JP2017201683A - 半導体素子 - Google Patents
半導体素子 Download PDFInfo
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- JP2017201683A JP2017201683A JP2017003123A JP2017003123A JP2017201683A JP 2017201683 A JP2017201683 A JP 2017201683A JP 2017003123 A JP2017003123 A JP 2017003123A JP 2017003123 A JP2017003123 A JP 2017003123A JP 2017201683 A JP2017201683 A JP 2017201683A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 322
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 74
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 63
- 230000015556 catabolic process Effects 0.000 claims description 21
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 238000002513 implantation Methods 0.000 description 25
- 230000008859 change Effects 0.000 description 21
- 239000012535 impurity Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 15
- 230000004888 barrier function Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000002161 passivation Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 239000013256 coordination polymer Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
0.13≦Rc/Rd
を満たす。
0.13≦Rc/Rd
を満たす。
0.15≦Rc/Rd
を満たしてもよい。
Rc/Rd≦0.65
を満たしてもよい。
1<dRf150/dRf25<1.5
を満たす。これにより、半導体素子のオン状態における抵抗の温度変化を抑制できる。
1<dRf150/dRf25≦1.35
を満たしてもよい。
以下、図面を参照しながら、本開示の第1の実施形態について説明する。本実施形態では、第1導電型がn型、第2導電型がp型である例について示すが、これに限定されない。本開示の実施形態において、第1導電型がp型、第2導電型がn型であってもよい。
図1から図12を参照して、第1の実施形態に係る半導体素子1000を説明する。
金属と半導体からなるショットキー接合に対して、金属が半導体よりも負となる電圧を印加すると、接合界面において空乏層が延びる。同様に、p型領域およびn型領域を含む半導体のpn接合に対して、p型領域がn型領域よりも負となる電圧を印加すると、接合界面において空乏層が延びる。接合界面での電界強度がある値に到達すると、空乏層にアバランシェ電流が流れ、それより高い電圧を印加できなくなる。本明細書ではこのアバランシェ電流が流れるときの電圧を「アバランシェ耐圧」と表記する。
、温度T1よりも高い温度T2のときの電流−電圧特性を特性線L20で示している。温度T1は例えば室温(ここでは25℃)、温度T2は例えば150℃である。なお、これらの温度は、半導体内部の接合温度である。
うに、ある閾値電圧Vth1までは電流がほとんど流れないが、それ以上の順方向電圧を
印加することにより電流が流れる。この閾値電圧Vth1は第1電極159とドリフト層
102との間に形成されるショットキー障壁の大きさに依存する。ただし、閾値電圧Vth1は、ショットキー接合により決定されるショットキー障壁電位φbの大きさとは異な
る。閾値電圧Vth1以上の電圧が印加され、順方向電流が流れると、順方向電圧の増分
dVfに対して順方向電流はほぼ線形に増加する。電流が流れる電圧領域では、特性線L10はほぼ直線で表される。この直線を延長して順方向電流がゼロとなるときの順方向電圧が閾値電圧Vth1に相当する。閾値電圧Vth1以上の電圧で従来の半導体素子はオン状態となる。
される。この直線を延長して順方向電流がゼロとなるときの順方向電圧が閾値電圧Vth2に相当する。
dVf/dIf=dRf (1)
dRf≒Rd+Rb+Rsub+Rc
なお、従来の半導体素子では、前述のように接触抵抗Rcは1×10-4Ωcm2より小さ
いため、ここではゼロとして扱う(Rc=0)。従って、後述する計算において、従来の半導体素子における微分抵抗dRfを、Rd+Rb+Rsubとみなすことがある。
る微分抵抗dRf20は、温度T1における微分抵抗dRf10よりも大きくなる。
なるときの順方向電圧をV10、温度T2においてオン状態の順方向電流がある順方向電流
Iとなるときの順方向電圧をV20とすると、温度T1および温度T2における微分抵抗dRf10およびdRf20は、下記式(2)および(3)で表される。
dRf10=dVf/dIf
=(V10−Vth1)/I (2)
dRf20=dVf/dIf
=(V20−Vth2)/I (3)
、図2を参照しながら前述した、従来の半導体素子における特性線L10、L20も破線で示している。
る順方向電流Iとなるときの順方向電圧をV1、温度T2においてオン状態の順方向電流がある順方向電流Iとなるときの順方向電圧をV2とする。同様に、従来の半導体素子にお
いて、温度T1においてオン状態の順方向電流がある順方向電流Iとなるときの順方向電
圧をV10、温度T2においてオン状態の順方向電流がある順方向電流Iとなるときの順方
向電圧をV20とする。
っている。半導体素子1000の特性線L1は、従来の半導体素子の特性線L10に対して
、下式(4)に示すように、順方向電流がIとなるときにΔVT1、すなわちI×Rc(V)だけ電圧降下する。すなわち、半導体素子1000の微分抵抗dRfは、Rcの分だけ従来よりも増加する。
ΔVT1=V1−V10=I×Rc(V) (4)
おける閾値電圧および電流が流れる電圧領域における傾きは略等しい。温度T2における
半導体素子1000の特性線L2は、従来の半導体素子の特性線L20に対して、順方向電
流がIとなるときにΔVT2だけ電圧降下する。すなわち、半導体素子1000の温度T2
における微分抵抗dRfは、温度T1のときと同様に、従来の半導体素子の微分抵抗に対
して接触抵抗Rcの分だけ増加する。しかし、温度T2における接触抵抗Rcは温度T1のときの接触抵抗Rcよりも小さいため、温度T2における、半導体素子1000の微分抵
抗dRfと従来の半導体素子の微分抵抗との差は小さくなる。この結果、半導体素子1000における、特性線L1およびL2が交差するクロスポイントCPは、図3に示すように、従来の半導体素子のクロスポイントCP0に対して高電圧側および高電流側にシフトする。
下をゼロ、すなわち、V20≒V2と仮定している。
dRf1=dVf/dIf
=(V1−Vth1)/I (5)
dRf2=dVf/dIf
=(V2−Vth2)/I
≒(V20−Vth2)/I
=dRf20 (6)
抗を、温度T1(室温)の微分抵抗で規格化した値をそれぞれD0、Dとする。本明細書では、これらの値D0、Dを「微分抵抗比」と呼ぶ。微分抵抗比D0、Dは、下記式(7)、(8)のように表される。
D0=dRf20/dRf10 (7)
D=dRf2/dRf1 (8)
半導体素子1000の微分抵抗比Dは、式(8)、(5)、(6)、(4)、(2)および(7)を用いると、従来の半導体素子における微分抵抗比D0を用いた式(9)で表す
ことができる。
D=dRf2/dRf1
≒dRf20/{(V1−Vth1)/I}
=dRf20/{(V10+IRc−Vth1)/I}
=dRf20/{(V10−Vth1)/I+Rc}
=dRf20/(dRf10+Rc)
=D0・dRf10/(dRf10+Rc) (9)
式(9)から、D/D0を求めると、式(10)が得られる。
D/D0≒1/(1+Rc/dRf10) (10)
だし、D≧1、D0>1)。
すなわち、
1/(1+Rc/dRf10)<1 (11)
であればよい。式(12)に示すように、半導体素子1000の微分抵抗比Dは、従来の半導体素子の微分抵抗比D0と比べて10%以上小さくなってもよい。
1/(1+Rc/dRf10)≦0.9 (12)
式(12)から、接触抵抗Rcの範囲は、例えば式(13)で表される。
Rc≧(dRf10)/9 (13)
前述したように、従来の半導体素子の微分抵抗dRf10は、次式(14)で表わされる。dRf10=Rd+Rb+Rsub+Rc
≒Rd+Rb+Rsub (14)
式(13)、(14)から、次式(15)が得られる。
Rc/(Rd+Rsub+Rb)≧0.11 (15)
式(15)から、接触抵抗Rcと、ドリフト抵抗に対する接触抵抗の割合Rc/Rdとの関係を算出できる。
フは、図4と同じ計算結果に基づいている。
図6Aから図9Bを参照しながら、本実施形態に係る半導体素子1000の製造方法を説明する。図6Aから図9Bは、それぞれ、半導体素子1000の製造方法を説明するための工程断面図である。
501を形成した後、Alイオンなどのp型の不純物イオンをドリフト層102に注入する。これにより、ドリフト層102に、ガードリング注入領域1510およびFLR注入領域1520を含む終端注入領域1500が形成される。終端注入領域1500、ガードリング注入領域1510およびFLR注入領域1520は、それぞれ、後に、終端領域150、ガードリング領域151およびFLR領域152となる。終端注入領域1500、ガードリング注入領域1510およびFLR注入領域1520の注入ドーズ量はいずれも4.6×1015cm-2であり、不純物注入時には半導体基板101は例えば300℃以上500℃以下に加熱されていてもよい。このとき、終端領域150とドリフト層102の間に形成されるpn接合までの接合深さが、ドリフト層102の表面201から例えば1μm程度になるように不純物注入エネルギーが調整される。不純物注入後、マスク501は除去される。
さは例えば300nmである。次にフォトレジストによるマスクを形成して例えばウェットエッチングによりガードリング領域151の一部、および、ガードリング領域151の内側のドリフト層102を露出させる。その後マスクを除去する。このようにして、図8Aに示すように、開口を有する絶縁膜111が得られる。
図10は、実施例の半導体素子の順方向の電流−電圧特性の一例を示す図である。室温(25℃)および150℃における特性を、それぞれ、実線および破線で示している。
分抵抗dRfを電流−電圧特性から求めた。結果を図11に示す。
D150=dRf150/dRf25=1.35
であった。
.5未満に抑えることが可能である。接触抵抗Rcを調整することにより、150℃のときの微分抵抗比D150を1.35以下に抑えることも可能である。なお、本実施例ではd
Rf150>dRf25であることから、微分抵抗比D150は1よりも大きい。従って、D150
は、1<D150<1.5を満たしてもよい。また、D150は、1<D150≦1.35を満た
してもよい。これにより、微分抵抗の温度変化を従来よりも低減できる。
以下、本実施形態の半導体素子の変形例を説明する。
101 半導体基板
102 ドリフト層
110 第2電極
111 絶縁膜
112 表面電極
113 裏面電極
114 パッシベーション膜
150 終端領域
151 ガードリング領域
152 FLR領域
153 バリア領域
159 第1電極
191 バッファ層
192 接触抵抗調整領域
201 表面
202 第2主面
Claims (17)
- 第1主面及び前記第1主面と反対側の第2主面を有する第1導電型の半導体基板と、
前記半導体基板の前記第1主面上に配置された第1導電型の炭化珪素半導体層と、
前記炭化珪素半導体層上に配置された第1電極と、
前記半導体基板の前記第2主面上に配置され、前記半導体基板とオーミック接合を形成する第2電極と
を備え、
前記半導体基板の前記第2主面と前記第2電極との間の室温における接触抵抗をRc、前記炭化珪素半導体層の前記第1主面の法線方向の室温における抵抗をRdとしたとき、0.13≦Rc/Rd
を満たす、半導体素子。 - 前記炭化珪素半導体層内に配置された第2導電型の終端領域をさらに備え、
前記終端領域は、前記第1主面の法線方向から見て前記炭化珪素半導体層の表面の一部を囲んでおり、
前記第1電極は、前記炭化珪素半導体層と接する面を有し、
前記第1電極は、前記炭化珪素半導体層と接する前記面の縁部において、前記終端領域と接している、請求項1に記載の半導体素子。 - 前記接触抵抗は1×10-4Ωcm2以上である、請求項1または2に記載の半導体素子。
- 前記接触抵抗は3×10-4Ωcm2以下であり、かつ
0.15≦Rc/Rd
を満たす、請求項1から3のいずれかに記載の半導体素子。 - Rc/Rd≦0.65
を満たす、請求項1から4のいずれかに記載の半導体素子。 - 前記接触抵抗は5.5×10-4Ωcm2以下である、請求項1に記載の半導体素子。
- 前記半導体素子の室温におけるアバランシェ耐圧は600V以上3000V以下である、請求項1から6のいずれかに記載の半導体素子。
- 前記終端領域は、
前記第1電極と接する第2導電型のガードリング領域と、
前記第1主面の法線方向から見て前記ガードリング領域を囲み、かつ、前記ガードリング領域と接触していない、第2導電型のフローティング領域と、
を含む、請求項2に記載の半導体素子。 - 前記半導体基板内の前記第2主面と接する位置に配置された接触抵抗調整領域をさらに備える、請求項1から8のいずれかに記載の半導体素子。
- 前記接触抵抗調整領域は第1導電型を有する、請求項9に記載の半導体素子。
- 前記第2電極はチタンを含む、請求項1から10のいずれかに記載の半導体素子。
- 前記第2電極の膜厚が100nm以上200nm以下である、請求項11に記載の半導体素子。
- 前記第1電極は、前記炭化珪素半導体層とショットキー接合を形成する、請求項1から12のいずれかに記載の半導体素子。
- 第1主面及び前記第1主面と反対側の第2主面を有する第1導電型の半導体基板と、
前記半導体基板の前記第1主面上に配置された第1導電型の炭化珪素半導体層と、
前記炭化珪素半導体層上に配置された第1電極と、
前記半導体基板の前記第2主面上に配置され、前記半導体基板とオーミック接合を形成する第2電極と、を備える半導体素子であって、
前記半導体素子は、前記第2電極よりも前記第1電極が正となる電圧を前記第1電極と前記第2電極との間に印加した際に非線形な電流−電圧特性を有し、
前記電流−電圧特性のオン状態の領域において、
25℃における電流に対する電圧の増加量をdRf25、150℃における電流に対する電圧の増加量をdRf150としたとき、
1<dRf150/dRf25<1.5
を満たす、半導体素子。 - 1<dRf150/dRf25≦1.35
を満たす、請求項14に記載の半導体素子。 - 室温におけるアバランシェ耐圧が600V以上3000V以下である、請求項14または15に記載の半導体素子。
- 前記第1電極は、前記炭化珪素半導体層とショットキー接合を形成する、請求項14から16のいずれかに記載の半導体素子。
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