WO2010148265A3 - Apertured abrasive disk assembly with improved flow dynamics - Google Patents

Apertured abrasive disk assembly with improved flow dynamics Download PDF

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Publication number
WO2010148265A3
WO2010148265A3 PCT/US2010/039104 US2010039104W WO2010148265A3 WO 2010148265 A3 WO2010148265 A3 WO 2010148265A3 US 2010039104 W US2010039104 W US 2010039104W WO 2010148265 A3 WO2010148265 A3 WO 2010148265A3
Authority
WO
WIPO (PCT)
Prior art keywords
abrasive disk
apertures
disk assembly
affinity
liquids
Prior art date
Application number
PCT/US2010/039104
Other languages
French (fr)
Other versions
WO2010148265A2 (en
Inventor
Stephen J. Benner
Darryl W. Peters
Original Assignee
Confluense Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Confluense Llc filed Critical Confluense Llc
Publication of WO2010148265A2 publication Critical patent/WO2010148265A2/en
Publication of WO2010148265A3 publication Critical patent/WO2010148265A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

Abstract

The evacuation properties of an abrasive disk are improved by forming its apertures to exhibit a configuration that will direct process fluids onto or away from a workpiece (or contact) interface through capillary action, surface tension/affinity, and/or boundary layer pump actions. The capillary action is accomplished by modifying the geometries of the apertures to form capillary tubes, where the orientation and lift angle of the capillary tubes is controlled to improve the flow of relatively thin layers of liquids. The surface tension/affinity between a liquid material and the abrasive disk is controlled by modifying the through-hole apertures to exhibit a serrated inner surface, which will decrease the attraction between the material of the abrasive disk and the process liquid. A plurality of apertured disks may be stacked, and their respective apertures properly arranged on each surface, to create a Tesla pump such that the kinetic energy associated with rotation of the disk assembly will preferentially bias both the vertical and tangential flow of liquids between the working surface and the disk assembly.
PCT/US2010/039104 2009-06-19 2010-06-18 Apertured abrasive disk assembly with improved flow dynamics WO2010148265A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US21847309P 2009-06-19 2009-06-19
US61/218,473 2009-06-19
US12/817,461 2010-06-17
US12/817,461 US20110039485A1 (en) 2009-06-19 2010-06-17 Apertured Abrasive Disk Assembly With Improved Flow Dynamics

Publications (2)

Publication Number Publication Date
WO2010148265A2 WO2010148265A2 (en) 2010-12-23
WO2010148265A3 true WO2010148265A3 (en) 2011-04-07

Family

ID=43357061

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/039104 WO2010148265A2 (en) 2009-06-19 2010-06-18 Apertured abrasive disk assembly with improved flow dynamics

Country Status (2)

Country Link
US (1) US20110039485A1 (en)
WO (1) WO2010148265A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2972949B1 (en) * 2011-03-21 2014-05-16 Snecma MACHINING TOOL WITH DEBOUCHANT HOLES
GB2508246A (en) * 2012-11-27 2014-05-28 Safehouse Habitats Scotland Ltd Cold cutting/grinding disc
GB2515764A (en) * 2013-07-02 2015-01-07 3M Innovative Properties Co Abrasive article and adapter therefore
DE102017216175A1 (en) 2017-09-13 2019-03-14 Robert Bosch Gmbh abrasive article

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001277103A (en) * 2000-03-30 2001-10-09 Jsr Corp Polishing pad
JP2008087082A (en) * 2006-09-29 2008-04-17 Three M Innovative Properties Co Grinding tool for sucking dust
KR100862130B1 (en) * 2006-03-27 2008-10-09 가부시끼가이샤 도시바 Grinding pad, grinding method and grinding apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6361414B1 (en) * 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6702655B2 (en) * 2002-07-05 2004-03-09 Taiwan Semiconductor Manufacturing Co., Ltd Slurry delivery system for chemical mechanical polisher
US6969307B2 (en) * 2004-03-30 2005-11-29 Lam Research Corporation Polishing pad conditioning and polishing liquid dispersal system
KR100568258B1 (en) * 2004-07-01 2006-04-07 삼성전자주식회사 Polishing pad for chemical mechanical polishing and apparatus using the same
KR100693251B1 (en) * 2005-03-07 2007-03-13 삼성전자주식회사 Pad conditioner for improving removal rate and roughness of polishing pad and chemical mechanical polishing apparatus using the same
US7383723B2 (en) * 2005-05-24 2008-06-10 Intel Corporation Detecting particle agglomeration in chemical mechanical polishing slurries
US7597608B2 (en) * 2006-10-30 2009-10-06 Applied Materials, Inc. Pad conditioning device with flexible media mount
US7632170B2 (en) * 2007-06-25 2009-12-15 Novellus Systems, Inc. CMP apparatuses with polishing assemblies that provide for the passive removal of slurry

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001277103A (en) * 2000-03-30 2001-10-09 Jsr Corp Polishing pad
KR100862130B1 (en) * 2006-03-27 2008-10-09 가부시끼가이샤 도시바 Grinding pad, grinding method and grinding apparatus
JP2008087082A (en) * 2006-09-29 2008-04-17 Three M Innovative Properties Co Grinding tool for sucking dust

Also Published As

Publication number Publication date
WO2010148265A2 (en) 2010-12-23
US20110039485A1 (en) 2011-02-17

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