JP2017182849A - 研磨用組成物、それを用いた磁気ディスク用基板の研磨方法およびその研磨方法を使用する磁気ディスク用基板の製造方法 - Google Patents
研磨用組成物、それを用いた磁気ディスク用基板の研磨方法およびその研磨方法を使用する磁気ディスク用基板の製造方法 Download PDFInfo
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- JP2017182849A JP2017182849A JP2016064156A JP2016064156A JP2017182849A JP 2017182849 A JP2017182849 A JP 2017182849A JP 2016064156 A JP2016064156 A JP 2016064156A JP 2016064156 A JP2016064156 A JP 2016064156A JP 2017182849 A JP2017182849 A JP 2017182849A
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- Prior art keywords
- polishing
- acid
- polishing composition
- polished
- sulfonic acid
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 156
- 239000000758 substrate Substances 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 50
- 125000003118 aryl group Chemical group 0.000 claims abstract description 46
- 239000002253 acid Substances 0.000 claims abstract description 42
- 150000003839 salts Chemical class 0.000 claims abstract description 42
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims abstract description 39
- 239000006061 abrasive grain Substances 0.000 claims abstract description 35
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 23
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 23
- 229910052783 alkali metal Inorganic materials 0.000 claims description 6
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000003082 abrasive agent Substances 0.000 claims 1
- 238000007665 sagging Methods 0.000 abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 33
- 230000000052 comparative effect Effects 0.000 description 19
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 18
- 239000008119 colloidal silica Substances 0.000 description 16
- -1 zirconia Chemical compound 0.000 description 16
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- 239000007800 oxidant agent Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 14
- 125000000542 sulfonic acid group Chemical group 0.000 description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 12
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- 239000011734 sodium Substances 0.000 description 9
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- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 3
- 150000003863 ammonium salts Chemical class 0.000 description 3
- 229920006318 anionic polymer Polymers 0.000 description 3
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- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 3
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 3
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 3
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- 238000001556 precipitation Methods 0.000 description 3
- 239000001488 sodium phosphate Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 3
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 2
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- XHZPRMZZQOIPDS-UHFFFAOYSA-N 2-Methyl-2-[(1-oxo-2-propenyl)amino]-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(C)(C)NC(=O)C=C XHZPRMZZQOIPDS-UHFFFAOYSA-N 0.000 description 2
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- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
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- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 125000001165 hydrophobic group Chemical group 0.000 description 2
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
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- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-N peroxydisulfuric acid Chemical compound OS(=O)(=O)OOS(O)(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-N 0.000 description 2
- MPNNOLHYOHFJKL-UHFFFAOYSA-N peroxyphosphoric acid Chemical compound OOP(O)(O)=O MPNNOLHYOHFJKL-UHFFFAOYSA-N 0.000 description 2
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- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
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- 235000011008 sodium phosphates Nutrition 0.000 description 2
- 229940006186 sodium polystyrene sulfonate Drugs 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 description 1
- MLIWQXBKMZNZNF-KUHOPJCQSA-N (2e)-2,6-bis[(4-azidophenyl)methylidene]-4-methylcyclohexan-1-one Chemical compound O=C1\C(=C\C=2C=CC(=CC=2)N=[N+]=[N-])CC(C)CC1=CC1=CC=C(N=[N+]=[N-])C=C1 MLIWQXBKMZNZNF-KUHOPJCQSA-N 0.000 description 1
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- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical group C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000467 phytic acid Substances 0.000 description 1
- 235000002949 phytic acid Nutrition 0.000 description 1
- 229940068041 phytic acid Drugs 0.000 description 1
- 229960005141 piperazine Drugs 0.000 description 1
- 229960003506 piperazine hexahydrate Drugs 0.000 description 1
- AVRVZRUEXIEGMP-UHFFFAOYSA-N piperazine;hexahydrate Chemical compound O.O.O.O.O.O.C1CNCCN1 AVRVZRUEXIEGMP-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001444 polymaleic acid Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229960003975 potassium Drugs 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- KYKNRZGSIGMXFH-ZVGUSBNCSA-M potassium bitartrate Chemical compound [K+].OC(=O)[C@H](O)[C@@H](O)C([O-])=O KYKNRZGSIGMXFH-ZVGUSBNCSA-M 0.000 description 1
- 235000019396 potassium bromate Nutrition 0.000 description 1
- 229940094037 potassium bromate Drugs 0.000 description 1
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 1
- 229940046063 potassium chlorate Drugs 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 239000004224 potassium gluconate Substances 0.000 description 1
- 235000013926 potassium gluconate Nutrition 0.000 description 1
- 229960003189 potassium gluconate Drugs 0.000 description 1
- 229910001487 potassium perchlorate Inorganic materials 0.000 description 1
- 229960002832 potassium perchlorate Drugs 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 229940074439 potassium sodium tartrate Drugs 0.000 description 1
- 239000004302 potassium sorbate Substances 0.000 description 1
- 235000010241 potassium sorbate Nutrition 0.000 description 1
- 229940069338 potassium sorbate Drugs 0.000 description 1
- 239000001472 potassium tartrate Substances 0.000 description 1
- 229940111695 potassium tartrate Drugs 0.000 description 1
- 235000011005 potassium tartrates Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- POSICDHOUBKJKP-UHFFFAOYSA-N prop-2-enoxybenzene Chemical compound C=CCOC1=CC=CC=C1 POSICDHOUBKJKP-UHFFFAOYSA-N 0.000 description 1
- 235000019423 pullulan Nutrition 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- UPMFZISCCZSDND-JJKGCWMISA-M sodium gluconate Chemical compound [Na+].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O UPMFZISCCZSDND-JJKGCWMISA-M 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- PFUVRDFDKPNGAV-UHFFFAOYSA-N sodium peroxide Chemical compound [Na+].[Na+].[O-][O-] PFUVRDFDKPNGAV-UHFFFAOYSA-N 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- HIEHAIZHJZLEPQ-UHFFFAOYSA-M sodium;naphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 HIEHAIZHJZLEPQ-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 125000001935 tetracenyl group Chemical group C1(=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C12)* 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 1
- 235000019798 tripotassium phosphate Nutrition 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
【解決手段】砥粒、および端部形状改善剤を含み、前記端部形状改善剤は、炭素数1〜10のアルキル基で置換された芳香環を有する芳香族スルホン酸またはその塩である、研磨用組成物、あるいは砥粒、酸剤、および端部形状改善剤を含み、前記端部形状改善剤は、炭素数1〜10のアルキル基で置換された芳香環を有する芳香族スルホン酸またはその塩である、研磨用組成物である。
【選択図】なし
Description
本発明の第一実施形態の研磨用組成物は、砥粒、および端部形状改善剤を含み、前記端部形状改善剤は、炭素数1〜10のアルキル基で置換された芳香環を有する芳香族スルホン酸またはその塩である、研磨用組成物である。また、本発明の第二実施形態の研磨用組成物は、砥粒、酸剤、および端部形状改善剤を含み、前記端部形状改善剤は、炭素数1〜10のアルキル基で置換された芳香環を有する芳香族スルホン酸またはその塩である、研磨用組成物である。
ここに開示される研磨用組成物は、種々の材質および形状を有する研磨対象物の研磨に適用され得る。研磨対象物の材質は、例えば、シリコン、アルミニウム、ニッケル、タングステン、銅、タンタル、チタン、ステンレス鋼等の金属もしくは半金属またはこれらの合金、およびそれらの材料を使用した半導体配線に使用される薄膜;石英ガラス、アルミノシリケートガラス、ガラス状カーボン等のガラス状物質;アルミナ、シリカ、サファイア、窒化ケイ素、窒化タンタル、炭化チタン等のセラミック材料;炭化ケイ素、窒化ガリウム、ヒ化ガリウム等の化合物半導体基板材料;ポリイミド樹脂等の樹脂材料;等であり得る。例えば、ニッケルリンめっき層を有する基板やガラス材料基板、さらには下記のアルミニウム合金の表面にニッケルリンめっき層を有する磁気ディスク用基板(Ni−P基板)やガラス製磁気ディスク用基板に適しているが、これらに限定されない。また、これらのうち複数の材質により構成された研磨対象物であってもよい。研磨対象物の形状は特に制限されない。ここに開示される研磨用組成物は、例えば、板状や多面体状等の、平面を有する研磨対象物の研磨に好ましく適用され得る。
研磨用組成物中の砥粒は、研磨対象物を機械的に研磨する役割を担い、研磨用組成物による研磨対象物の研磨速度の向上に寄与する。
本発明の第二実施形態の研磨用組成物は、酸剤を含む。研磨用組成物中の酸剤は、研磨対象物を化学的に研磨する役割を担い、研磨用組成物による研磨対象物の研磨速度の向上に寄与する。
本発明の研磨用組成物は、アルカリ剤を含んでもよい。アルカリ剤の例としては、アルカリ金属塩(水酸化物塩を含む。以下同じ。)、アルカリ土類金属塩またはアンモニウム塩が挙げられる。より好適な例としては、水酸化カリウム、炭酸カリウム、炭酸水素カリウム、炭酸ナトリウム、炭酸アンモニウム、リン酸カリウム、リン酸水素カリウム、リン酸ナトリウム、リン酸水素ナトリウム、リン酸水素アンモニウム、クエン酸カリウム、シュウ酸カリウム、シュウ酸水素アンモニウム、酒石酸カリウム、酒石酸カリウムナトリウム、酒石酸アンモニウム、酒石酸水素アンモニウム、臭素酸カリウム、ソルビン酸カリウム、塩素酸カリウム、過塩素酸カリウム、硝酸カルシウム、グルコン酸カリウム、グルコン酸ナトリウム、コハク酸カリウム、フッ化カリウム、フッ化カルシウム、フッ化アンモニウム、過ヨウ素酸カリウム、フェリシアン化カリウム、酢酸アンモニウム、水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム、水酸化テトラブチルアンモニウムが挙げられる。なかでも、水酸化カリウム、炭酸カリウム、炭酸水素カリウム、炭酸ナトリウム、炭酸アンモニウム、リン酸カリウム、リン酸水素カリウム、リン酸ナトリウム、リン酸水素ナトリウム、リン酸水素アンモニウムがより好ましい。このようなアルカリ剤は、1種を単独でまたは2種以上を組み合わせて用いることができる。
研磨用組成物中の端部形状改善剤は、研磨用組成物を用いて研磨対象物を研磨したときに、研磨対象物の表面に発生する端面ダレ(ロールオフ)を低減する作用を有する。このような端面ダレが生じる理由としては、研磨対象物の端部に生じうる応力集中により端部の加工が進行してしまうことが要因と考えられる。研磨対象物が磁気ディスク用基板である場合、磁気ディスクの記録面積が減少してしまう。よって、研磨対象物の端面ダレを低減することにより磁気ディスクの記録面積を高めることができ、記録容量を高めることができる。
上記例示化合物のうち、特に好ましくは(1b)、(1c)、(2a)、(2b)、または(2c)であり、特により好ましくは(2a)、(2b)である。
本実施形態の研磨用組成物は、酸化剤を含んでいてもよい。酸化剤は、研磨対象物の表面を酸化する作用を有する。酸化剤によって研磨対象物の表面が酸化されると、砥粒による研磨対象物の機械的な研磨が促進され、その結果、研磨用組成物による研磨対象物の研磨速度が向上する。
また、本実施形態の研磨用組成物には、水溶性高分子をさらに添加してもよい。使用可能な水溶性高分子としては、特に制限はなく、アニオン性ポリマー、ノニオン性ポリマー、カチオン性ポリマー、両性ポリマーのいずれも使用可能である。そのなかでもアニオン性ポリマーを含むことが好ましい。アニオン性ポリマーには、カルボン酸系重合体、スルホン酸系重合体などがある。
本実施形態の研磨用組成物は、通常各成分の分散または溶解のための分散媒(溶媒)が用いられる。分散媒としては、有機溶媒、水が挙げられるが、分散媒として水を含むことが好ましい。また、分散媒は、各成分の分散または溶解のために、水と有機溶媒との混合物であってもよい。この場合、用いられる有機溶媒としては、水と混和する有機溶媒であるアセトン、アセトニトリル、エタノール、メタノール、イソプロパノール、グリセリン、エチレングリコール、プロピレングリコール等が挙げられる。また、これらの有機溶媒を水と混合せずに用いて、各成分を分散または溶解した後に、水と混合してもよい。これら有機溶媒は、単独でもまたは2種以上組み合わせても用いることができる。
本実施形態の研磨用組成物には本発明の効果を阻害しない範囲内において、必要に応じて防腐剤、防カビ剤、防食剤、消泡剤、キレート剤等を添加してもよい。例えば、防腐剤および防カビ剤としては、2−メチル−4−イソチアゾリン−3−オンや5−クロロ−2−メチル−4−イソチアゾリン−3−オン等のイソチアゾリン系防腐剤、パラオキシ安息香酸エステル類、およびフェノキシエタノール等が挙げられるが、これに制限されない。これら防腐剤、防カビ剤、防食剤、消泡剤、キレート剤等は、単独でもまたは2種以上混合して用いてもよい。
本実施形態の研磨用組成物のpHは、好ましくは1以上である。また、pHは好ましくは13以下であり、より好ましくは12以下である。研磨用組成物のpHが上記範囲内であれば、研磨用組成物の加工性に優れる。
本実施形態の研磨用組成物は、砥粒、および端部形状改善剤、さらに必要に応じてその他の成分を、分散媒中で混合することにより製造される。研磨用組成物を調製するに際しての各成分の混合順序は特に制限されず、例えば、分散媒に、分散媒以外の全ての成分を一括して添加して撹拌混合してもよいし、一成分ずつ添加し撹拌混合することを繰り返してもよい。また、各成分を混合する際の温度は特に制限されないが、10℃以上40℃以下が好ましく、溶解速度を上げるために加熱してもよい。また、混合時間も特に制限されない。
上述のように、第一および第二実施形態の研磨用組成物は、研磨対象物として磁気ディスク用基板を研磨するのに好適に用いられる。よって、本発明の第三実施形態は、第一および第二実施形態の研磨用組成物を用いて研磨対象物を研磨する工程を含む、磁気ディスク用基板の研磨方法である。また、本発明の第四実施形態は、第三実施形態の研磨方法を使用する磁気ディスク用基板の製造方法である。
砥粒としてSiO2(球状コロイダルシリカ(平均アスペクト比1.2)、平均一次粒子径17nm)を165g/L、酸剤として亜リン酸4.12g/L、端部形状改善剤として表1で示される化合物を表1に記載の量になるように、水に適宜に混合することにより実施例1〜3および比較例1〜6の研磨用組成物を調製した。実施例1〜3および比較例2〜6の研磨用組成物で用いた端部形状改善剤は、以下の市販品を用いたものである。また、比較例1では端部形状改善剤は、使用しなかった。
・モノイソプロピルナフタレンスルホン酸Na、分子量約272
・ジイソプロピルナフタレンスルホン酸Na、分子量約314
・POAアリルフェニルエーテルサルフェートNa、分子量約1,900
・ラウレス硫酸Na(ポリオキシエチレンラウリルエーテル硫酸Na)(2E.O.)、分子量約376
・POE(2)アルキル(C12−C14)スルホコハク酸2Na、分子量約512
・モノオレイン酸POEソルビタン(20E.O.)、分子量約1,309
・ポリアクリル酸Na、分子量約3,000
(研磨工程)
上記のようにして得られた実施例1〜3および比較例1〜6の研磨用組成物を用いて、研磨機として装置SPEEDFAM社製 両面研磨機9B−5Pを用いて下記条件で磁気ディスク用基板の研磨を行った。
研磨対象物:直径65mmの磁気ディスク用ガラス基板(アルミノシリケートガラス)
投入した研磨対象物(基板)の枚数:10枚
研磨機:SPEEDFAM社製 両面研磨機9B−5P
研磨パッド:スエードパッド
研磨荷重:75g/cm2
定盤回転数:40rpm
研磨用組成物の供給速度:150mL/分
取り代(両面):2μm
(評価)
実施例1〜3および比較例1〜6の研磨用組成物に対して、研磨用組成物の保存安定性の評価を行った。
実施例1〜3および比較例1〜6で得られた研磨用組成物を、以下の方法により保存安定性を評価した。
○:溶液に濁りなく、油分の浮遊もなし(変化無し)
×:溶液に濁りあり、もしくは油分の浮遊発生。
上記研磨工程において、実施例1〜3および比較例1〜6の研磨用組成物を用いた際のそれぞれの研磨速度を下記計算式により求めた。
研磨速度[μm/分]=研磨による基板の重量減少量[g]/(基板面積[cm2]×基板の密度[g/cm3]×研磨時間[分])×104
<端面ダレの評価>
端面ダレの評価として、「端部形状改善指標」を表1に示す。「端部形状改善指標」は下記方法に従って評価した。
Claims (7)
- 砥粒、および端部形状改善剤を含み、
前記端部形状改善剤は、炭素数1〜10のアルキル基で置換された芳香環を有する芳香族スルホン酸またはその塩である、研磨用組成物。 - 砥粒、酸剤、および端部形状改善剤を含み、
前記端部形状改善剤は、炭素数1〜10のアルキル基で置換された芳香環を有する芳香族スルホン酸またはその塩である、研磨用組成物。 - 前記端部形状改善剤が、下記式(1)および(2):
で表される芳香族スルホン酸またはその塩からなる群より選択される1種以上である、請求項1または2に記載の研磨用組成物。 - 前記端部形状改善剤が、下記式(2):
で表される芳香族スルホン酸またはその塩である、請求項3に記載の研磨用組成物。 - 磁気ディスク用基板を研磨するのに使用される、請求項1〜4のいずれか1項に記載の研磨用組成物。
- 請求項1〜5のいずれか1項に記載の研磨用組成物を用いて研磨対象物を研磨する工程を含む、磁気ディスク用基板の研磨方法。
- 請求項6に記載の研磨方法を使用する、磁気ディスク用基板の製造方法。
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