JP2017189849A5 - - Google Patents

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JP2017189849A5
JP2017189849A5 JP2016081116A JP2016081116A JP2017189849A5 JP 2017189849 A5 JP2017189849 A5 JP 2017189849A5 JP 2016081116 A JP2016081116 A JP 2016081116A JP 2016081116 A JP2016081116 A JP 2016081116A JP 2017189849 A5 JP2017189849 A5 JP 2017189849A5
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JP
Japan
Prior art keywords
thickness
surface plate
thickness measuring
carrier
workpiece
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JP2016081116A
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English (en)
Japanese (ja)
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JP6760638B2 (ja
JP2017189849A (ja
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Priority to JP2016081116A priority Critical patent/JP6760638B2/ja
Priority claimed from JP2016081116A external-priority patent/JP6760638B2/ja
Priority to KR1020170045067A priority patent/KR102315142B1/ko
Priority to CN201710228022.7A priority patent/CN107297678A/zh
Priority to TW106112056A priority patent/TWI704613B/zh
Publication of JP2017189849A publication Critical patent/JP2017189849A/ja
Publication of JP2017189849A5 publication Critical patent/JP2017189849A5/ja
Application granted granted Critical
Publication of JP6760638B2 publication Critical patent/JP6760638B2/ja
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JP2016081116A 2016-04-14 2016-04-14 平面研磨装置 Active JP6760638B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016081116A JP6760638B2 (ja) 2016-04-14 2016-04-14 平面研磨装置
KR1020170045067A KR102315142B1 (ko) 2016-04-14 2017-04-07 평면 연마 장치
CN201710228022.7A CN107297678A (zh) 2016-04-14 2017-04-10 平面研磨装置
TW106112056A TWI704613B (zh) 2016-04-14 2017-04-11 平面研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016081116A JP6760638B2 (ja) 2016-04-14 2016-04-14 平面研磨装置

Publications (3)

Publication Number Publication Date
JP2017189849A JP2017189849A (ja) 2017-10-19
JP2017189849A5 true JP2017189849A5 (enrdf_load_stackoverflow) 2019-05-16
JP6760638B2 JP6760638B2 (ja) 2020-09-23

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ID=60085360

Family Applications (1)

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JP2016081116A Active JP6760638B2 (ja) 2016-04-14 2016-04-14 平面研磨装置

Country Status (4)

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JP (1) JP6760638B2 (enrdf_load_stackoverflow)
KR (1) KR102315142B1 (enrdf_load_stackoverflow)
CN (1) CN107297678A (enrdf_load_stackoverflow)
TW (1) TWI704613B (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7046358B2 (ja) * 2018-04-17 2022-04-04 スピードファム株式会社 研磨装置
CN110193775B (zh) * 2019-03-12 2021-09-17 上海新昇半导体科技有限公司 化学机械抛光方法以及化学抛光系统
JP7651151B2 (ja) * 2019-12-25 2025-03-26 スピードファム株式会社 ワークホール検出装置及びワークホール検出方法
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
CN113245973B (zh) * 2021-06-08 2022-07-22 唐山国芯晶源电子有限公司 一种石英晶片抛光游轮修磨厚度检测方法
IT202100022463A1 (it) 2021-08-27 2023-02-27 Biesse Spa Metodo per controllare la lavorazione di pannelli di forma sostanzialmente parallelepipeda e macchina per la lavorazione di pannelli di forma sostanzialmente parallelepipeda, in particolare macchina levigatrice per la levigatura/satinatura di pannelli di legno, metallo, o simili
JP7296161B1 (ja) * 2022-06-27 2023-06-22 不二越機械工業株式会社 両面研磨装置
CN117359435B (zh) * 2023-12-05 2024-03-05 福建荣德光电科技有限公司 一种光学镜片加工用的数控平面精密铣磨机
CN117583975B (zh) * 2024-01-18 2024-03-19 山西日盛达太阳能科技股份有限公司 一种光伏玻璃抛光装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740233A (ja) * 1993-07-27 1995-02-10 Speedfam Co Ltd ワークの厚さ測定装置
JP2888339B1 (ja) * 1998-03-27 1999-05-10 直江津電子工業株式会社 被加工物保持プレート
JP4324933B2 (ja) 2000-08-23 2009-09-02 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 平面研磨装置
JP4202841B2 (ja) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ 表面研磨装置
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP2010023167A (ja) * 2008-07-18 2010-02-04 Epson Toyocom Corp 砥粒加工装置およびそれを用いた砥粒加工方法
JP4955624B2 (ja) 2008-07-31 2012-06-20 信越半導体株式会社 両面研磨装置
KR20100079199A (ko) * 2008-12-30 2010-07-08 주식회사 동부하이텍 화학적 기계 연마 장치 및 방법
US20120276662A1 (en) * 2011-04-27 2012-11-01 Iravani Hassan G Eddy current monitoring of metal features
JP5917994B2 (ja) * 2012-04-23 2016-05-18 スピードファム株式会社 研磨装置の計測用窓構造
JP6146213B2 (ja) * 2013-08-30 2017-06-14 株式会社Sumco ワークの両面研磨装置及び両面研磨方法
JP6622117B2 (ja) * 2016-03-08 2019-12-18 スピードファム株式会社 平面研磨装置及びキャリア

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