JP2017220543A5 - - Google Patents

Download PDF

Info

Publication number
JP2017220543A5
JP2017220543A5 JP2016113277A JP2016113277A JP2017220543A5 JP 2017220543 A5 JP2017220543 A5 JP 2017220543A5 JP 2016113277 A JP2016113277 A JP 2016113277A JP 2016113277 A JP2016113277 A JP 2016113277A JP 2017220543 A5 JP2017220543 A5 JP 2017220543A5
Authority
JP
Japan
Prior art keywords
insulating layer
resin
cover
layer
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016113277A
Other languages
English (en)
Japanese (ja)
Other versions
JP6594264B2 (ja
JP2017220543A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016113277A priority Critical patent/JP6594264B2/ja
Priority claimed from JP2016113277A external-priority patent/JP6594264B2/ja
Priority to US15/477,414 priority patent/US9997474B2/en
Publication of JP2017220543A publication Critical patent/JP2017220543A/ja
Publication of JP2017220543A5 publication Critical patent/JP2017220543A5/ja
Application granted granted Critical
Publication of JP6594264B2 publication Critical patent/JP6594264B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016113277A 2016-06-07 2016-06-07 配線基板及び半導体装置、並びにそれらの製造方法 Active JP6594264B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016113277A JP6594264B2 (ja) 2016-06-07 2016-06-07 配線基板及び半導体装置、並びにそれらの製造方法
US15/477,414 US9997474B2 (en) 2016-06-07 2017-04-03 Wiring board and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016113277A JP6594264B2 (ja) 2016-06-07 2016-06-07 配線基板及び半導体装置、並びにそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2017220543A JP2017220543A (ja) 2017-12-14
JP2017220543A5 true JP2017220543A5 (OSRAM) 2019-01-17
JP6594264B2 JP6594264B2 (ja) 2019-10-23

Family

ID=60483874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016113277A Active JP6594264B2 (ja) 2016-06-07 2016-06-07 配線基板及び半導体装置、並びにそれらの製造方法

Country Status (2)

Country Link
US (1) US9997474B2 (OSRAM)
JP (1) JP6594264B2 (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6661232B2 (ja) * 2016-03-01 2020-03-11 新光電気工業株式会社 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法
WO2020000414A1 (en) * 2018-06-29 2020-01-02 Intel Corporation Coupling mechanisms for substrates, semiconductor packages, and/or printed circuit boards
JP7289620B2 (ja) * 2018-09-18 2023-06-12 新光電気工業株式会社 配線基板、積層型配線基板、半導体装置
WO2020060265A1 (ko) * 2018-09-20 2020-03-26 주식회사 엘지화학 다층인쇄회로기판, 이의 제조방법 및 이를 이용한 반도체 장치
KR102257926B1 (ko) 2018-09-20 2021-05-28 주식회사 엘지화학 다층인쇄회로기판, 이의 제조방법 및 이를 이용한 반도체 장치
WO2020067320A1 (ja) * 2018-09-27 2020-04-02 株式会社村田製作所 樹脂多層基板
JP7269755B2 (ja) * 2019-02-26 2023-05-09 ローム株式会社 電子装置および電子装置の製造方法
JP7459492B2 (ja) * 2019-11-29 2024-04-02 大日本印刷株式会社 配線基板
DE102021120241B4 (de) * 2020-11-10 2025-03-20 Taiwan Semiconductor Manufacturing Co., Ltd. Packagestruktur, halbleitervorrichtung und verfahren zu deren herstellung
JP7694883B2 (ja) * 2021-08-30 2025-06-18 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000133946A (ja) * 1997-01-17 2000-05-12 Ibiden Co Ltd 多層プリント配線板
JP2001358248A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd キャパシタを内蔵した回路基板とその製造方法
US8502398B2 (en) * 2007-10-05 2013-08-06 Shinko Electric Industries Co., Ltd. Wiring board, semiconductor apparatus and method of manufacturing them
JP4975581B2 (ja) * 2007-10-11 2012-07-11 新光電気工業株式会社 配線基板及びその製造方法
JP5295596B2 (ja) * 2008-03-19 2013-09-18 新光電気工業株式会社 多層配線基板およびその製造方法
JP5101451B2 (ja) 2008-10-03 2012-12-19 新光電気工業株式会社 配線基板及びその製造方法
JP5675443B2 (ja) * 2011-03-04 2015-02-25 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP5990421B2 (ja) * 2012-07-20 2016-09-14 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
JP5662551B1 (ja) * 2013-12-20 2015-01-28 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP6170832B2 (ja) * 2013-12-20 2017-07-26 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP6324876B2 (ja) * 2014-07-16 2018-05-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP6358887B2 (ja) * 2014-07-31 2018-07-18 新光電気工業株式会社 支持体、配線基板及びその製造方法、半導体パッケージの製造方法

Similar Documents

Publication Publication Date Title
JP2017220543A5 (OSRAM)
JP2017510828A5 (OSRAM)
JP2014197522A5 (ja) 発光装置
JP2013533605A5 (OSRAM)
JP2016029161A5 (OSRAM)
JP2011091297A5 (OSRAM)
JP2013095809A5 (OSRAM)
JP2014504663A5 (OSRAM)
JP2014179457A5 (OSRAM)
PH12018500798B1 (en) First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip
SG10201401166YA (en) Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof
MY184907A (en) Metal foil, metal foil having release layer, laminated material, printed wiring board, semiconductor package, electronic device, and method for producing printed wiring board
JP2016207959A5 (OSRAM)
JP2015153811A5 (OSRAM)
JP2017228734A5 (OSRAM)
JP2014208764A5 (OSRAM)
KR20180084674A (ko) 감광성 필름 적층체 및 그것을 사용하여 형성된 경화물
JP2018125378A5 (OSRAM)
JP2012248370A5 (OSRAM)
JP2016031889A5 (OSRAM)
JP2010232230A5 (OSRAM)
JP2017112146A5 (OSRAM)
MY205698A (en) Cover film and electronic component package using same
JP2018136522A5 (OSRAM)
JP2016147924A5 (OSRAM)