WO2012047068A3 - Light-emitting element and method for manufacturing same - Google Patents

Light-emitting element and method for manufacturing same Download PDF

Info

Publication number
WO2012047068A3
WO2012047068A3 PCT/KR2011/007460 KR2011007460W WO2012047068A3 WO 2012047068 A3 WO2012047068 A3 WO 2012047068A3 KR 2011007460 W KR2011007460 W KR 2011007460W WO 2012047068 A3 WO2012047068 A3 WO 2012047068A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting element
manufacturing same
fine structures
carbon layer
Prior art date
Application number
PCT/KR2011/007460
Other languages
French (fr)
Korean (ko)
Other versions
WO2012047068A2 (en
Inventor
이규철
이철호
김용진
Original Assignee
서울대학교산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울대학교산학협력단 filed Critical 서울대학교산학협력단
Priority to US13/878,251 priority Critical patent/US8916850B2/en
Publication of WO2012047068A2 publication Critical patent/WO2012047068A2/en
Publication of WO2012047068A3 publication Critical patent/WO2012047068A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/34Materials of the light emitting region containing only elements of group IV of the periodic system
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0093Wafer bonding; Removal of the growth substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H01L33/18Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/641Heat extraction or cooling elements characterized by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Devices (AREA)

Abstract

The present invention provides a light-emitting element comprising: a carbon layer comprising a graphene; a plurality of fine structures having grown toward the upper side of the carbon layer; and a light-emitting structure layer formed on the surface of the fine structures.
PCT/KR2011/007460 2010-10-07 2011-10-07 Light-emitting element and method for manufacturing same WO2012047068A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/878,251 US8916850B2 (en) 2010-10-07 2011-10-07 Light-emitting element and method for manufacturing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100097840A KR101217209B1 (en) 2010-10-07 2010-10-07 Light emitting device and method for manufacturing the same
KR10-2010-0097840 2010-10-07

Publications (2)

Publication Number Publication Date
WO2012047068A2 WO2012047068A2 (en) 2012-04-12
WO2012047068A3 true WO2012047068A3 (en) 2012-05-31

Family

ID=45928257

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/007460 WO2012047068A2 (en) 2010-10-07 2011-10-07 Light-emitting element and method for manufacturing same

Country Status (3)

Country Link
US (1) US8916850B2 (en)
KR (1) KR101217209B1 (en)
WO (1) WO2012047068A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140021444A1 (en) * 2010-05-31 2014-01-23 Snu R&Db Foundation Electronic device and manufacturing method thereof
KR101217210B1 (en) * 2010-10-07 2012-12-31 서울대학교산학협력단 Light emitting device and method for manufacturing the same
GB201021112D0 (en) 2010-12-13 2011-01-26 Ntnu Technology Transfer As Nanowires
KR101908546B1 (en) 2012-04-27 2018-10-17 엘지이노텍 주식회사 Light emitting device
GB201211038D0 (en) 2012-06-21 2012-08-01 Norwegian Univ Sci & Tech Ntnu Solar cells
TWI476953B (en) * 2012-08-10 2015-03-11 Univ Nat Taiwan Semiconductor light-emitting device and manufacturing method thereof
EP2722889B1 (en) 2012-10-18 2018-03-21 LG Innotek Co., Ltd. Light emitting diode with improved efficiency though current spreading
GB201311101D0 (en) 2013-06-21 2013-08-07 Norwegian Univ Sci & Tech Ntnu Semiconducting Films
DE112013007072T5 (en) * 2013-06-28 2016-01-28 Intel Corporation Nano-structures and nano-features with Si (111) planes on Si (100) wafers for III-N epitaxy
US9048303B1 (en) * 2014-01-30 2015-06-02 Infineon Technologies Austria Ag Group III-nitride-based enhancement mode transistor
KR102075986B1 (en) 2014-02-03 2020-02-11 삼성전자주식회사 Emiconductor light emitting device
US9337279B2 (en) 2014-03-03 2016-05-10 Infineon Technologies Austria Ag Group III-nitride-based enhancement mode transistor
KR102212557B1 (en) 2014-11-03 2021-02-08 삼성전자주식회사 Nano-sturucture semiconductor light emitting device
CN104409580B (en) * 2014-11-12 2017-02-01 无锡格菲电子薄膜科技有限公司 GaN-based LED (light-emitting diode) epitaxial wafer and preparation method thereof
EP3323152B1 (en) * 2015-07-13 2021-10-27 Crayonano AS Nanowires/nanopyramids shaped light emitting diodes and photodetectors
WO2017009395A1 (en) 2015-07-13 2017-01-19 Crayonano As Nanowires or nanopyramids grown on graphitic substrate
TWI539043B (en) 2015-07-21 2016-06-21 財團法人工業技術研究院 Method for manufacturing graphene flower
KR20180053652A (en) 2015-07-31 2018-05-23 크래요나노 에이에스 Method for growing nanowires or nanopires on a graphite substrate
CN105161588A (en) * 2015-08-18 2015-12-16 西安电子科技大学 R-plane sapphire substrate-based yellow light-emitting diode (LED) material and preparation method thereof
KR102172865B1 (en) 2016-09-29 2020-11-02 니치아 카가쿠 고교 가부시키가이샤 Light-emitting element
GB201705755D0 (en) 2017-04-10 2017-05-24 Norwegian Univ Of Science And Tech (Ntnu) Nanostructure
CN107749437A (en) * 2017-11-17 2018-03-02 广州市香港科大霍英东研究院 Pliability light emitting diode processing procedure and its structure
KR102142359B1 (en) * 2018-09-27 2020-08-07 한국원자력연구원 Method for preparing boron-doped carbon nanomaterial
CN109638116B (en) * 2018-11-27 2020-12-25 华灿光电(浙江)有限公司 Preparation method of epitaxial wafer of light emitting diode and epitaxial wafer
US11462659B2 (en) * 2019-09-10 2022-10-04 Koito Manufacturing Co., Ltd. Semiconductor light emitting device and manufacturing method of semiconductor light emitting device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332650A (en) * 2005-05-24 2006-12-07 Lg Electronics Inc Rod-type light emitting element and manufacturing method thereof
KR20090003526A (en) * 2007-06-14 2009-01-12 삼성전자주식회사 Infrared rays emitting device using graphene
KR20090123951A (en) * 2007-03-13 2009-12-02 위스콘신 얼럼나이 리서어치 화운데이션 Graphite-based photovoltaic cells
KR20100074442A (en) * 2008-12-24 2010-07-02 경희대학교 산학협력단 Variable energy visible light tunneling emitter using graphene and manufacturing method of the same
KR20100082215A (en) * 2009-01-08 2010-07-16 삼성전자주식회사 White light emitting diode

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100693805B1 (en) 2005-06-20 2007-03-12 (주)더리즈 Gallium Nitride Based Compound Semiconductor Device And Forming Method Thereof
KR101636915B1 (en) * 2010-09-03 2016-07-07 삼성전자주식회사 Semiconductor compound structure and method of manufacturing the same using graphene or carbon nanotubes, and seciconductor device including the semiconductor compound
US8648328B2 (en) * 2011-12-27 2014-02-11 Sharp Laboratories Of America, Inc. Light emitting diode (LED) using three-dimensional gallium nitride (GaN) pillar structures with planar surfaces

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332650A (en) * 2005-05-24 2006-12-07 Lg Electronics Inc Rod-type light emitting element and manufacturing method thereof
KR20090123951A (en) * 2007-03-13 2009-12-02 위스콘신 얼럼나이 리서어치 화운데이션 Graphite-based photovoltaic cells
KR20090003526A (en) * 2007-06-14 2009-01-12 삼성전자주식회사 Infrared rays emitting device using graphene
KR20100074442A (en) * 2008-12-24 2010-07-02 경희대학교 산학협력단 Variable energy visible light tunneling emitter using graphene and manufacturing method of the same
KR20100082215A (en) * 2009-01-08 2010-07-16 삼성전자주식회사 White light emitting diode

Also Published As

Publication number Publication date
US8916850B2 (en) 2014-12-23
WO2012047068A2 (en) 2012-04-12
KR20120036129A (en) 2012-04-17
US20130187128A1 (en) 2013-07-25
KR101217209B1 (en) 2012-12-31

Similar Documents

Publication Publication Date Title
WO2012047068A3 (en) Light-emitting element and method for manufacturing same
WO2012047069A3 (en) Light-emitting element and method for manufacturing same
USD655094S1 (en) Substrate with a camouflage pattern
USD653235S1 (en) Earbud assembly
USD738699S1 (en) Rescue tool
EP2548228A4 (en) Manufacture of graphene-based apparatus
WO2011099831A3 (en) Flexible transparent heating element using graphene and method for manufacturing same
USD686350S1 (en) Surface pattern as applied to a tile
WO2012121940A3 (en) Methods of forming polycrystalline elements and structures formed by such methods
USD681964S1 (en) Wipe with pattern for embossing
WO2011162999A3 (en) Cutting elements for earth-boring tools, earth-boring tools including such cutting elements, and methods of forming cutting elements for earth-boring tools
WO2013049042A3 (en) Coalesced nanowire structures with interstitial voids and method for manufacturing the same
WO2012057517A3 (en) Compound semiconductor device and method for manufacturing a compound semiconductor
WO2013029028A3 (en) Patterned transparent conductors and related manufacturing methods
WO2012004699A3 (en) Panel and method for manufacturing panels
USD680947S1 (en) Keyboard solar panels
WO2013051875A3 (en) Organic light-emitting device and method for manufacturing same
USD677804S1 (en) Grooved tile
USD670829S1 (en) Tile pattern
WO2013003453A3 (en) Insert for radomes and methods of manufacturing insert for radomes
GB2497005B (en) Light-emitting structure and a method for fabricating the same
WO2013032233A3 (en) Graphene-based laminate including doped polymer layer
WO2011122882A3 (en) Semiconductor template substrate, light-emitting element using a semiconductor template substrate, and a production method therefor
USD659405S1 (en) Substrate with camouflage pattern
WO2012057504A3 (en) Solar cell and method for manufacturing same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11830953

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 13878251

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 11830953

Country of ref document: EP

Kind code of ref document: A2