | 1973-07-24 | Honeywell Inf Systems | Method of making beam leads on substrates |
| WO1990015438A1 (en) * | 1989-06-08 | 1990-12-13 | Unistructure, Inc. | Beam lead and semiconductor device structure and method for fabricating integrated structure |
| US6283919B1 (en) | 1996-11-26 | 2001-09-04 | Atl Ultrasound | Ultrasonic diagnostic imaging with blended tissue harmonic signals |
| US6458083B1 (en) | 1996-11-26 | 2002-10-01 | Koninklijke Philips Electronics N.V. | Ultrasonic harmonic imaging with adaptive image formation |
| EP0901164A2 (en) | 1997-09-05 | 1999-03-10 | Lsi Logic Corporation | Integrated circuit packaging method, packaging apparatus, and package |
| US6013032A (en) | 1998-03-13 | 2000-01-11 | Hewlett-Packard Company | Beamforming methods and apparatus for three-dimensional ultrasound imaging using two-dimensional transducer array |
| US5997479A (en) | 1998-05-28 | 1999-12-07 | Hewlett-Packard Company | Phased array acoustic systems with intra-group processors |
| JP4651153B2 (ja) * | 1999-10-28 | 2011-03-16 | ローム株式会社 | 半導体装置 |
| FR2801971B1 (fr) * | 1999-12-07 | 2002-02-15 | St Microelectronics Sa | Emetteur et recepteur acoustiques integres, et procede de fabrication correspondant |
| US6530885B1 (en) | 2000-03-17 | 2003-03-11 | Atl Ultrasound, Inc. | Spatially compounded three dimensional ultrasonic images |
| US6443896B1 (en) | 2000-08-17 | 2002-09-03 | Koninklijke Philips Electronics N.V. | Method for creating multiplanar ultrasonic images of a three dimensional object |
| US6468216B1 (en) | 2000-08-24 | 2002-10-22 | Kininklijke Philips Electronics N.V. | Ultrasonic diagnostic imaging of the coronary arteries |
| WO2004073101A2 (en) | 2003-02-11 | 2004-08-26 | Oplink Communications, Inc. | Suspended and truncated coplanar waveguide |
| JP5133680B2 (ja) | 2004-03-15 | 2013-01-30 | ジョージア・テック・リサーチ・コーポレーション | 微小電気機械システム用のパッケージングおよびその製造方法 |
| US7545075B2 (en) * | 2004-06-04 | 2009-06-09 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same |
| US8658453B2 (en) * | 2004-09-15 | 2014-02-25 | Sonetics Ultrasound, Inc. | Capacitive micromachined ultrasonic transducer |
| WO2006046471A1 (ja) | 2004-10-27 | 2006-05-04 | Olympus Corporation | 静電容量型超音波振動子及びその体腔内超音波診断システム |
| CA2607885A1 (en) | 2005-05-18 | 2006-11-23 | Kolo Technologies, Inc. | Through-wafer interconnection |
| JP2006332799A (ja) * | 2005-05-23 | 2006-12-07 | Matsushita Electric Works Ltd | 音響センサ |
| FR2903811B1 (fr) | 2006-07-12 | 2008-08-29 | Commissariat Energie Atomique | Dispositif electronique comprenant des composants electroniques relies a un substrat et mutuellement connectes et procede de fabrication d'un tel dispositif |
| WO2009073752A1 (en) * | 2007-12-03 | 2009-06-11 | Kolo Technologies, Inc. | Ultrasound scanner built with capacitive micromachined ultrasonic transducers (cmuts) |
| WO2009073692A1 (en) | 2007-12-03 | 2009-06-11 | Kolo Technologies, Inc. | Packaging and connecting electrostatic transducer arrays |
| US20110071396A1 (en) * | 2008-05-15 | 2011-03-24 | Hitachi Medical Corporation | Ultrasonic probe, method for manufacturing the same and ultrasonic diagnostic apparatus |
| US8743082B2 (en) | 2010-10-18 | 2014-06-03 | Qualcomm Mems Technologies, Inc. | Controller architecture for combination touch, handwriting and fingerprint sensor |
| RU2603435C2 (ru) | 2011-10-17 | 2016-11-27 | Конинклейке Филипс Н.В. | Устройство с переходными отверстиями в подложке и способ его производства |
| JP2013226390A (ja) * | 2012-03-31 | 2013-11-07 | Canon Inc | 探触子、及びそれを用いた被検体情報取得装置 |
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| US20170136496A1 (en) | 2017-05-18 |
| US10586753B2 (en) | 2020-03-10 |
| EP3126065B1 (en) | 2021-05-19 |
| EP3126065A2 (en) | 2017-02-08 |
| JP2017514556A (ja) | 2017-06-08 |
| WO2015150385A3 (en) | 2016-05-19 |
| WO2015150385A2 (en) | 2015-10-08 |
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