CN103413805B - 可调光led灯丝制造工艺 - Google Patents
可调光led灯丝制造工艺 Download PDFInfo
- Publication number
- CN103413805B CN103413805B CN201310383732.9A CN201310383732A CN103413805B CN 103413805 B CN103413805 B CN 103413805B CN 201310383732 A CN201310383732 A CN 201310383732A CN 103413805 B CN103413805 B CN 103413805B
- Authority
- CN
- China
- Prior art keywords
- led chip
- transparency carrier
- chip array
- led
- lamp filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310383732.9A CN103413805B (zh) | 2013-08-29 | 2013-08-29 | 可调光led灯丝制造工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310383732.9A CN103413805B (zh) | 2013-08-29 | 2013-08-29 | 可调光led灯丝制造工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103413805A CN103413805A (zh) | 2013-11-27 |
CN103413805B true CN103413805B (zh) | 2016-09-14 |
Family
ID=49606803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310383732.9A Expired - Fee Related CN103413805B (zh) | 2013-08-29 | 2013-08-29 | 可调光led灯丝制造工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103413805B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103855146B (zh) * | 2014-01-13 | 2017-01-25 | 深圳市瑞丰光电子股份有限公司 | Led灯丝及照明器具 |
CN103956357B (zh) * | 2014-05-06 | 2016-09-28 | 佛山市国星光电股份有限公司 | 一种led灯丝的制造方法 |
CN105674108A (zh) * | 2016-03-24 | 2016-06-15 | 海宁博华照明电器有限公司 | 新型led灯 |
CN106382609B (zh) * | 2016-10-18 | 2023-05-30 | 南昌大学 | 一种led灯丝条 |
CN107388066A (zh) * | 2017-08-23 | 2017-11-24 | 福建鸿博光电科技有限公司 | 一种多色温led软灯丝及灯具 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202796937U (zh) * | 2012-07-09 | 2013-03-13 | 江阴浩瀚光电科技有限公司 | 可调色温模组芯片 |
CN103219329A (zh) * | 2013-03-21 | 2013-07-24 | 歌尔声学股份有限公司 | 发光二极管装置及其制造方法 |
CN103236485A (zh) * | 2013-04-16 | 2013-08-07 | 哈尔滨奥瑞德光电技术股份有限公司 | 一种在蓝宝石透明导热板上制作发光体的方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7999283B2 (en) * | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
-
2013
- 2013-08-29 CN CN201310383732.9A patent/CN103413805B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202796937U (zh) * | 2012-07-09 | 2013-03-13 | 江阴浩瀚光电科技有限公司 | 可调色温模组芯片 |
CN103219329A (zh) * | 2013-03-21 | 2013-07-24 | 歌尔声学股份有限公司 | 发光二极管装置及其制造方法 |
CN103236485A (zh) * | 2013-04-16 | 2013-08-07 | 哈尔滨奥瑞德光电技术股份有限公司 | 一种在蓝宝石透明导热板上制作发光体的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103413805A (zh) | 2013-11-27 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Wu Maoqing Inventor after: Lin Xie Inventor before: Ma Wenbo Inventor before: Wang Jianquan Inventor before: Liang Li Inventor before: Chen Ke |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170414 Address after: 515065 Shantou, Longhu Province Wan Ji industrial zone, Wan Ji North Street, No. 2 Patentee after: Shantou super time light source Co., Ltd. Address before: Tak Road 629000 in Sichuan province Suining City Economic Development Zone Patentee before: Sichuan Bonshine Optical Electron Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160914 Termination date: 20190829 |