CN107225498A - 用于cmp抛光垫的碎屑移除凹槽 - Google Patents

用于cmp抛光垫的碎屑移除凹槽 Download PDF

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Publication number
CN107225498A
CN107225498A CN201710180712.XA CN201710180712A CN107225498A CN 107225498 A CN107225498 A CN 107225498A CN 201710180712 A CN201710180712 A CN 201710180712A CN 107225498 A CN107225498 A CN 107225498A
Authority
CN
China
Prior art keywords
polishing
groove
grooves
polishing pad
glassware
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710180712.XA
Other languages
English (en)
Chinese (zh)
Inventor
L·M·库克
Y·童
J·索
J·J·亨德伦
P·康奈尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROHM AND HAAS ELECTRONIC MATER
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=59886174&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN107225498(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by ROHM AND HAAS ELECTRONIC MATER filed Critical ROHM AND HAAS ELECTRONIC MATER
Publication of CN107225498A publication Critical patent/CN107225498A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN201710180712.XA 2016-03-24 2017-03-23 用于cmp抛光垫的碎屑移除凹槽 Pending CN107225498A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/079824 2016-03-24
US15/079,824 US10875146B2 (en) 2016-03-24 2016-03-24 Debris-removal groove for CMP polishing pad

Publications (1)

Publication Number Publication Date
CN107225498A true CN107225498A (zh) 2017-10-03

Family

ID=59886174

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710180712.XA Pending CN107225498A (zh) 2016-03-24 2017-03-23 用于cmp抛光垫的碎屑移除凹槽

Country Status (6)

Country Link
US (1) US10875146B2 (https=)
JP (1) JP6993090B2 (https=)
KR (1) KR102363154B1 (https=)
CN (1) CN107225498A (https=)
FR (1) FR3049205B1 (https=)
TW (1) TWI773663B (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108214285A (zh) * 2018-01-25 2018-06-29 成都时代立夫科技有限公司 一种化学机械抛光垫
CN110732983A (zh) * 2019-10-30 2020-01-31 郑州伯利森新材料科技有限公司 一种硬脆材料加工用免修整超硬砂轮及其制备方法
CN111805433A (zh) * 2019-04-10 2020-10-23 松下知识产权经营株式会社 研磨装置以及研磨方法
CN111867781A (zh) * 2018-04-26 2020-10-30 丸石产业株式会社 研磨垫用的衬底及使用该衬底的研磨方法
CN115972083A (zh) * 2023-01-05 2023-04-18 华虹半导体(无锡)有限公司 研磨垫
CN116276633A (zh) * 2023-02-13 2023-06-23 上海芯谦集成电路有限公司 一种具有透气孔的抛光垫

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DE102017216033A1 (de) * 2017-09-12 2019-03-14 Carl Zeiss Smt Gmbh Verfahren zum Bearbeiten eines Werkstücks bei der Herstellung eines optischen Elements
KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
US20210263418A1 (en) * 2018-07-27 2021-08-26 Asml Netherlands B.V. Tool for modifying a support surface
KR101952829B1 (ko) * 2018-08-13 2019-02-27 최유섭 금속부품의 연마가공장치 및 이를 이용한 연마가공방법
TWI771668B (zh) 2019-04-18 2022-07-21 美商應用材料股份有限公司 Cmp期間基於溫度的原位邊緣不對稱校正
WO2020255744A1 (ja) * 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
GB2590511B (en) * 2019-11-20 2023-10-25 Best Engineered Surface Tech Llc Hybrid CMP conditioning head
TWI797501B (zh) * 2019-11-22 2023-04-01 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
KR102746090B1 (ko) 2020-03-13 2024-12-26 삼성전자주식회사 Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
CN114496880B (zh) * 2020-10-26 2025-07-25 昆明物理研究所 一种化学抛光夹具
EP4382250A4 (en) * 2021-08-04 2025-06-11 Kuraray Co., Ltd. POLISHING CUSHION
KR102685134B1 (ko) * 2022-06-09 2024-07-15 케이피엑스케미칼 주식회사 개선된 연마속도를 갖는 연마패드 및 이를 포함하는 화학적 기계적 연마장치
KR102685136B1 (ko) * 2022-06-09 2024-07-15 케이피엑스케미칼 주식회사 개선된 연마속도를 갖는 연마패드 및 이를 포함하는 화학적 기계적 연마장치
KR20240105053A (ko) * 2022-12-28 2024-07-05 삼성전자주식회사 화학 기계적 연마 장치 및 이의 제어 방법
US20250108477A1 (en) * 2023-09-28 2025-04-03 Applied Materials, Inc. Chemical mechanical polishing edge control with pad recesses
CN120651714B (zh) * 2025-07-22 2026-03-31 四川省贝特化工科技有限公司 一种囊包颗粒用智能检测装置及其检测方法

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CN1494983A (zh) * 2002-06-03 2004-05-12 Jsr��ʽ���� 抛光垫及多层抛光垫
US6749714B1 (en) * 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
CN1846940A (zh) * 2005-04-12 2006-10-18 罗门哈斯电子材料Cmp控股股份有限公司 径向倾斜的抛光垫
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
US20090311955A1 (en) * 2008-03-14 2009-12-17 Nexplanar Corporation Grooved CMP pad

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JP4645825B2 (ja) 2004-05-20 2011-03-09 Ｊｓｒ株式会社 化学機械研磨パッド及び化学機械研磨方法
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JP4695386B2 (ja) * 2004-12-01 2011-06-08 東洋ゴム工業株式会社 研磨パッド、研磨方法ならびに半導体デバイスの製造方法および半導体デバイス
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US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
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TWI599447B (zh) * 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
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US6749714B1 (en) * 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
CN1494983A (zh) * 2002-06-03 2004-05-12 Jsr��ʽ���� 抛光垫及多层抛光垫
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
CN1846940A (zh) * 2005-04-12 2006-10-18 罗门哈斯电子材料Cmp控股股份有限公司 径向倾斜的抛光垫
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108214285A (zh) * 2018-01-25 2018-06-29 成都时代立夫科技有限公司 一种化学机械抛光垫
CN111867781A (zh) * 2018-04-26 2020-10-30 丸石产业株式会社 研磨垫用的衬底及使用该衬底的研磨方法
KR20210002464A (ko) * 2018-04-26 2021-01-08 마루이시 산교 가부시키가이샤 연마 패드용 깔개 및 그 깔개를 사용하는 연마방법
KR102629759B1 (ko) 2018-04-26 2024-01-25 마루이시 산교 가부시키가이샤 연마 패드용 깔개 및 그 깔개를 사용하는 연마방법
CN111805433A (zh) * 2019-04-10 2020-10-23 松下知识产权经营株式会社 研磨装置以及研磨方法
CN111805433B (zh) * 2019-04-10 2024-05-31 松下知识产权经营株式会社 研磨装置以及研磨方法
CN110732983A (zh) * 2019-10-30 2020-01-31 郑州伯利森新材料科技有限公司 一种硬脆材料加工用免修整超硬砂轮及其制备方法
CN115972083A (zh) * 2023-01-05 2023-04-18 华虹半导体(无锡)有限公司 研磨垫
CN116276633A (zh) * 2023-02-13 2023-06-23 上海芯谦集成电路有限公司 一种具有透气孔的抛光垫

Also Published As

Publication number Publication date
KR20170113203A (ko) 2017-10-12
US10875146B2 (en) 2020-12-29
FR3049205B1 (fr) 2021-08-06
US20170274496A1 (en) 2017-09-28
KR102363154B1 (ko) 2022-02-15
TWI773663B (zh) 2022-08-11
TW201800181A (zh) 2018-01-01
JP6993090B2 (ja) 2022-01-13
FR3049205A1 (fr) 2017-09-29
JP2017208530A (ja) 2017-11-24

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Application publication date: 20171003