JP2014188668A5 - Substrate manufacturing method and carrier - Google Patents

Substrate manufacturing method and carrier Download PDF

Info

Publication number
JP2014188668A5
JP2014188668A5 JP2013069798A JP2013069798A JP2014188668A5 JP 2014188668 A5 JP2014188668 A5 JP 2014188668A5 JP 2013069798 A JP2013069798 A JP 2013069798A JP 2013069798 A JP2013069798 A JP 2013069798A JP 2014188668 A5 JP2014188668 A5 JP 2014188668A5
Authority
JP
Japan
Prior art keywords
carrier
thick
carrier according
substrate
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013069798A
Other languages
Japanese (ja)
Other versions
JP2014188668A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2013069798A priority Critical patent/JP2014188668A/en
Priority claimed from JP2013069798A external-priority patent/JP2014188668A/en
Publication of JP2014188668A publication Critical patent/JP2014188668A/en
Publication of JP2014188668A5 publication Critical patent/JP2014188668A5/en
Pending legal-status Critical Current

Links

Claims (11)

基板を保持するための保持孔が形成されたキャリアであって、
前記キャリアは、厚肉部と、前記厚肉部の厚みよりも厚みの小さい薄肉部とを備え、
前記厚肉部および前記薄肉部のいずれか一方は、前記保持孔の周囲に形成される、
キャリア。 A carrier having a holding hole for holding a substrate ,
The carrier comprises a thick part and a thin part having a thickness smaller than the thickness of the thick part,
Either one of the thick part and the thin part is formed around the holding hole,
Career . 前記薄肉部は、前記保持孔の周囲に形成され、
前記厚肉部は、前記薄肉部の周囲に形成される、請求項１記載のキャリア。 The thin portion is formed around the holding hole,
The carrier according to claim 1, wherein the thick part is formed around the thin part. 前記薄肉部は、前記キャリアの径方向において、前記保持孔から前記厚肉部にかけて厚みが大きくなるように形成される、請求項２記載のキャリア。 The carrier according to claim 2, wherein the thin portion is formed so as to increase in thickness from the holding hole to the thick portion in a radial direction of the carrier . 前記厚肉部は、前記保持孔の周囲に形成され、
前記薄肉部は、前記厚肉部の周囲に形成される、請求項１記載のキャリア。 The thick portion is formed around the holding hole,
The carrier according to claim 1, wherein the thin portion is formed around the thick portion. 前記厚肉部は、前記キャリアの径方向において、前記保持孔から前記薄肉部にかけて厚みが小さくなるように形成される、請求項４記載のキャリア。 The carrier according to claim 4, wherein the thick portion is formed so that the thickness decreases from the holding hole to the thin portion in a radial direction of the carrier . 前記厚肉部または前記薄肉部のうち、前記保持孔の周囲に形成される部分の径方向の長さが、１〜５００μｍである、請求項１〜５のいずれか１項に記載のキャリア。 The carrier according to any one of claims 1 to 5 , wherein a radial length of a portion formed around the holding hole in the thick portion or the thin portion is 1 to 500 µm. 前記厚肉部のうちもっとも厚みの大きな部分と、前記薄肉部のうちもっとも厚みの小さな部分との厚みの差が、１〜５００μｍである、請求項１〜６のいずれか１項に記載のキャリア。 The carrier according to any one of claims 1 to 6, wherein a difference in thickness between a thickest part of the thick part and a thinnest part of the thin part is 1 to 500 µm. . 前記厚肉部は、前記基板の厚みよりも１〜２００μｍ小さな厚みの部分を含む、請求項１〜７のいずれか１項に記載のキャリア。 The thick portion, including pre 1~200μm portion of smaller thickness than the thickness of Kimoto plate carrier according to any one of claims 1 to 7. 前記保持孔は、前記キャリアに同心円状に複数形成されている、請求項１〜８のいずれか１項に記載のキャリア。 The carrier according to any one of claims 1 to 8, wherein a plurality of the holding holes are concentrically formed in the carrier . 請求項１〜９のいずれ１項に記載のキャリアに前記基板を保持し、研磨パッドを備える上下の定盤により前記基板を挟持して前記基板の両面を同時に研磨する研磨工程を備える、基板の製造方法。A substrate comprising: a polishing step of holding the substrate on the carrier according to claim 1, and sandwiching the substrate by upper and lower surface plates provided with a polishing pad to simultaneously polish both surfaces of the substrate. Production method. 前記基板がガラスである、請求項１０に記載の基板の製造方法。The manufacturing method of the board | substrate of Claim 10 whose said board | substrate is glass.
JP2013069798A 2013-03-28 2013-03-28 Method of manufacturing glass substrate Pending JP2014188668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013069798A JP2014188668A (en) 2013-03-28 2013-03-28 Method of manufacturing glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013069798A JP2014188668A (en) 2013-03-28 2013-03-28 Method of manufacturing glass substrate

Publications (2)

Publication Number Publication Date
JP2014188668A JP2014188668A (en) 2014-10-06
JP2014188668A5 true JP2014188668A5 (en) 2016-05-26

Family

ID=51835521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013069798A Pending JP2014188668A (en) 2013-03-28 2013-03-28 Method of manufacturing glass substrate

Country Status (1)

Country Link
JP (1) JP2014188668A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015076227A1 (en) * 2013-11-20 2015-05-28 旭硝子株式会社 Glass plate manufacturing method
JP6443370B2 (en) * 2016-03-18 2018-12-26 信越半導体株式会社 Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer
JP6579056B2 (en) * 2016-07-29 2019-09-25 株式会社Sumco Wafer double-side polishing method
JP7200898B2 (en) * 2019-09-27 2023-01-10 株式会社Sumco Double-sided polishing method of workpiece

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2782868B2 (en) * 1989-12-12 1998-08-06 富士通株式会社 Wafer polishing method
JP2001328062A (en) * 2000-05-22 2001-11-27 Mitsubishi Materials Silicon Corp Grinding method for semiconductor wafer and its device
JP3872967B2 (en) * 2001-07-04 2007-01-24 株式会社東芝 Double-side polishing apparatus, double-side polishing method and double-side polishing support member
DE10250823B4 (en) * 2002-10-31 2005-02-03 Siltronic Ag Carrier and method for simultaneous two-sided machining of workpieces
DE102005034119B3 (en) * 2005-07-21 2006-12-07 Siltronic Ag Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection
JP3974632B1 (en) * 2006-04-05 2007-09-12 株式会社白崎製作所 DLC coated wafer holder and method for producing DLC coated wafer holder
JP2008221356A (en) * 2007-03-09 2008-09-25 Epson Toyocom Corp Double-sided polishing carrier
JP5334428B2 (en) * 2008-03-10 2013-11-06 Ｈｏｙａ株式会社 Manufacturing method of glass substrate for magnetic disk
JP2010045279A (en) * 2008-08-18 2010-02-25 Nippon Steel Corp Method for polishing both surface of semiconductor substrate
JP5312911B2 (en) * 2008-11-12 2013-10-09 Ｈｏｙａ株式会社 Manufacturing method of glass substrate for magnetic disk and manufacturing method of magnetic disk

Similar Documents

Publication Publication Date Title
JP2013229093A5 (en)
JP2014029853A5 (en)
JP2014515123A5 (en)
JP2014032960A5 (en) Method for manufacturing display device
EP2698821A3 (en) Organic light emitting display and method for manufacturing the same
TR201905077T4 (en) Insulating glass units with low diffusivity and antireflection coatings and / or methods of manufacturing them.
JP2014237545A5 (en)
WO2013161209A3 (en) Liquid crystal display device
JP2016506539A5 (en)
JP2014188668A5 (en) Substrate manufacturing method and carrier
JP2011009723A5 (en)
EP2995995A3 (en) Pattern structure and method of manufacturing the pattern structure
EP2851451A8 (en) Amorphous-carbon-containing film
JP2016066597A5 (en) Method for manufacturing display device
JP2013172147A5 (en)
EA201591231A1 (en) TRANSPARENT SUBSTRATE, IN PARTICULAR GLASS SUBSTRATE COATED AT LESS THAN ONE, AT LEAST, BIFFUNCTIONAL POROUS LAYER, METHOD OF MANUFACTURE AND APPLICATION
JP2015014547A5 (en)
JP2013092758A5 (en)
WO2012102565A3 (en) Gravure roll and manufacturing the same
ITMI20130954A1 (en) STRUCTURAL ELEMENTER WITH THROUGH CONTACT AND PROCEDURE FOR THE RELATED PRODUCTION
EP2590210A3 (en) Heat dissipating device and manufacture method thereof
WO2015044773A3 (en) A structure for a heat transfer interface and method of manufacturing the same
WO2015073857A3 (en) Flexible heat sealed decorative articles having a support layer and methods of making the same
CN203730589U (en) Connecting disc
JP2012128384A5 (en)