JP2017502487A5 - - Google Patents

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Publication number
JP2017502487A5
JP2017502487A5 JP2016563243A JP2016563243A JP2017502487A5 JP 2017502487 A5 JP2017502487 A5 JP 2017502487A5 JP 2016563243 A JP2016563243 A JP 2016563243A JP 2016563243 A JP2016563243 A JP 2016563243A JP 2017502487 A5 JP2017502487 A5 JP 2017502487A5
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JP
Japan
Prior art keywords
conductive
layer
electronic component
component
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2016563243A
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English (en)
Japanese (ja)
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JP2017502487A (ja
JP6356264B2 (ja
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Publication date
Priority claimed from DK201470011A external-priority patent/DK178014B1/da
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Publication of JP2017502487A publication Critical patent/JP2017502487A/ja
Publication of JP2017502487A5 publication Critical patent/JP2017502487A5/ja
Application granted granted Critical
Publication of JP6356264B2 publication Critical patent/JP6356264B2/ja
Active legal-status Critical Current
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JP2016563243A 2014-01-10 2015-01-08 少なくとも１つの電子部品を備えた構成部材、及び、これに関連した方法 Active JP6356264B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DKPA201470011 2014-01-10
DK201470011A DK178014B1 (en) 2014-01-10 2014-01-10 Construction element with at least one electronic component
PCT/DK2015/050001 WO2015104024A1 (en) 2014-01-10 2015-01-08 Construction element with at least one electronic component and associated method

Publications (3)

Publication Number Publication Date
JP2017502487A JP2017502487A (ja) 2017-01-19
JP2017502487A5 true JP2017502487A5 (enExample) 2018-02-08
JP6356264B2 JP6356264B2 (ja) 2018-07-11

Family

ID=52282364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016563243A Active JP6356264B2 (ja) 2014-01-10 2015-01-08 少なくとも１つの電子部品を備えた構成部材、及び、これに関連した方法

Country Status (9)

Country Link
US (2) US9874339B2 (enExample)
EP (2) EP3094923B1 (enExample)
JP (1) JP6356264B2 (enExample)
CN (2) CN108105595B (enExample)
BR (1) BR112016016028B1 (enExample)
DK (2) DK178014B1 (enExample)
RU (1) RU2664952C2 (enExample)
SG (1) SG11201605586VA (enExample)
WO (1) WO2015104024A1 (enExample)

Families Citing this family (11)

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US11230338B2 (en) 2012-03-28 2022-01-25 Salvaggio Jr David Integrated electronic component in vehicle body
WO2017042206A1 (en) * 2015-09-07 2017-03-16 Beaulieu International Group Nv Covering panel comprising a lighting system
CN108700284B (zh) * 2016-01-11 2021-01-01 莱德爱邦德国际股份有限公司 供电模块
CN205807211U (zh) 2016-06-20 2016-12-14 冯霞 用于容器的发光装置
EP3532772B1 (en) * 2016-10-31 2022-05-11 LED iBond International A/S Electrical supply system
WO2019210926A1 (en) * 2018-05-02 2019-11-07 Led Ibond International Aps Coupling unit attached to a composite board
WO2021108463A1 (en) * 2019-11-25 2021-06-03 Electronic Theatre Controls, Inc. Light module aperture for printed circuit board integration
WO2021170194A1 (en) 2020-02-26 2021-09-02 LED iBond International A/S Air transport unit
EP4165345A1 (en) * 2020-06-11 2023-04-19 Signify Holding B.V. Lamp or luminaire comprising a led module
EP4305676A1 (en) 2021-03-09 2024-01-17 Baldr Light ApS A light emitting device
EP4405613B8 (en) 2021-09-20 2025-12-17 LED iBond International A/S An led plug

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DE19911860A1 (de) * 1999-03-17 2000-12-28 Werner Vidoni Beleuchtbare Dekorationsplatte
CN2414585Y (zh) * 2000-01-07 2001-01-10 神达电脑股份有限公司 多层印刷电路板的噪音抑制装置
US6540373B2 (en) * 2001-03-29 2003-04-01 Bendrix L. Bailey Lighting system
US6888537B2 (en) * 2002-02-13 2005-05-03 Siemens Technology-To-Business Center, Llc Configurable industrial input devices that use electrically conductive elastomer
TWM271254U (en) * 2004-09-10 2005-07-21 Sen Tech Co Ltd Heat dissipation base and package structure for light-emitting diode
US7543956B2 (en) * 2005-02-28 2009-06-09 Philips Solid-State Lighting Solutions, Inc. Configurations and methods for embedding electronics or light emitters in manufactured materials
EP1841013A1 (de) * 2006-03-30 2007-10-03 Ueli Egger Beleuchtungseinrichtung
EP1876389A1 (en) * 2006-07-05 2008-01-09 LiteCorp Europe B.V. Lighting system for a display apparatus
WO2008071787A1 (de) * 2006-12-15 2008-06-19 Fritz Egger Gmbh & Co. Bauteil mit mindestens einem leuchtmittel
US7687823B2 (en) * 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
DE102008024776A1 (de) * 2007-09-28 2009-11-26 Osram Gesellschaft mit beschränkter Haftung Leuchtmittel mit magnetischer Haftung
DK176818B1 (da) 2007-12-17 2009-10-26 Ledlumina Technology As Adapter med mindst en elektroniske komponent
US7547924B1 (en) * 2007-12-31 2009-06-16 Chien-Feng Lin Light-emitting diode structure
JP5492899B2 (ja) * 2008-10-10 2014-05-14 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 分配型照明システム
CN101610624A (zh) * 2009-06-25 2009-12-23 常熟市瑞特电器有限责任公司 舰船电子彩灯控制装置
CN201628107U (zh) * 2010-01-29 2010-11-10 深圳市长运通集成电路设计有限公司 一种led发光装置
AU2011245060B2 (en) * 2010-04-26 2015-07-16 Organic Response Ab Illumination apparatus methods and systems
US20150199314A1 (en) 2010-10-26 2015-07-16 Google Inc. Editing Application For Synthesized eBooks
EP2485342A3 (en) 2011-01-27 2014-06-11 Scanled IPR ApS A construction panel and a method of attaching a light emitter thereto
KR101804892B1 (ko) * 2011-04-14 2017-12-06 엘지디스플레이 주식회사 발광다이오드어셈블리 및 그를 포함한 액정표시장치
DE102011101805B4 (de) * 2011-05-17 2016-08-25 Fela Holding Gmbh Schaltungsträger
CN202365446U (zh) * 2011-11-30 2012-08-08 陆建益 热能保健桌垫
WO2013117198A1 (en) * 2012-02-08 2013-08-15 Scanled Ipr Aps An assembly of a construction panel and a light emitting diode
CN202536071U (zh) * 2012-03-14 2012-11-21 福建中烟工业有限责任公司 一种滚筒筒壁电加热装置
CN203327291U (zh) * 2013-04-03 2013-12-04 中国计量学院 一种基于电力载波通信的led氛围灯

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