JP2017208530A5 - - Google Patents

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Publication number
JP2017208530A5
JP2017208530A5 JP2017056833A JP2017056833A JP2017208530A5 JP 2017208530 A5 JP2017208530 A5 JP 2017208530A5 JP 2017056833 A JP2017056833 A JP 2017056833A JP 2017056833 A JP2017056833 A JP 2017056833A JP 2017208530 A5 JP2017208530 A5 JP 2017208530A5
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JP
Japan
Prior art keywords
polishing
groove
supply
polishing pad
radial
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JP2017056833A
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English (en)
Japanese (ja)
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JP6993090B2 (ja
JP2017208530A (ja
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Priority claimed from US15/079,824 external-priority patent/US10875146B2/en
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Publication of JP2017208530A5 publication Critical patent/JP2017208530A5/ja
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JP2017056833A 2016-03-24 2017-03-23 Ｃｍｐ研磨パッドのための研磨くず除去溝 Active JP6993090B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/079,824 2016-03-24
US15/079,824 US10875146B2 (en) 2016-03-24 2016-03-24 Debris-removal groove for CMP polishing pad

Publications (3)

Publication Number Publication Date
JP2017208530A JP2017208530A (ja) 2017-11-24
JP2017208530A5 true JP2017208530A5 (https=) 2020-04-16
JP6993090B2 JP6993090B2 (ja) 2022-01-13

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ID=59886174

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JP2017056833A Active JP6993090B2 (ja) 2016-03-24 2017-03-23 Ｃｍｐ研磨パッドのための研磨くず除去溝

Country Status (6)

Country Link
US (1) US10875146B2 (https=)
JP (1) JP6993090B2 (https=)
KR (1) KR102363154B1 (https=)
CN (1) CN107225498A (https=)
FR (1) FR3049205B1 (https=)
TW (1) TWI773663B (https=)

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DE102017216033A1 (de) * 2017-09-12 2019-03-14 Carl Zeiss Smt Gmbh Verfahren zum Bearbeiten eines Werkstücks bei der Herstellung eines optischen Elements
CN108214285A (zh) * 2018-01-25 2018-06-29 成都时代立夫科技有限公司 一种化学机械抛光垫
JP7026942B2 (ja) * 2018-04-26 2022-03-01 丸石産業株式会社 研磨パッド用の下敷及び該下敷を使用する研磨方法
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
US20210263418A1 (en) * 2018-07-27 2021-08-26 Asml Netherlands B.V. Tool for modifying a support surface
KR101952829B1 (ko) * 2018-08-13 2019-02-27 최유섭 금속부품의 연마가공장치 및 이를 이용한 연마가공방법
JP7178662B2 (ja) * 2019-04-10 2022-11-28 パナソニックＩｐマネジメント株式会社 研磨装置および研磨方法
TWI771668B (zh) 2019-04-18 2022-07-21 美商應用材料股份有限公司 Cmp期間基於溫度的原位邊緣不對稱校正
WO2020255744A1 (ja) * 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
CN110732983A (zh) * 2019-10-30 2020-01-31 郑州伯利森新材料科技有限公司 一种硬脆材料加工用免修整超硬砂轮及其制备方法
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TWI797501B (zh) * 2019-11-22 2023-04-01 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
KR102746090B1 (ko) 2020-03-13 2024-12-26 삼성전자주식회사 Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
CN114496880B (zh) * 2020-10-26 2025-07-25 昆明物理研究所 一种化学抛光夹具
EP4382250A4 (en) * 2021-08-04 2025-06-11 Kuraray Co., Ltd. POLISHING CUSHION
KR102685134B1 (ko) * 2022-06-09 2024-07-15 케이피엑스케미칼 주식회사 개선된 연마속도를 갖는 연마패드 및 이를 포함하는 화학적 기계적 연마장치
KR102685136B1 (ko) * 2022-06-09 2024-07-15 케이피엑스케미칼 주식회사 개선된 연마속도를 갖는 연마패드 및 이를 포함하는 화학적 기계적 연마장치
KR20240105053A (ko) * 2022-12-28 2024-07-05 삼성전자주식회사 화학 기계적 연마 장치 및 이의 제어 방법
CN115972083A (zh) * 2023-01-05 2023-04-18 华虹半导体(无锡)有限公司 研磨垫
CN116276633B (zh) * 2023-02-13 2025-09-16 上海芯谦集成电路有限公司 一种具有透气孔的抛光垫
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JP2016124043A (ja) 2014-12-26 2016-07-11 東洋ゴム工業株式会社 研磨パッド

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