CN103855146A - Led灯丝及照明器具 - Google Patents

Led灯丝及照明器具 Download PDF

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CN103855146A
CN103855146A CN201410014267.6A CN201410014267A CN103855146A CN 103855146 A CN103855146 A CN 103855146A CN 201410014267 A CN201410014267 A CN 201410014267A CN 103855146 A CN103855146 A CN 103855146A
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substrate
bonding area
led filament
crystal bonding
led
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CN103855146B (zh
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游志
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Shenzhen Refond Optoelectronics Co Ltd
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Shenzhen Refond Optoelectronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

本发明适用于照明技术领域，提供了一种LED灯丝及照明器具，所述LED灯丝包括第一基板、与所述第一基板背靠背贴合的第二基板和荧光胶，所述第一基板和第二基板中间部分均为固晶区，多个LED芯片设于所述固晶区，由所述荧光胶完全包覆固晶区及LED芯片。这种结构的LED灯丝正面和背面均可发光，如此可彻底解决现有灯丝产品正面、背面光色不一致的问题。因而，本LED灯丝可广泛应用于各种照明器具。

Description

LED灯丝及照明器具
技术领域
本发明属于照明技术领域，尤其涉及一种LED灯丝及照明器具。
背景技术
目前，LED灯丝产品由BT板或是FR4，金属基板等不透明基板制成，点亮后往往会在基板背面存在暗区，光色一致性差，影响照明效果。
发明内容
本发明实施例的目的在于提供一种LED灯丝，旨在解决现有LED灯丝光色一致性差的问题。
本发明实施例是这样实现的，一种LED灯丝，包括第一基板、与所述第一基板背靠背贴合的第二基板和荧光胶，所述第一基板和第二基板中间部分均为固晶区，多个LED芯片设于所述固晶区，由所述荧光胶完全包覆固晶区及LED芯片。
本发明实施例的另一目的在于提供一种照明器具，所述照明器具采用上述LED灯丝。
本发明实施例先于两块基板的固晶区分别固焊LED芯片，接着使它们背靠背相互贴合成一体化，然后成型完全包覆各面固晶区及LED芯片的荧光胶。这种结构的LED灯丝正面和背面均可发光，如此可彻底解决现有灯丝产品正面、背面光色不一致的问题。因而，本LED灯丝可广泛应用于各种照明器具。
附图说明
图1是本发明实施例提供的LED灯丝的结构示意图；
图2是图1A-A截面示意图；
图3是灯丝基板的结构示意图；
图4是大块基板的结构示意图；
图5是由塑胶件衔接固晶区和焊接区的结构示意图；
图6是图5B-B剖面图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明实施例先于两块基板的固晶区分别固焊LED芯片，接着使它们背靠背相互贴合成一体化，然后成型完全包覆各面固晶区及LED芯片的荧光胶。这种结构的LED灯丝正面和背面均可发光，如此可彻底解决现有灯丝产品正面、背面光色不一致的问题。
以下结合具体实施例对本发明的实现进行详细描述。
如图1～3所示，本发明实施例提供的LED灯丝包括第一基板1、与所述第一基板1背靠背贴合的第二基板2和荧光胶4，所述第一基板1和第二基板2中间部分均为固晶区11，多个LED芯片3设于所述固晶区11，由所述荧光胶4完全包覆固晶区11及LED芯片3。其中，所述第一基板1和第二基板2为BT板或是FR4，金属基板等不透明基板。这种结构的LED灯丝正面及背面均可发光，如此可彻底解决现有灯丝产品背面光色与正面光色不一致的问题。
如图4所示，本发明实施例先通过机械加工、化学蚀刻或是其它成型方法对大块基板5进行加工，使之成型出多个平行排列的灯丝基板，即前述第一基板或第二基板。此处还可单独由固化后的塑胶件16对所述固晶区较小端14及与所述固晶区断开的焊接区12进行衔接，使所述固晶区较小端14位于缺口13的中部，从而断开的正、负极衔接在一起，如图5、6所示。所述第一基板或第二基板嵌在该塑胶件16中，可以是部分或全部包裹在塑胶中，如此保证正、负极位置相对稳定，在断开处不易断裂，同时提高了基板的整体强度。其中，所述塑胶件16可以由透明的或是其它有色塑胶（如热塑或是热固性材质）制成。接着，于各灯丝基板的固晶区11设计使LED芯片3与外部电气互联的线路，并于各固晶区11设置多个LED芯片3。固焊所述LED芯片3后，将两大块基板5背靠背贴合在一起。然后，通过注塑或是模压等工艺成型所述荧光胶2，使之全包裹LED芯片3以及固晶区11（即固晶区所在的部分基板），从而实现类似白炽灯发光效果。最后，切割出各LED灯丝。
通常，所述LED灯丝既可以是双边单电极，也可以是单边双电极，设计灵活。如图1、3所示，本实施例提供的LED灯丝采取双边单电极样式，其中所述第一基板1和第二基板2两端均为焊接区12，所述固晶区11有一端与焊接区12断开，如此可将本LED灯丝的正、负极断开，而且对整个基板破坏较小。当然，所述固晶区11两端均与相应的焊接区12断开亦可。
其中，与所述固晶区11断开的焊接区12设一缺口13，所述固晶区较小端14容置于该缺口13，如图1、3、4所示。在此通过所述荧光胶2定位固晶区较小端14与缺口13，使之分开一定距离，且相互平行。此结构设计，于所述荧光胶2成型固化后，增强了所述固晶区11与焊接区12的断开处的连接强度，进一步提升本LED灯丝的可靠性。
为增强扣胶力，保证所述荧光胶2与基板结合强度，于所述焊接区12靠近固晶区11的端部设用以填充荧光胶的通孔15。该增加的通孔15减小了所述荧光胶溢胶的面积，亦可缩短所述荧光胶在基板表面溢胶的距离。作为优选，所述通孔15仅靠近固晶区11的部分被荧光胶所填充，这样既可达到前述效果，又可节省了所述荧光胶。所述大块基板5的表面镀有银膜或金膜，以此增强本LED灯丝光取出率。其中，所述荧光胶2为混合有荧光粉的热固性材料（如硅胶、环氧树脂），其横截面可成型为方形、圆形或椭圆形。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (8)

1.一种LED灯丝，其特征在于，包括第一基板、与所述第一基板背靠背贴合的第二基板和荧光胶，所述第一基板和第二基板中间部分均为固晶区，多个LED芯片设于所述固晶区，由所述荧光胶完全包覆固晶区及LED芯片。
2.如权利要求1所述的LED灯丝，其特征在于，所述第一基板和第二基板两端均为焊接区，所述固晶区至少有一端与焊接区断开。
3.如权利要求2所述的LED灯丝，其特征在于，与所述固晶区断开的焊接区设一缺口，所述固晶区较小端容置于该缺口。
4.如权利要求3所述的LED灯丝，其特征在于，由固化后的塑胶件对所述固晶区较小端及与所述固晶区断开的焊接区进行衔接，使所述固晶区较小端位于缺口的中部，从而断开基板的正、负极。
5.如权利要求3所述的LED灯丝，其特征在于，所述焊接区靠近固晶区的端部设用以填充荧光胶的通孔。
6.如权利要求1～5中任一项所述的LED灯丝，其特征在于，所述基板表面镀有银膜或金膜。
7.如权利要求6所述的LED灯丝，其特征在于，所述荧光胶的横截面为方形、圆形或椭圆形。
8.一种照明器具，其特征在于，所述照明器具采用如权利要求1～7中任一项所述的LED灯丝。
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EP3086371A1 (en) * 2015-04-20 2016-10-26 Everlight Electronics Co., Ltd Light emitting module
CN107887369A (zh) * 2016-09-30 2018-04-06 王定锋 一种led双色灯条及制作方法
CN110379802A (zh) * 2019-07-23 2019-10-25 济南南知信息科技有限公司 一种led全塑封结构及其塑封工艺

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CN110379802A (zh) * 2019-07-23 2019-10-25 济南南知信息科技有限公司 一种led全塑封结构及其塑封工艺

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