JP2017513239A - セグメント化npn垂直バイポーラトランジスタ - Google Patents
セグメント化npn垂直バイポーラトランジスタ Download PDFInfo
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- 229910021332 silicide Inorganic materials 0.000 claims abstract description 89
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 89
- 239000002184 metal Substances 0.000 claims abstract description 85
- 229910052751 metal Inorganic materials 0.000 claims abstract description 85
- 239000004065 semiconductor Substances 0.000 claims abstract description 57
- 230000011218 segmentation Effects 0.000 claims abstract description 18
- 239000010953 base metal Substances 0.000 claims abstract 7
- 238000009792 diffusion process Methods 0.000 claims description 16
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 8
- 229920005591 polysilicon Polymers 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000036039 immunity Effects 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000012217 deletion Methods 0.000 description 6
- 230000037430 deletion Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0259—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
- H01L27/0823—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
- H01L27/0825—Combination of vertical direct transistors of the same conductivity type having different characteristics,(e.g. Darlington transistors)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0804—Emitter regions of bipolar transistors
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41708—Emitter or collector electrodes for bipolar transistors
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
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Abstract
Description
Claims (18)
- セグメント化されたバイポーラトランジスタであって、
半導体表面を有する基板、
前記半導体表面におけるpベースであって、前記pベースが少なくとも一つのpベースフィンガーを含み、前記pベースフィンガーがベース金属/シリサイドスタックを含み、前記ベース金属/シリサイドスタックが、前記pベースフィンガーの前記半導体表面上のシリサイド層に接するベース金属ラインを含む、前記pベース、
前記半導体表面における前記pベースの下のn+埋め込み層、
コレクタであって、前記コレクタが、前記半導体表面から前記n+埋め込み層まで延在する前記pベースの横のn+シンカー拡散を含み、前記n+シンカー拡散がコレクタフィンガーを含み、前記コレクタフィンガーがコレクタ金属/シリサイドスタックを含み、前記コレクタ金属/シリサイドスタックが、前記コレクタフィンガーの前記半導体表面上のシリサイド層に接するコレクタ金属ラインを含む、前記コレクタ、及び
前記pベースの一部内のn+エミッタであって、前記n+エミッタが、少なくとも一つのエミッタフィンガーを含み、前記エミッタフィンガーがエミッタ金属/シリサイドスタックを含み、前記エミッタ金属/シリサイドスタックが、前記エミッタフィンガーの前記半導体表面上のシリサイド層に接するエミッタ金属ラインを含む、前記n+エミッタ、
を含み、
前記エミッタ金属/シリサイドスタックがセグメント化を含み、当該セグメント化が、前記エミッタ金属ラインにおける、或いは、前記エミッタの前記半導体表面上の前記シリサイド層におけるエミッタギャップを含み、又は前記コレクタ金属/シリサイドスタックがセグメント化を含み、当該セグメント化が、前記コレクタ金属ラインにおける、又は前記コレクタフィンガーの前記半導体表面上の前記シリサイド層におけるコレクタギャップを含む、
トランジスタ。 - 請求項1に記載のトランジスタであって、電流を前記エミッタギャップを介して前記エミッタの前記半導体表面に流すために、前記エミッタギャップが、前記エミッタ金属ラインにおける前記エミッタギャップの下にある前記エミッタの前記半導体表面上の前記エミッタ金属ライン及び前記シリサイド層両方を介する、トランジスタ。
- 請求項2に記載のトランジスタであって、電流を前記コレクタギャップを介して前記コレクタの前記半導体表面に流すために、前記コレクタギャップが、前記コレクタ金属ラインにおける前記コレクタギャップの下にある前記コレクタの前記半導体表面上の前記コレクタ金属ライン及び前記シリサイド層両方にある、トランジスタ。
- 請求項1に記載のトランジスタであって、前記少なくとも一つのベースフィンガーが複数のベースフィンガーを含み、前記少なくとも一つのエミッタフィンガーが、前記複数のベースフィンガーと互いに組み合わされる複数のエミッタフィンガーを含む、トランジスタ。
- 請求項1に記載のトランジスタであって、前記エミッタと直列のエミッタ減衰抵抗器を更に含む、トランジスタ。
- 請求項5に記載のトランジスタであって、前記エミッタ減衰抵抗器が、前記半導体表面上の能動エリアの或る領域に直接的に接する、ドープされたポリシリコンを含む、トランジスタ。
- 請求項1に記載のトランジスタであって、直列にスタックされる前記セグメント化されたバイポーラトランジスタのアレイを更に含み、前記セグメント化が、前記アレイを介する横方向電流フロー経路に対する耐性を付加するように配置される、トランジスタ。
- 請求項1に記載のトランジスタであって、前記半導体表面がシリコンを含む、トランジスタ。
- 請求項1に記載のトランジスタであって、前記半導体表面がシリコン/ゲルマニウムを含み、前記基板がシリコンを含む、トランジスタ。
- 集積回路(IC)であって、
半導体表面を有する基板、
或る機能性を実現及び実施するように構成される前記半導体表面を用いて形成され、少なくとも第1の端子及び接地端子を含む複数の端子を有する、機能性回路要素、及び
前記半導体表面に形成される前記ICのための静電放電(ESD)保護デバイスとして構成される少なくとも一つのセグメント化されたバイポーラトランジスタ、
を含み、
前記セグメント化されたバイポーラトランジスタが、
前記半導体表面におけるpベースであって、前記pベースが少なくとも一つのベース金属/シリサイドスタックを含み、前記ベース金属/シリサイドスタックが、前記pベースフィンガーの前記半導体表面上のシリサイド層に接するベース金属ラインを含む、前記pベースと、
前記半導体表面における前記pベースの下のn+埋め込み層と、
コレクタであって、前記コレクタが、前記半導体表面から前記n+埋め込み層まで延在する前記pベースの横のn+シンカー拡散を含み、前記シンカー拡散がコレクタフィンガーを含み、前記コレクタフィンガーがコレクタ金属/シリサイドスタックを含み、前記コレクタ金属/シリサイドスタックが、前記コレクタフィンガーの前記半導体表面上のシリサイド層に接するコレクタ金属ラインを含む、前記コレクタと、
前記pベースの一部内のn+エミッタであって、前記n+エミッタが、少なくとも一つのエミッタフィンガーを含み、前記エミッタフィンガーがエミッタ金属/シリサイドスタックを含み、前記エミッタ金属/シリサイドスタックが、前記エミッタフィンガーの前記半導体表面上のシリサイド層に接するエミッタ金属ラインを含む、前記n+エミッタと、
を含み、
前記エミッタ金属/シリサイドスタックがセグメント化を含み、当該セグメント化が、前記エミッタ金属ラインにおける、又は前記エミッタの前記半導体表面上の前記シリサイド層におけるエミッタギャップを含み、或いは、前記コレクタ金属/シリサイドスタックがセグメント化を含み、当該セグメント化が、前記コレクタ金属ラインにおける、又は前記コレクタフィンガーの前記半導体表面上の前記シリサイド層におけるコレクタギャップを含む、
IC。 - 請求項10に記載のICであって、電流を前記エミッタギャップを介して前記エミッタの前記半導体表面に流すために、前記エミッタギャップが、前記エミッタ金属ラインにおける前記エミッタギャップの下にある前記エミッタの前記半導体表面上の前記エミッタ金属ライン及び前記シリサイド層両方を介する、IC。
- 請求項11に記載のICであって、電流を前記コレクタギャップを介して前記コレクタの前記半導体表面に流すために、前記コレクタギャップが、前記コレクタ金属ラインにおける前記コレクタギャップの下にある前記コレクタの前記半導体表面上の前記コレクタ金属ライン及び前記シリサイド層両方にある、IC。
- 請求項11に記載のICであって、前記少なくとも一つのベースフィンガーが複数のベースフィンガーを含み、前記少なくとも一つのエミッタフィンガーが、前記複数のベースフィンガーと互いに組み合わされる複数の前記エミッタフィンガーを含む、IC。
- 請求項10に記載のICであって、前記エミッタと直列のエミッタ減衰抵抗器を更に含む、IC。
- 請求項14に記載のICであって、前記エミッタ減衰抵抗器が、前記半導体表面上の能動エリアの或る領域に直接的に接する、ドープされたポリシリコンを含む、IC。
- 請求項10に記載のICであって、直列にスタックされる前記セグメント化されたバイポーラトランジスタのアレイを更に含み、前記セグメント化が、前記アレイを介する横方向電流フロー経路に対する耐性を付加するように配置される、IC。
- 請求項10に記載のICであって、前記半導体表面がシリコンを含む、IC。
- 請求項10に記載のICであって、前記半導体表面がシリコン/ゲルマニウムを含み、前記基板がシリコンを含む、IC。
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US14/222,288 | 2014-03-21 | ||
US14/222,288 US9153569B1 (en) | 2014-03-21 | 2014-03-21 | Segmented NPN vertical bipolar transistor |
PCT/US2015/022030 WO2015143438A1 (en) | 2014-03-21 | 2015-03-23 | Segmented npn vertical bipolar transistor |
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JP2017513239A5 JP2017513239A5 (ja) | 2018-04-19 |
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JP (1) | JP6607917B2 (ja) |
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KR20210081753A (ko) * | 2019-12-24 | 2021-07-02 | 에스케이하이닉스 주식회사 | 반도체 장치 및 이의 테스트 방법 |
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CN106030808A (zh) | 2016-10-12 |
US9153569B1 (en) | 2015-10-06 |
EP3120386A1 (en) | 2017-01-25 |
EP3120386A4 (en) | 2017-11-08 |
US20150270256A1 (en) | 2015-09-24 |
CN106030808B (zh) | 2020-06-16 |
WO2015143438A1 (en) | 2015-09-24 |
JP6607917B2 (ja) | 2019-11-20 |
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