DK3094923T3 - Konstruktionselement med mindst én elektronisk komponent og tilhørende fremgangsmåde - Google Patents

Konstruktionselement med mindst én elektronisk komponent og tilhørende fremgangsmåde Download PDF

Info

Publication number
DK3094923T3
DK3094923T3 DK15700004.3T DK15700004T DK3094923T3 DK 3094923 T3 DK3094923 T3 DK 3094923T3 DK 15700004 T DK15700004 T DK 15700004T DK 3094923 T3 DK3094923 T3 DK 3094923T3
Authority
DK
Denmark
Prior art keywords
electronic component
construction element
associated procedure
procedure
construction
Prior art date
Application number
DK15700004.3T
Other languages
English (en)
Inventor
Lars Frederiksen
Original Assignee
Led Ibond Int A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Led Ibond Int A/S filed Critical Led Ibond Int A/S
Application granted granted Critical
Publication of DK3094923T3 publication Critical patent/DK3094923T3/da

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2121/00—Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2121/008—Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00 for simulation of a starry sky or firmament
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Civil Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DK15700004.3T 2014-01-10 2015-01-08 Konstruktionselement med mindst én elektronisk komponent og tilhørende fremgangsmåde DK3094923T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK201470011A DK178014B1 (en) 2014-01-10 2014-01-10 Construction element with at least one electronic component
PCT/DK2015/050001 WO2015104024A1 (en) 2014-01-10 2015-01-08 Construction element with at least one electronic component and associated method

Publications (1)

Publication Number Publication Date
DK3094923T3 true DK3094923T3 (da) 2022-02-07

Family

ID=52282364

Family Applications (2)

Application Number Title Priority Date Filing Date
DK201470011A DK178014B1 (en) 2014-01-10 2014-01-10 Construction element with at least one electronic component
DK15700004.3T DK3094923T3 (da) 2014-01-10 2015-01-08 Konstruktionselement med mindst én elektronisk komponent og tilhørende fremgangsmåde

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DK201470011A DK178014B1 (en) 2014-01-10 2014-01-10 Construction element with at least one electronic component

Country Status (9)

Country Link
US (2) US9874339B2 (da)
EP (2) EP3553375B1 (da)
JP (1) JP6356264B2 (da)
CN (2) CN105899873B (da)
BR (1) BR112016016028B1 (da)
DK (2) DK178014B1 (da)
RU (1) RU2664952C2 (da)
SG (1) SG11201605586VA (da)
WO (1) WO2015104024A1 (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11230338B2 (en) * 2012-03-28 2022-01-25 Salvaggio Jr David Integrated electronic component in vehicle body
WO2017042206A1 (en) * 2015-09-07 2017-03-16 Beaulieu International Group Nv Covering panel comprising a lighting system
WO2017121430A1 (en) * 2016-01-11 2017-07-20 Led Ibond International Aps Electrical supply module
CN205807211U (zh) 2016-06-20 2016-12-14 冯霞 用于容器的发光装置
EP3532772B1 (en) * 2016-10-31 2022-05-11 LED iBond International A/S Electrical supply system
WO2019210926A1 (en) * 2018-05-02 2019-11-07 Led Ibond International Aps Coupling unit attached to a composite board
DE112020004042T5 (de) * 2019-11-25 2022-08-18 Electronic Theatre Controls, Inc. Lichtmodulöffnung zur leiterplattenintegration
WO2021170194A1 (en) 2020-02-26 2021-09-02 LED iBond International A/S Air transport unit
US11959619B2 (en) * 2020-06-11 2024-04-16 Signify Holding B.V. Lamp or luminaire comprising a LED module
US20240162384A1 (en) 2021-03-09 2024-05-16 Baldr Light Aps A light emitting device
WO2023041136A1 (en) * 2021-09-20 2023-03-23 LED iBond International A/S An led plug

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DE19911860A1 (de) * 1999-03-17 2000-12-28 Werner Vidoni Beleuchtbare Dekorationsplatte
CN2414585Y (zh) * 2000-01-07 2001-01-10 神达电脑股份有限公司 多层印刷电路板的噪音抑制装置
US6540373B2 (en) * 2001-03-29 2003-04-01 Bendrix L. Bailey Lighting system
US6888537B2 (en) * 2002-02-13 2005-05-03 Siemens Technology-To-Business Center, Llc Configurable industrial input devices that use electrically conductive elastomer
TWM271254U (en) * 2004-09-10 2005-07-21 Sen Tech Co Ltd Heat dissipation base and package structure for light-emitting diode
US7543956B2 (en) * 2005-02-28 2009-06-09 Philips Solid-State Lighting Solutions, Inc. Configurations and methods for embedding electronics or light emitters in manufactured materials
EP1841013A1 (de) * 2006-03-30 2007-10-03 Ueli Egger Beleuchtungseinrichtung
EP1876389A1 (en) * 2006-07-05 2008-01-09 LiteCorp Europe B.V. Lighting system for a display apparatus
PT2102548T (pt) * 2006-12-15 2016-12-20 Fritz Egger Gmbh & Co Og Componente que tem pelo menos uma fonte de luz
US7687823B2 (en) * 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
DE102008024776A1 (de) * 2007-09-28 2009-11-26 Osram Gesellschaft mit beschränkter Haftung Leuchtmittel mit magnetischer Haftung
DK176818B1 (da) * 2007-12-17 2009-10-26 Ledlumina Technology As Adapter med mindst en elektroniske komponent
US7547924B1 (en) * 2007-12-31 2009-06-16 Chien-Feng Lin Light-emitting diode structure
WO2010042216A2 (en) * 2008-10-10 2010-04-15 Digital Optics International, Llc Distributed illumination system
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CN201628107U (zh) * 2010-01-29 2010-11-10 深圳市长运通集成电路设计有限公司 一种led发光装置
BR112012027425A2 (pt) * 2010-04-26 2017-08-08 Organic Response Pty Ltd aparelho para iluminação contralada, sistema para controlar a operação de uma pluralidade de fontes e métodos de controle de uma pluralidade de fontes de luz
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KR101804892B1 (ko) * 2011-04-14 2017-12-06 엘지디스플레이 주식회사 발광다이오드어셈블리 및 그를 포함한 액정표시장치
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WO2013117198A1 (en) * 2012-02-08 2013-08-15 Scanled Ipr Aps An assembly of a construction panel and a light emitting diode
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Also Published As

Publication number Publication date
CN105899873A (zh) 2016-08-24
EP3553375B1 (en) 2023-06-07
CN108105595A (zh) 2018-06-01
JP2017502487A (ja) 2017-01-19
WO2015104024A1 (en) 2015-07-16
RU2664952C2 (ru) 2018-08-23
CN105899873B (zh) 2018-01-16
EP3094923B1 (en) 2021-11-10
BR112016016028B1 (pt) 2022-05-17
JP6356264B2 (ja) 2018-07-11
US9587812B2 (en) 2017-03-07
US20160334086A1 (en) 2016-11-17
RU2016130791A (ru) 2018-02-16
US20150198314A1 (en) 2015-07-16
DK178014B1 (en) 2015-03-09
EP3553375A1 (en) 2019-10-16
RU2016130791A3 (da) 2018-07-30
SG11201605586VA (en) 2016-08-30
EP3553375C0 (en) 2023-06-07
EP3094923A1 (en) 2016-11-23
BR112016016028A2 (da) 2017-08-08
CN108105595B (zh) 2020-12-25
US9874339B2 (en) 2018-01-23

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