JP2017174997A - Multilayer substrate and method of manufacturing multilayer substrate - Google Patents

Multilayer substrate and method of manufacturing multilayer substrate Download PDF

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JP2017174997A
JP2017174997A JP2016060042A JP2016060042A JP2017174997A JP 2017174997 A JP2017174997 A JP 2017174997A JP 2016060042 A JP2016060042 A JP 2016060042A JP 2016060042 A JP2016060042 A JP 2016060042A JP 2017174997 A JP2017174997 A JP 2017174997A
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conductor pattern
planar conductor
multilayer substrate
insulating
multilayer
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邦明 用水
Kuniaki Yosui
邦明 用水
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To reduce the loss of a multilayer substrate using an interlayer connection conductor.SOLUTION: A multilayer substrate 10 includes a laminate 100, a first flat conductor pattern 201, a second flat conductor pattern 202, and an interlayer connection conductor 301. The laminate 100 is formed by laminating a first insulating base material 101 and a second insulating base material 102. The first flat conductor pattern 201 is formed on the first insulating base material 101, and the second flat conductor pattern 202 is formed on the second insulating base material 102. The interlayer connection conductor 301 connects the first flat conductor pattern 201 and the second flat conductor pattern 202. The interlayer connection conductor 301 includes a first portion 302 and a second portion 303. The first portion 302 is made of a solidified conductive paste. The second portion 303 has a conductivity higher than that of the solidified conductive paste. The second portion 303 protrudes from a surface of the second flat conductive pattern 202.SELECTED DRAWING: Figure 1

Description

本発明は、複数の平面導体パターンおよび層間接続導体が形成された多層基板、および、この多層基板の製造方法に関する。   The present invention relates to a multilayer substrate on which a plurality of planar conductor patterns and interlayer connection conductors are formed, and a method for manufacturing the multilayer substrate.

従来、各種の多層基板が実用化されている。例えば、特許文献１では、多層基板は、複数層の樹脂基材が積層されてなる。複数の樹脂基材には、それぞれ平面導体パターンが形成されている。平面導体パターンは、銅（Ｃｕ）等の導電率が高い材料からなる。   Conventionally, various multilayer substrates have been put into practical use. For example, in Patent Document 1, the multilayer substrate is formed by laminating a plurality of layers of resin base materials. A planar conductor pattern is formed on each of the plurality of resin substrates. The planar conductor pattern is made of a material having high conductivity such as copper (Cu).

これらの平面導体パターンは、積層方向に延びる層間接続導体によって接続されている。層間接続導体は、導電ペーストを固化したものである。   These planar conductor patterns are connected by an interlayer connection conductor extending in the stacking direction. The interlayer connection conductor is a solidified conductive paste.

特開２０１５−１７０６１５号公報JP2015-170615A

しかしながら、層間接続導体は、平面導体パターンに対する接着性等も考慮しなければならず、その材料の組成から、平面導体パターンよりも導電率が低い。このため、層間接続導体を用いる多層基板は、層間接続導体を用いない多層基板よりも伝送損失が大きくなってしまう。   However, the interlayer connection conductor must also take into account the adhesiveness to the planar conductor pattern, and its electrical conductivity is lower than that of the planar conductor pattern due to the composition of the material. For this reason, the multilayer substrate using the interlayer connection conductor has a larger transmission loss than the multilayer substrate not using the interlayer connection conductor.

したがって、本発明の目的は、層間接続導体による伝送損失を小さくすることにある。   Accordingly, an object of the present invention is to reduce transmission loss due to interlayer connection conductors.

この発明の多層基板は、積層体、第１平面導体パターン、第２平面導体パターン、および、層間接続導体を備える。積層体は、複数の絶縁性基材が積層されてなる。第１平面導体パターンは、積層体に形成されている。第２平面導体パターンは、積層体に形成されており、第１平面導体パターンに対して積層方向に離間している。層間接続導体は、第１平面導体パターンと第２平面導体パターンとを接続している。層間接続導体は、第１部分と第２部分とを備える。第１部分は、導電ペーストを固化してなる。第２部分は、固化された導電ペーストよりも導電率が高い。第２部分は、第２平面導体パターンの表面から突起している。   The multilayer substrate of the present invention includes a laminate, a first planar conductor pattern, a second planar conductor pattern, and an interlayer connection conductor. The laminate is formed by laminating a plurality of insulating substrates. The first planar conductor pattern is formed in the laminate. The 2nd plane conductor pattern is formed in the laminated body, and is spaced apart in the lamination direction with respect to the 1st plane conductor pattern. The interlayer connection conductor connects the first planar conductor pattern and the second planar conductor pattern. The interlayer connection conductor includes a first portion and a second portion. The first part is formed by solidifying the conductive paste. The second portion has a higher conductivity than the solidified conductive paste. The second portion protrudes from the surface of the second planar conductor pattern.

この構成では、第２部分を備えることによって、層間接続導体の伝送損失が、導電ペーストのみからなる層間接続導体と比較して低下する。   In this configuration, by providing the second portion, the transmission loss of the interlayer connection conductor is reduced as compared with the interlayer connection conductor made of only the conductive paste.

また、この発明の多層基板では、第１平面導体パターンと第２平面導体パターンとは、金属箔からなることが好ましい。   In the multilayer substrate of the present invention, the first planar conductor pattern and the second planar conductor pattern are preferably made of metal foil.

この構成では、第１平面導体パターンと第２平面導体パターンの導電率が向上し、伝送損失が低下する。   In this configuration, the conductivity of the first planar conductor pattern and the second planar conductor pattern is improved, and the transmission loss is reduced.

また、この発明の多層基板では、第２部分は、第２平面導体パターンと同じ材料であることが好ましい。   In the multilayer substrate of the present invention, the second portion is preferably made of the same material as the second planar conductor pattern.

この構成では、層間接続導体の一部が、第２平面導体パターンと同じ材料になり、第２部分と第２平面導体パターンとの接合強度が向上する。特に、平面導体パターンが金属箔の場合、導電率が高くなり、層間接続導体での伝送損失が低下する。また、層間接続導体の一部を、平面導体パターンと同時に形成できる。   In this configuration, a part of the interlayer connection conductor is made of the same material as that of the second planar conductor pattern, and the bonding strength between the second portion and the second planar conductor pattern is improved. In particular, when the planar conductor pattern is a metal foil, the conductivity is increased and the transmission loss in the interlayer connection conductor is reduced. Further, a part of the interlayer connection conductor can be formed simultaneously with the planar conductor pattern.

また、この発明の多層基板では、第２部分は、第１平面導体パターンに当接していることが好ましい。   In the multilayer substrate of the present invention, it is preferable that the second portion is in contact with the first planar conductor pattern.

この構成では、第１平面導体パターンと第２平面導体パターンとが第２部分を直接介して接続される部分を有する。これにより、層間接続導体の損失がさらに低下する。   In this configuration, the first planar conductor pattern and the second planar conductor pattern have a portion connected directly via the second portion. Thereby, the loss of an interlayer connection conductor further decreases.

また、この発明の多層基板では、第２部分は、溝または凹部を有することが好ましい。   In the multilayer substrate of the present invention, the second portion preferably has a groove or a recess.

この構成では、第２部分と第１部分との接触面積が大きくなり、第１部分と第２部分との接合強度、すなわち、第２部分を介した第１部分と第２平面導体パターンとの接合強度が向上する。   In this configuration, the contact area between the second part and the first part increases, and the bonding strength between the first part and the second part, that is, the first part and the second planar conductor pattern via the second part. Bonding strength is improved.

また、この発明の多層基板では、第２部分は、複数設けられていてもよい。   In the multilayer substrate of the present invention, a plurality of second portions may be provided.

この構成では、第１部分と第２部分との接触面の形状が多様になり、層間接続導体の伝送損失の低下、接合強度の向上が可能になる。   In this configuration, the shape of the contact surface between the first part and the second part becomes diversified, and the transmission loss of the interlayer connection conductor can be reduced and the bonding strength can be improved.

また、この発明の多層基板では、第１部分と第２部分とは、固相拡散層を介して接合されていることが好ましい。   In the multilayer substrate of the present invention, it is preferable that the first portion and the second portion are joined via a solid phase diffusion layer.

この構成では、第１部分と第２部分との接合強度が向上する。   In this configuration, the bonding strength between the first portion and the second portion is improved.

また、この発明の多層基板では、層間接続導体の径は、第１平面導体パターン側よりも第２平面導体パターン側の方が大きいことが好ましい。   In the multilayer substrate of the present invention, it is preferable that the diameter of the interlayer connection conductor is larger on the second planar conductor pattern side than on the first planar conductor pattern side.

この構成では、第１部分を形成する孔に第２部分を挿入し易くなり、層間接続導体が確実且つ容易に形成される。   In this configuration, the second portion can be easily inserted into the hole forming the first portion, and the interlayer connection conductor can be formed reliably and easily.

また、この発明の多層基板の製造方法では、次の各工程を有する。この製造方法は、第１絶縁性基材に第１平面導体パターンを形成し、第２絶縁性基材に第２平面導体パターンを形成する工程を有する。この製造方法は、第１絶縁性基材における第１平面導体パターンに重なる部分に、貫通孔を形成する工程を有する。この製造方法は、貫通孔に導電ペーストを流し込む工程を有する。この製造方法は、第２平面導体パターンが第２絶縁性基材に当接する面に対向する面を第２平面導体パターンの表面とし、該表面から突起する導電性の凸部を形成する工程を有する。この製造方法は、凸部が貫通孔内に収まるように、第１絶縁性基材と第２絶縁性基材とを積層する工程を有する。この製造方法は、この積層された状態において、第１絶縁性基材と第２絶縁性基材とを加熱プレスする工程を有する。   The method for manufacturing a multilayer substrate according to the present invention includes the following steps. This manufacturing method has the process of forming a 1st plane conductor pattern in a 1st insulating base material, and forming a 2nd plane conductor pattern in a 2nd insulating base material. This manufacturing method includes a step of forming a through hole in a portion of the first insulating substrate that overlaps the first planar conductor pattern. This manufacturing method includes a step of pouring a conductive paste into the through hole. This manufacturing method includes a step of forming a conductive convex portion protruding from a surface of the second planar conductor pattern, the surface facing the surface of the second planar conductor pattern contacting the second insulating substrate. Have. This manufacturing method includes a step of laminating the first insulating base material and the second insulating base material so that the convex portion is accommodated in the through hole. This manufacturing method includes a step of heat-pressing the first insulating base material and the second insulating base material in the laminated state.

この製造方法では、伝送損失の小さい層間接続導体を容易に製造できる。   With this manufacturing method, an interlayer connection conductor with a small transmission loss can be easily manufactured.

また、この発明の多層基板の製造方法では、第１平面導体パターンと第２平面導体パターンとは金属箔からなることが好ましい。   Moreover, in the manufacturing method of the multilayer board | substrate of this invention, it is preferable that a 1st planar conductor pattern and a 2nd planar conductor pattern consist of metal foil.

この製造方法では、伝送損失が低い多層基板が容易に製造される。   In this manufacturing method, a multilayer substrate with low transmission loss is easily manufactured.

また、この発明の多層基板の製造方法では、貫通孔は、第１平面導体パターンに当接する面の径よりも、開口面の径の方が大きいことが好ましい。   In the method for manufacturing a multilayer board according to the present invention, it is preferable that the diameter of the through hole of the through hole is larger than the diameter of the surface in contact with the first planar conductor pattern.

この製造方法では、第１部分を形成する貫通孔に第２部分を挿入し易くなる。   In this manufacturing method, it becomes easy to insert the second portion into the through hole forming the first portion.

また、この発明の多層基板の製造方法では、凸部を形成する工程は、第２平面導体パターンの表面に、導電性材料を部分的にメッキする工程であってもよい。   In the multilayer substrate manufacturing method of the present invention, the step of forming the convex portion may be a step of partially plating a conductive material on the surface of the second planar conductor pattern.

この製造方法では、凸部を容易に且つ所望の形状に形成できる。   In this manufacturing method, the convex portion can be easily formed into a desired shape.

また、この発明の多層基板の製造方法では、凸部を形成する工程は、第２平面導体パターンの表面に、該第２平面導体パターンと同じ材料を部分的に成長させる工程であってもよい。   In the multilayer substrate manufacturing method of the present invention, the step of forming the convex portion may be a step of partially growing the same material as the second planar conductor pattern on the surface of the second planar conductor pattern. .

この製造方法でも、凸部を容易に且つ所望の形状に形成できる。   Even in this manufacturing method, the convex portion can be easily formed into a desired shape.

また、この発明の多層基板の製造方法では、凸部を形成する工程は、第２平面導体パターンを、部分的にエッチングする工程であってもよい。   In the method for manufacturing a multilayer substrate according to the present invention, the step of forming the convex portion may be a step of partially etching the second planar conductor pattern.

この製造方法でも、凸部を容易に且つ所望の形状に形成できる。   Even in this manufacturing method, the convex portion can be easily formed into a desired shape.

この発明によれば、層間接続導体による損失が小さくなり、層間接続導体を用いた多層基板の損失を小さくできる。   According to this invention, the loss due to the interlayer connection conductor is reduced, and the loss of the multilayer substrate using the interlayer connection conductor can be reduced.

（Ａ）は本発明の第１の実施形態に係る多層基板の一部を拡大した側面断面図であり、（Ｂ）は本発明の第１の実施形態に係る多層基板の一部を拡大した平面図であり、（Ｃ）は本発明の第１の実施形態に係る多層基板の一部を拡大した積層時の側面断面図である。(A) is side surface sectional drawing to which a part of multilayer substrate concerning the 1st embodiment of the present invention was expanded, (B) was expanded a part of multilayer substrate concerning the 1st embodiment of the present invention. It is a top view and (C) is a side sectional view at the time of lamination which expanded a part of multilayer board concerning a 1st embodiment of the present invention. 本発明の第１の実施形態に係る多層基板の製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the multilayer substrate which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る多層基板の製造方法における各工程での側面断面図である。It is side surface sectional drawing in each process in the manufacturing method of the multilayer substrate which concerns on the 1st Embodiment of this invention. 本発明の第２の実施形態に係る多層基板の一部を拡大した側面断面図である。It is side surface sectional drawing to which a part of multilayer substrate concerning the 2nd Embodiment of this invention was expanded. 本発明の第２の実施形態に係る多層基板の製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the multilayer board | substrate which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態に係る多層基板の製造方法における各工程での側面断面図である。It is side surface sectional drawing in each process in the manufacturing method of the multilayer board | substrate which concerns on the 2nd Embodiment of this invention. 本発明の第３の実施形態に係る多層基板の製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the multilayer substrate which concerns on the 3rd Embodiment of this invention. 本発明の第３の実施形態に係る多層基板の製造方法における各工程での側面断面図である。It is side surface sectional drawing in each process in the manufacturing method of the multilayer substrate which concerns on the 3rd Embodiment of this invention. （Ａ）は本発明の第４の実施形態に係る多層基板の一部を拡大した側面断面図であり、（Ｂ）は本発明の第４の実施形態に係る多層基板の一部を拡大した平面図であり、（Ｃ）は本発明の第４の実施形態に係る多層基板の派生例の一部を拡大した平面図である。(A) is side surface sectional drawing to which a part of multilayer substrate concerning the 4th embodiment of the present invention was expanded, (B) was expanded a part of multilayer substrate concerning the 4th embodiment of the present invention. It is a top view, (C) is the top view which expanded a part of derivative example of the multilayer substrate based on the 4th Embodiment of this invention. 本発明の第５の実施形態に係る多層基板の一部を拡大した側面断面図である。It is side surface sectional drawing to which a part of multilayer board | substrate concerning the 5th Embodiment of this invention was expanded.

本発明の第１の実施形態に係る多層基板、および、多層基板の製造方法について、図を参照して説明する。図１（Ａ）は、本発明の第１の実施形態に係る多層基板の一部を拡大した側面断面図である。図１（Ｂ）は、本発明の第１の実施形態に係る多層基板の一部を拡大した平面図である。図１（Ｃ）は、本発明の第１の実施形態に係る多層基板の一部を拡大した積層時の側面断面図である。   A multilayer substrate and a method for manufacturing the multilayer substrate according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1A is an enlarged side sectional view of a part of the multilayer substrate according to the first embodiment of the present invention. FIG. 1B is an enlarged plan view of a part of the multilayer substrate according to the first embodiment of the present invention. FIG. 1C is a side cross-sectional view at the time of lamination in which a part of the multilayer substrate according to the first embodiment of the present invention is enlarged.

図１（Ａ）、図１（Ｂ）、図１（Ｃ）に示すように、多層基板１０は、積層体１００、第１平面導体パターン２０１、第２平面導体パターン２０２、および、層間接続導体３０１を備える。図１（Ｃ）に示すように、積層体１００は、第１絶縁性基材１０１と第２絶縁性基材１０２とを備える。   As shown in FIG. 1A, FIG. 1B, and FIG. 1C, the multilayer substrate 10 includes a multilayer body 100, a first planar conductor pattern 201, a second planar conductor pattern 202, and an interlayer connection conductor. 301 is provided. As illustrated in FIG. 1C, the stacked body 100 includes a first insulating substrate 101 and a second insulating substrate 102.

第１絶縁性基材１０１と第２絶縁性基材１０２とは、同じ材料からなる。第１絶縁性基材１０１と第２絶縁性基材１０２は、熱可塑性樹脂からなり、例えば、液晶ポリマである。なお、第１絶縁性基材１０１と第２絶縁性基材１０２とは、熱可塑性樹脂でなくてもよく、絶縁体であればよい。   The first insulating substrate 101 and the second insulating substrate 102 are made of the same material. The first insulating substrate 101 and the second insulating substrate 102 are made of a thermoplastic resin and are, for example, a liquid crystal polymer. The first insulating substrate 101 and the second insulating substrate 102 do not have to be a thermoplastic resin, but may be an insulator.

第１絶縁性基材１０１と第２絶縁性基材１０２とは、それぞれの表面が平行になり、且つ、第１絶縁性基材１０１の裏面と第２絶縁性基材１０２の表面とが当接するように、積層されている。なお、多層基板１０は第１絶縁性基材１０１と第２絶縁性基材１０２以外の１以上の絶縁性基材が、さらに積層されていてもよい。   The first insulating substrate 101 and the second insulating substrate 102 are parallel to each other, and the back surface of the first insulating substrate 101 and the surface of the second insulating substrate 102 are in contact with each other. It is laminated so that it may touch. The multilayer substrate 10 may be further laminated with one or more insulating substrates other than the first insulating substrate 101 and the second insulating substrate 102.

第１平面導体パターン２０１は、第１絶縁性基材１０１の表面に形成されている。第２平面導体パターン２０２は、第２絶縁性基材１０２の表面に形成されている。すなわち、第１平面導体パターン２０１と第２平面導体パターン２０２とは、第１絶縁性基材１０１を挟んで離間している。言い換えれば、第１平面導体パターン２０１と第２平面導体パターン２０２とは、積層方向に離間して配置されている。第１平面導体パターン２０１と第２平面導体パターン２０２とは、積層体１００を平面視して（第１絶縁性基材１０１と第２絶縁性基材１０２との積層方向に視て）、部分的に重なっている。   The first planar conductor pattern 201 is formed on the surface of the first insulating substrate 101. The second planar conductor pattern 202 is formed on the surface of the second insulating substrate 102. That is, the first planar conductor pattern 201 and the second planar conductor pattern 202 are separated with the first insulating substrate 101 interposed therebetween. In other words, the first planar conductor pattern 201 and the second planar conductor pattern 202 are spaced apart from each other in the stacking direction. The first planar conductor pattern 201 and the second planar conductor pattern 202 are partly viewed in a plan view of the multilayer body 100 (as viewed in the stacking direction of the first insulating base material 101 and the second insulating base material 102). Overlapping.

第１平面導体パターン２０１と第２平面導体パターン２０２とは、それぞれ銅（Ｃｕ）等の導電率の高い材料からなる。第１平面導体パターン２０１と第２平面導体パターン２０２とは、銅箔等の金属箔であることが好ましい。この場合、導電ペーストを固化してなる導体パターンよりも導電率が向上する。   The first planar conductor pattern 201 and the second planar conductor pattern 202 are each made of a material having high conductivity such as copper (Cu). The first planar conductor pattern 201 and the second planar conductor pattern 202 are preferably metal foils such as copper foil. In this case, the conductivity is improved as compared with the conductor pattern formed by solidifying the conductive paste.

層間接続導体３０１は、積層体１００を平面視して、第１平面導体パターン２０１と第２平面導体パターン２０２とが重なる領域内に形成されている。層間接続導体３０１は、積層体１００における第１絶縁性基材１０１にからなる部分に形成されている。層間接続導体３０１は、第１部分３０２と第２部分３０３とからなる。   The interlayer connection conductor 301 is formed in a region where the first planar conductor pattern 201 and the second planar conductor pattern 202 overlap when the multilayer body 100 is viewed in plan. The interlayer connection conductor 301 is formed in a portion of the multilayer body 100 that is composed of the first insulating base material 101. The interlayer connection conductor 301 includes a first portion 302 and a second portion 303.

第１部分３０２は、貫通孔ＶＨ３０２内の導電ペーストＰ３０２が固化（金属化）することによって形成されている。導電ペーストＰ３０２には、錫（Ｓｎ）や銅（Ｃｕ）を含む導電粒子と樹脂成分とを混練した材料が用いられている。導電粒子は、銀（Ａｇ）、モリブデン（Ｍｏ）、ニッケル（Ｎｉ）等を含んでいてもよい。   The first portion 302 is formed by solidifying (metalizing) the conductive paste P302 in the through hole VH302. For the conductive paste P302, a material obtained by kneading conductive particles containing tin (Sn) or copper (Cu) and a resin component is used. The conductive particles may contain silver (Ag), molybdenum (Mo), nickel (Ni), or the like.

図１（Ｃ）に示すように、導電ペーストＰ３０２は、第１絶縁性基材１０１に形成された貫通孔ＶＨ３０２内に流し込まれている。貫通孔ＶＨ３０２は、第１絶縁性基材１０１を厚み方向に貫通した孔である。貫通孔ＶＨ３０２は、第１絶縁性基材１０１を平面視して、第１平面導体パターン２０１に重なっている。これにより、貫通孔ＶＨ３０２の一方の開口が塞がれ、流動性を有する導電ペーストＰ３０２は、貫通孔ＶＨ３０２内に保持されている。   As shown in FIG. 1C, the conductive paste P302 is poured into the through hole VH302 formed in the first insulating substrate 101. The through hole VH302 is a hole that penetrates the first insulating substrate 101 in the thickness direction. The through hole VH302 overlaps the first planar conductor pattern 201 when the first insulating substrate 101 is viewed in plan. Thereby, one opening of the through hole VH302 is closed, and the conductive paste P302 having fluidity is held in the through hole VH302.

第２部分３０３は、第２平面導体パターン２０２の表面から突起する凸部である。第２部分３０３の導電率は、第１部分３０２の導電率よりも高い。例えば、第２部分３０３は、第２平面導体パターン２０２の表面にメッキ形成された銅（Ｃｕ）やニッケル（Ｎｉ）等を含む導体からなる。   The second portion 303 is a convex portion protruding from the surface of the second planar conductor pattern 202. The conductivity of the second portion 303 is higher than the conductivity of the first portion 302. For example, the second portion 303 is made of a conductor containing copper (Cu), nickel (Ni), or the like plated on the surface of the second planar conductor pattern 202.

図１（Ａ）、図１（Ｂ）、図１（Ｃ）に示すように、第２部分３０３は、貫通孔ＶＨ３０２内に配置されている。そして、図１（Ａ）に示すように、第２部分３０３は、第１部分３０２に当接している。より具体的には、第２部分３０３における第２平面導体パターン２０２に当接する面を除く全面は、第１部分３０２に当接している。   As shown in FIG. 1A, FIG. 1B, and FIG. 1C, the second portion 303 is disposed in the through hole VH302. As shown in FIG. 1A, the second portion 303 is in contact with the first portion 302. More specifically, the entire surface of the second portion 303 except the surface that contacts the second planar conductor pattern 202 is in contact with the first portion 302.

第１部分３０２と第２部分３０３とは、例えば、錫（Ｓｎ）と銅（Ｃｕ）とからなる固相拡散層を形成して接合している。この固相拡散層は、多層基板製造時の複数の絶縁性基材を加熱プレスする工程において、第１部分３０２に含まれるＳｎ成分と第２部分３０３に含まれるＣｕ成分とが固相拡散し、例えばＣｕ６Ｓｎ５のような物質を生成することによって形成される。また、第１部分３０２と第１平面導体パターン２０１および第２平面導体パターン２０２とは、固相拡散層を形成して接合している。この固相拡散層は、多層基板製造時の複数の絶縁性基材を加熱プレスする工程において、第１部分３０２に含まれるＳｎ成分と第１平面導体パターン２０１および第２平面導体パターン２０２に含まれるＣｕ成分とが固相拡散し、例えばＣｕ６Ｓｎ５のような物質を生成することによって形成される。 The first portion 302 and the second portion 303 are joined by forming a solid phase diffusion layer made of, for example, tin (Sn) and copper (Cu). In this solid phase diffusion layer, the Sn component contained in the first portion 302 and the Cu component contained in the second portion 303 are solid phase diffused in the step of heat-pressing a plurality of insulating base materials during the production of the multilayer substrate. For example, by producing a material such as Cu 6 Sn 5 . Further, the first portion 302, the first planar conductor pattern 201, and the second planar conductor pattern 202 are joined by forming a solid phase diffusion layer. This solid phase diffusion layer is included in the Sn component included in the first portion 302 and the first planar conductor pattern 201 and the second planar conductor pattern 202 in the step of heat-pressing a plurality of insulating base materials during the production of the multilayer substrate. It is formed by solid-phase diffusion with the Cu component to be produced, for example, to generate a substance such as Cu 6 Sn 5 .

この構成によって、第１部分３０２と第２部分３０３との接合強度が高くなり、且つ、層間接続導体３０１と第１平面導体パターン２０１および第２平面導体パターン２０２との接合強度も高くなる。したがって、接合信頼性の高い多層基板１０を実現できる。   With this configuration, the bonding strength between the first portion 302 and the second portion 303 is increased, and the bonding strength between the interlayer connection conductor 301 and the first planar conductor pattern 201 and the second planar conductor pattern 202 is also increased. Therefore, the multilayer substrate 10 with high bonding reliability can be realized.

また、この構成によって、第１平面導体パターン２０１と第２平面導体パターン２０２とを接続する層間接続導体３０１は、第１部分３０２と第２部分３０３とを介して接続される部分を有する。これにより、層間接続導体が第１部分３０２のみ（固化された導電ペーストからなる部分のみ）からなる従来の態様と比較して、層間接続導体３０１の伝送損失が低くなる。したがって、多層基板１０の伝送損失が低くなる。   Also, with this configuration, the interlayer connection conductor 301 that connects the first planar conductor pattern 201 and the second planar conductor pattern 202 has a portion that is connected via the first portion 302 and the second portion 303. Thereby, the transmission loss of the interlayer connection conductor 301 is reduced as compared with the conventional mode in which the interlayer connection conductor is composed only of the first portion 302 (only the portion made of the solidified conductive paste). Therefore, the transmission loss of the multilayer substrate 10 is reduced.

なお、第２部分３０３を形成するメッキ導体は、銅（Ｃｕ）やニッケル（Ｎｉ）に限らず、他の導電性材料であってもよく、複数の導電性材料を層状にしてもよい。いずれにしても、第１部分３０２を形成する導電ペーストの導体と金属間化合物をつくることが容易な導体であることが好ましい。これにより、第１部分３０２と第２部分３０３とが固相拡散接合され、接合強度が向上する。   The plated conductor forming the second portion 303 is not limited to copper (Cu) or nickel (Ni), but may be another conductive material, or a plurality of conductive materials may be layered. In any case, it is preferable that the conductor of the conductive paste forming the first portion 302 and the conductor that can easily form an intermetallic compound are used. Thereby, the first portion 302 and the second portion 303 are solid phase diffusion bonded, and the bonding strength is improved.

また、第２部分３０３の先端側（第２平面導体パターン２０２側と反対側）の面の面積と、第２部分３０３の第２平面導体パターン２０２側の面の面積とは、同じであってもよい。しかしながら、第２部分３０３の先端側の面の面積は、第２部分３０３の第２平面導体パターン２０２側の面の面積よりも小さいことが好ましい。この構成によって、第２部分３０３は、側面視してテーパ状となり、第１部分３０２と第２部分３０３との接触面積が広くなる。これにより、第１部分３０２と第２部分３０３との接合強度がさらに向上する。また、第２部分３０３を、メッキによって所望の形状に形成しやすい。また、第２部分３０３を第１部分３０２となる導電ペーストに挿入しやすい。   The area of the surface of the second portion 303 on the tip side (opposite side of the second planar conductor pattern 202) and the area of the surface of the second portion 303 on the second planar conductor pattern 202 side are the same. Also good. However, the area of the surface of the second portion 303 on the tip side is preferably smaller than the area of the surface of the second portion 303 on the second planar conductor pattern 202 side. With this configuration, the second portion 303 is tapered in a side view, and the contact area between the first portion 302 and the second portion 303 is increased. Thereby, the joint strength between the first portion 302 and the second portion 303 is further improved. In addition, the second portion 303 can be easily formed into a desired shape by plating. Further, the second portion 303 can be easily inserted into the conductive paste that becomes the first portion 302.

同様に、第１部分３０２すなわち貫通孔ＶＨ３０２は、第１平面導体パターン２０１に当接する面の径よりも、この反対側の貫通孔ＶＨ３０２の開口面（積層状態で第２平面導体パターン２０２に当接する面）の径の方が大きいことが好ましい。言い換えれば、第１部分３０２すなわち貫通孔ＶＨ３０２は、第１平面導体パターン２０１に当接する面の面積よりも、この反対側の貫通孔ＶＨ３０２の開口面（積層状態で第２平面導体パターン２０２に当接する面）の面積の方が大きいことが好ましい。これにより、第２部分３０３を貫通孔ＶＨ３０２内に挿入し易く、層間接続導体３０１を確実に形成し易い。また、この形状は、レーザ等による孔空けの工程によって、容易に実現ができる。   Similarly, the first portion 302, that is, the through hole VH302, is opposed to the opening surface of the through hole VH302 opposite to the diameter of the surface in contact with the first planar conductor pattern 201 (laminated to the second planar conductor pattern 202 in the laminated state). It is preferable that the diameter of the contacting surface) is larger. In other words, the first portion 302, that is, the through hole VH302, is opposed to the opening surface of the through hole VH302 opposite to the area of the surface in contact with the first flat conductor pattern 201 (in the stacked state, the second flat conductor pattern 202 is contacted). The area of the contact surface) is preferably larger. Thereby, it is easy to insert the second portion 303 into the through hole VH302, and it is easy to reliably form the interlayer connection conductor 301. Further, this shape can be easily realized by a hole making process using a laser or the like.

このような構成からなる多層基板１０は、次に示すような製造方法によって形成できる。図２は、本発明の第１の実施形態に係る多層基板の製造方法を示すフローチャートである。図３は、本発明の第１の実施形態に係る多層基板の製造方法における各工程での側面断面図である。図３（Ａ）は、図２の工程Ｓ１０１の状態を示し、図３（Ｂ）は、図２の工程Ｓ１１１の状態を示し、図３（Ｃ）は、図２の工程Ｓ１２１の状態を示す。図３（Ｄ）は、図２の工程Ｓ１２２の状態を示し、図３（Ｅ）は、図２の工程Ｓ１０３の状態を示す。図３（Ａ）は、第２絶縁性基材１０２のみを図示し、第１絶縁性基材１０１の図示は省略している。   The multilayer substrate 10 having such a configuration can be formed by the following manufacturing method. FIG. 2 is a flowchart showing a method for manufacturing a multilayer substrate according to the first embodiment of the present invention. FIG. 3 is a side cross-sectional view at each step in the method for manufacturing a multilayer substrate according to the first embodiment of the present invention. 3A shows the state of step S101 in FIG. 2, FIG. 3B shows the state of step S111 in FIG. 2, and FIG. 3C shows the state of step S121 in FIG. . FIG. 3D shows the state of step S122 in FIG. 2, and FIG. 3E shows the state of step S103 in FIG. FIG. 3A shows only the second insulating base material 102, and the first insulating base material 101 is not shown.

第１絶縁性基材１０１に第１平面導体パターン２０１を形成し、第２絶縁性基材１０２に第２平面導体パターン２０２を形成する（Ｓ１０１）。第１平面導体パターン２０１と第２平面導体パターン２０２の形成は、例えば、第１絶縁性基材１０１および第２絶縁性基材１０２の片面全面に貼られた金属箔をフォトリソグラフィ等によってパターニングすることによって得られる。   The first planar conductor pattern 201 is formed on the first insulating substrate 101, and the second planar conductor pattern 202 is formed on the second insulating substrate 102 (S101). For example, the first planar conductor pattern 201 and the second planar conductor pattern 202 are formed by patterning a metal foil attached to the entire surface of one side of the first insulating substrate 101 and the second insulating substrate 102 by photolithography or the like. Can be obtained.

第２平面導体パターン２０２の表面（第２平面導体パターン２０２が第２絶縁性基材１０２に当接する面に対向する面）に凸部をＣｕメッキ形成することで、第２部分３０３を形成する（Ｓ１１１）。このような製造工程を用いることによって、第２部分３０３を、容易に且つ所望の形状で形成できる。   A convex portion is formed by Cu plating on the surface of the second planar conductor pattern 202 (the surface facing the surface where the second planar conductor pattern 202 abuts against the second insulating substrate 102), thereby forming the second portion 303. (S111). By using such a manufacturing process, the second portion 303 can be easily formed in a desired shape.

第１絶縁性基材１０１に、レーザ等によって貫通孔ＶＨ３０２を形成する（Ｓ１２１）。貫通孔ＶＨ３０２内に、Ｓｎを含む導電ペーストＰ３０２を流し込む（Ｓ１２２）。この際、導電ペーストＰ３０２は、貫通孔ＶＨ３０２に完全に充填しなくてもよい。逆に、図３（Ｄ）に示すように、貫通孔ＶＨ３０２の開口面から所定の凹みができるように、導電ペーストＰ３０２を貫通孔ＶＨ３０２に流し込むとよい。これにより、後述の積層の工程において、貫通孔ＶＨ３０２内に第２部分３０３が挿入された際に、導電ペーストＰ３０２が貫通孔ＶＨ３０２から溢れ出すことを抑制できる。したがって、積層体１００内での不要な短絡を抑制できる。   A through-hole VH302 is formed in the first insulating substrate 101 with a laser or the like (S121). A conductive paste P302 containing Sn is poured into the through hole VH302 (S122). At this time, the conductive paste P302 may not be completely filled in the through hole VH302. Conversely, as shown in FIG. 3D, the conductive paste P302 may be poured into the through-hole VH302 so that a predetermined dent is formed from the opening surface of the through-hole VH302. Thereby, it is possible to prevent the conductive paste P302 from overflowing from the through hole VH302 when the second portion 303 is inserted into the through hole VH302 in the laminating process described later. Therefore, an unnecessary short circuit in the stacked body 100 can be suppressed.

複数の絶縁性基材（第１絶縁性基材１０１と第２絶縁性基材１０２）を積層する（Ｓ１０３）。この際、図３（Ｅ）に示すように、第２部分３０３が貫通孔ＶＨ３０２内に収まるように、第１絶縁性基材１０１と第２絶縁性基材１０２とを積層する。なお、第１絶縁性基材１０１と第２絶縁性基材１０２以外の１以上の絶縁性基材をさらに積層してもよい。   A plurality of insulating substrates (first insulating substrate 101 and second insulating substrate 102) are stacked (S103). At this time, as shown in FIG. 3E, the first insulating base material 101 and the second insulating base material 102 are laminated so that the second portion 303 is accommodated in the through hole VH302. One or more insulating substrates other than the first insulating substrate 101 and the second insulating substrate 102 may be further laminated.

第１絶縁性基材１０１と第２絶縁性基材１０２とを含む複数の絶縁性基材が積層された積層体を加熱プレスする（Ｓ１０４）。この加熱プレスによって、第１絶縁性基材１０１と第２絶縁性基材１０２とを含む複数の絶縁性基材が接着する。また、導電ペーストＰ３０２が固化して第１部分３０２となる。さらに、加熱プレスの熱により、第１部分３０２と第２部分３０３との間に、ＳｎとＣｕとからなる固相拡散層が形成され、第１部分３０２と第２平面導体パターン２０２との間に、ＳｎとＣｕとからなる固相拡散層が形成される。   A laminated body in which a plurality of insulating base materials including the first insulating base material 101 and the second insulating base material 102 are stacked is heated and pressed (S104). By this heating press, a plurality of insulating substrates including the first insulating substrate 101 and the second insulating substrate 102 are bonded. Further, the conductive paste P302 is solidified to form the first portion 302. Furthermore, a solid phase diffusion layer made of Sn and Cu is formed between the first portion 302 and the second portion 303 by the heat of the hot press, and between the first portion 302 and the second planar conductor pattern 202. In addition, a solid phase diffusion layer made of Sn and Cu is formed.

このように、本実施形態の製造方法を用いることによって、接合の信頼性が高く、層間接続導体による伝送損失が抑制された多層基板１０を容易に製造できる。   Thus, by using the manufacturing method of the present embodiment, it is possible to easily manufacture the multilayer substrate 10 with high bonding reliability and suppressed transmission loss due to the interlayer connection conductor.

次に、第２の実施形態に係る多層基板および多層基板の製造方法について、図を参照して説明する。図４は、本発明の第２の実施形態に係る多層基板の一部を拡大した側面断面図である。   Next, a multilayer substrate and a method for manufacturing the multilayer substrate according to the second embodiment will be described with reference to the drawings. FIG. 4 is an enlarged side sectional view of a part of the multilayer substrate according to the second embodiment of the present invention.

本実施形態に係る多層基板１０Ａは、第１の実施形態に係る多層基板１０に対して、層間接続導体３０１Ａの構成において異なる。多層基板１０Ａの他の構成は、第１の実施形態に係る多層基板１０と同じであり、同じ箇所の説明は省略する。   The multilayer substrate 10A according to the present embodiment differs from the multilayer substrate 10 according to the first embodiment in the configuration of the interlayer connection conductor 301A. Other configurations of the multilayer substrate 10A are the same as those of the multilayer substrate 10 according to the first embodiment, and the description of the same portions is omitted.

層間接続導体３０１Ａの第１部分３０２は、第１の実施形態に係る層間接続導体３０１の第１部分３０２と同じであり、固化された導電ペーストからなる。   The first portion 302 of the interlayer connection conductor 301A is the same as the first portion 302 of the interlayer connection conductor 301 according to the first embodiment, and is made of a solidified conductive paste.

第２平面導体パターン２０２Ａは、第１の実施形態に係る第２平面導体パターン２０２と同じ形状である。   The second planar conductor pattern 202A has the same shape as the second planar conductor pattern 202 according to the first embodiment.

凸部２２２Ａは、第２平面導体パターン２０２Ａの表面を部分的に突起させたものである。凸部２２２Ａは、第２平面導体パターン２０２Ａの表面から部分的に第２平面導体パターン２０２Ａの材料を成長させることによって、実現される。例えば、第２平面導体パターン２０２Ａの表面に、第２平面導体パターン２０２Ａと同じ材料を部分的にスパッタリングすることで、成長させる。なお、成長の方法は他の方法であってもよい。   The convex portion 222A is obtained by partially projecting the surface of the second planar conductor pattern 202A. The convex portion 222A is realized by growing the material of the second planar conductor pattern 202A partially from the surface of the second planar conductor pattern 202A. For example, the same material as that of the second planar conductor pattern 202A is partially sputtered on the surface of the second planar conductor pattern 202A so as to be grown. The growth method may be other methods.

凸部２２２Ａは、貫通孔ＶＨ３０２内に配置されている。多層基板１０Ａでは、この凸部２２２Ａが、層間接続導体３０１Ａの第２部分となる。   The convex portion 222A is disposed in the through hole VH302. In the multilayer substrate 10A, the convex portion 222A is the second portion of the interlayer connection conductor 301A.

凸部２２２Ａは、第２平面導体パターン２０２Ａと一体であるので、層間接続導体３０１Ａの第２部分となる凸部２２２Ａの導電率は、第１部分３０２の導電率よりも高い。   Since the convex portion 222A is integral with the second planar conductor pattern 202A, the conductivity of the convex portion 222A serving as the second portion of the interlayer connection conductor 301A is higher than the conductivity of the first portion 302.

この構成であっても、第１の実施形態に多層基板１０と同様に、層間接続導体３０１Ａでの接合信頼性が高く、伝送損失が低い多層基板１０Ａを実現できる。さらに、この構成では、第２平面導体パターン２０２Ａと凸部２２２Ａとが一体であるので、第１の実施形態の多層基板１０にあった層間接続導体３０１の第２部分３０３と第２平面導体パターン２０２との接合界面は存在しない。したがって、さらに接合信頼性が高くなる。   Even with this configuration, similarly to the multilayer substrate 10 in the first embodiment, it is possible to realize the multilayer substrate 10A with high bonding reliability in the interlayer connection conductor 301A and low transmission loss. Further, in this configuration, since the second planar conductor pattern 202A and the convex portion 222A are integral, the second portion 303 of the interlayer connection conductor 301 and the second planar conductor pattern that are in the multilayer substrate 10 of the first embodiment. There is no bonding interface with 202. Accordingly, the bonding reliability is further increased.

このような構成からなる多層基板１０Ａは、次に示すような製造方法によって形成できる。図５は、本発明の第２の実施形態に係る多層基板の製造方法を示すフローチャートである。図６は、本発明の第２の実施形態に係る多層基板の製造方法における各工程での側面断面図である。図６（Ａ）は、図５の工程Ｓ１０１の状態を示し、図６（Ｂ）は、図５の工程Ｓ１３１の状態を示し、図６（Ｃ）は、図５の工程Ｓ１２１の状態を示す。図６（Ｄ）は、図５の工程Ｓ１２２の状態を示し、図６（Ｅ）は、図５の工程Ｓ１０３の状態を示す。図６（Ａ）は、第２絶縁性基材１０２のみを図示し、第１絶縁性基材１０１の図示は省略している。   The multilayer substrate 10A having such a configuration can be formed by the following manufacturing method. FIG. 5 is a flowchart showing a method for manufacturing a multilayer substrate according to the second embodiment of the present invention. FIG. 6 is a side cross-sectional view at each step in the method for manufacturing a multilayer substrate according to the second embodiment of the present invention. 6A shows the state of step S101 in FIG. 5, FIG. 6B shows the state of step S131 in FIG. 5, and FIG. 6C shows the state of step S121 in FIG. . FIG. 6D shows the state of step S122 in FIG. 5, and FIG. 6E shows the state of step S103 in FIG. FIG. 6A shows only the second insulating base material 102, and the first insulating base material 101 is not shown.

第１絶縁性基材１０１に第１平面導体パターン２０１を形成し、第２絶縁性基材１０２に第２平面導体パターン２０２Ａを形成する（Ｓ１０１）。   The first planar conductor pattern 201 is formed on the first insulating substrate 101, and the second planar conductor pattern 202A is formed on the second insulating substrate 102 (S101).

第２平面導体パターン２０２の表面から、第２平面導体パターン２０２と同じ材料（例えば、Ｃｕ）の突起を部分的に成長させることによって、凸部２２２Ａを形成する（Ｓ１３１）。このような製造工程を用いることによって、凸部２２２Ａを、容易に且つ所望の形状で形成できる。   Projections 222A are formed by partially growing protrusions of the same material (for example, Cu) as the second planar conductor pattern 202 from the surface of the second planar conductor pattern 202 (S131). By using such a manufacturing process, the convex portion 222A can be easily formed in a desired shape.

第１の実施形態に係る多層基板の製造方法と同様に、第１絶縁性基材１０１に、レーザ等によって貫通孔ＶＨ３０２を形成する（Ｓ１２１）。貫通孔ＶＨ３０２に導電ペーストＰ３０２を流し込む（Ｓ１２２）。   Similar to the method of manufacturing the multilayer substrate according to the first embodiment, the through hole VH302 is formed in the first insulating base 101 by a laser or the like (S121). The conductive paste P302 is poured into the through hole VH302 (S122).

複数の絶縁性基材（第１絶縁性基材１０１と第２絶縁性基材１０２）を含む複数の絶縁性基材を積層する（Ｓ１０３）。この際、図６（Ｅ）に示すように、凸部２２２Ａが貫通孔ＶＨ３０２内に収まるように、第１絶縁性基材１０１と第２絶縁性基材１０２とを含む複数の絶縁性基材を積層する。   A plurality of insulating substrates including a plurality of insulating substrates (first insulating substrate 101 and second insulating substrate 102) are stacked (S103). At this time, as shown in FIG. 6 (E), a plurality of insulating base materials including the first insulating base material 101 and the second insulating base material 102 so that the convex portions 222A are accommodated in the through holes VH302. Are laminated.

第１絶縁性基材１０１と第２絶縁性基材１０２とを含む複数の絶縁性基材が積層された積層体を加熱プレスする（Ｓ１０４）。この加熱プレスによって、第１絶縁性基材１０１と第２絶縁性基材１０２とが接着する。また、導電ペーストＰ３０２が固化して第１部分３０２となる。さらに、第１部分３０２と凸部２２２Ａとの間に固相拡散層が形成され、第１部分３０２と第２平面導体パターン２０２Ａとの間に固相拡散層が形成される。   A laminated body in which a plurality of insulating base materials including the first insulating base material 101 and the second insulating base material 102 are stacked is heated and pressed (S104). By this heating press, the first insulating substrate 101 and the second insulating substrate 102 are bonded. Further, the conductive paste P302 is solidified to form the first portion 302. Further, a solid phase diffusion layer is formed between the first portion 302 and the convex portion 222A, and a solid phase diffusion layer is formed between the first portion 302 and the second planar conductor pattern 202A.

このように、本実施形態の製造方法を用いることによって、接合の信頼性が高く、層間接続導体による損失が抑制された多層基板１０Ａを容易に製造できる。   As described above, by using the manufacturing method of this embodiment, it is possible to easily manufacture the multilayer substrate 10A with high bonding reliability and suppressed loss due to the interlayer connection conductor.

次に、第３の実施形態に係る多層基板の製造方法について、図を参照して説明する。本実施形態に係る多層基板は、第２の実施形態に係る多層基板と同じ構造であり、製造方法が異なる。したがって、以下では、構造の説明は省略し、製造方法について説明する。   Next, a method for manufacturing a multilayer substrate according to the third embodiment will be described with reference to the drawings. The multilayer substrate according to this embodiment has the same structure as the multilayer substrate according to the second embodiment, and the manufacturing method is different. Therefore, the description of the structure is omitted below, and the manufacturing method is described.

図７は、本発明の第３の実施形態に係る多層基板の製造方法を示すフローチャートである。図８は、本発明の第２の実施形態に係る多層基板の製造方法における各工程での側面断面図である。図８（Ａ）は、図７の工程Ｓ１０１の状態を示し、図８（Ｂ）は、図７の工程Ｓ１４１の状態を示し、図８（Ｃ）は、図７の工程Ｓ１２１の状態を示す。図８（Ｄ）は、図７の工程Ｓ１２２の状態を示し、図８（Ｅ）は、図７の工程Ｓ１０３の状態を示す。   FIG. 7 is a flowchart showing a method for manufacturing a multilayer substrate according to the third embodiment of the present invention. FIG. 8 is a side cross-sectional view at each step in the method for manufacturing a multilayer substrate according to the second embodiment of the present invention. 8A shows the state of step S101 in FIG. 7, FIG. 8B shows the state of step S141 in FIG. 7, and FIG. 8C shows the state of step S121 in FIG. . FIG. 8D shows the state of step S122 in FIG. 7, and FIG. 8E shows the state of step S103 in FIG.

第１絶縁性基材１０１に第１平面導体パターン２０１を形成し、第２絶縁性基材１０２に第２平面導体パターン２０２ＡＤを形成する（Ｓ１０１）。第２平面導体パターン２０２ＡＤの厚みは、後述の第２平面導体パターン２０２Ａの厚みと凸部２２２Ａの厚みとを加算した厚みよりも大きい、または同じである。   The first planar conductor pattern 201 is formed on the first insulating substrate 101, and the second planar conductor pattern 202AD is formed on the second insulating substrate 102 (S101). The thickness of the second planar conductor pattern 202AD is greater than or equal to the sum of the thickness of a second planar conductor pattern 202A described later and the thickness of the convex portion 222A.

第２平面導体パターン２０２ＡＤを表面側から選択的にエッチングする。この際、凸部２２２Ａを形成しない領域のみを選択的にエッチングする。なお、エッチングは、化学的なものであるが、第２平面導体パターン２０２ＡＤを物理的に削ってもよい。これによって、凸部２２２Ａと第２平面導体パターン２０２Ａとが形成される（Ｓ１４１）。このような製造工程を用いることによって、凸部２２２Ａを、容易に且つ所望の形状で形成できる。   The second planar conductor pattern 202AD is selectively etched from the surface side. At this time, only the region where the convex portion 222A is not formed is selectively etched. Etching is chemical, but the second planar conductor pattern 202AD may be physically cut. Thereby, the convex portion 222A and the second planar conductor pattern 202A are formed (S141). By using such a manufacturing process, the convex portion 222A can be easily formed in a desired shape.

第１の実施形態に係る多層基板の製造方法と同様に、第１絶縁性基材１０１に、レーザ等によって貫通孔ＶＨ３０２を形成する（Ｓ１２１）。貫通孔ＶＨ３０２に導電ペーストＰ３０２を流し込む（Ｓ１２２）。   Similar to the method of manufacturing the multilayer substrate according to the first embodiment, the through hole VH302 is formed in the first insulating base 101 by a laser or the like (S121). The conductive paste P302 is poured into the through hole VH302 (S122).

複数の絶縁性基材（第１絶縁性基材１０１と第２絶縁性基材１０２）を積層する（Ｓ１０３）。この際、図８（Ｅ）に示すように、凸部２２２Ａが貫通孔ＶＨ３０２内に収まるように、第１絶縁性基材１０１と第２絶縁性基材１０２とを含む複数の絶縁性基材を積層する。   A plurality of insulating substrates (first insulating substrate 101 and second insulating substrate 102) are stacked (S103). At this time, as shown in FIG. 8E, a plurality of insulating base materials including the first insulating base material 101 and the second insulating base material 102 so that the convex portion 222A is accommodated in the through hole VH302. Are laminated.

第１絶縁性基材１０１と第２絶縁性基材１０２と含む複数の絶縁性基材が積層された積層体を加熱プレスする（Ｓ１０４）。この加熱プレスによって、第１絶縁性基材１０１と第２絶縁性基材１０２とが接着する。また、導電ペーストＰ３０２が固化して第１部分３０２となる。さらに、第１部分３０２と凸部２２２Ａとの間に固相拡散層が形成され、第１部分３０２と第２平面導体パターン２０２Ａとの間に固相拡散層が形成される。   A laminated body in which a plurality of insulating base materials including the first insulating base material 101 and the second insulating base material 102 are stacked is heated and pressed (S104). By this heating press, the first insulating substrate 101 and the second insulating substrate 102 are bonded. Further, the conductive paste P302 is solidified to form the first portion 302. Further, a solid phase diffusion layer is formed between the first portion 302 and the convex portion 222A, and a solid phase diffusion layer is formed between the first portion 302 and the second planar conductor pattern 202A.

このように、本実施形態の製造方法を用いても、接合の信頼性が高く、層間接続導体による伝送損失が抑制された多層基板１０Ａを容易に製造できる。   As described above, even when the manufacturing method of the present embodiment is used, it is possible to easily manufacture the multilayer substrate 10A in which the bonding reliability is high and the transmission loss due to the interlayer connection conductor is suppressed.

次に、本発明の第４の実施形態に係る多層基板について、図を参照して説明する。図９（Ａ）は、本発明の第４の実施形態に係る多層基板の一部を拡大した側面断面図である。図９（Ｂ）は、本発明の第４の実施形態に係る多層基板の一部を拡大した平面図である。図９（Ｃ）は、本発明の第４の実施形態に係る多層基板の派生例の一部を拡大した平面図である。   Next, a multilayer substrate according to a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 9A is an enlarged side sectional view of a part of the multilayer substrate according to the fourth embodiment of the present invention. FIG. 9B is an enlarged plan view of a part of the multilayer substrate according to the fourth embodiment of the present invention. FIG. 9C is a plan view enlarging a part of a derivative example of the multilayer substrate according to the fourth embodiment of the present invention.

図９（Ａ）、図９（Ｂ）に示すように、本実施形態に係る多層基板１０Ｂは、第２の実施形態に係る多層基板１０Ａに対して、溝２２３Ｂを追加したものである。多層基板１０Ｂの他の構成は、多層基板１０Ａの構成と同じであり、同じ箇所の説明は省略する。   As shown in FIGS. 9A and 9B, the multilayer substrate 10B according to the present embodiment is obtained by adding a groove 223B to the multilayer substrate 10A according to the second embodiment. The other configuration of the multilayer substrate 10B is the same as the configuration of the multilayer substrate 10A, and the description of the same portion is omitted.

多層基板１０Ｂの第２平面導体パターン２０２Ｂは、多層基板１０Ａの第２平面導体パターン２０２Ａと同じであり、多層基板１０Ｂの凸部２２２Ｂは、多層基板１０Ａの凸部２２２Ａと同じである。凸部２２２Ｂには、溝２２３Ｂが形成されている。このような溝２２３Ｂが形成された凸部２２２Ｂと第１部分３０２とによって、層間接続導体３０１Ｂが形成される。   The second planar conductor pattern 202B of the multilayer substrate 10B is the same as the second planar conductor pattern 202A of the multilayer substrate 10A, and the convex portion 222B of the multilayer substrate 10B is the same as the convex portion 222A of the multilayer substrate 10A. A groove 223B is formed in the convex portion 222B. An interlayer connection conductor 301B is formed by the convex portion 222B in which the groove 223B is formed and the first portion 302.

このような構成とすることによって、溝２２３Ｂが形成されていない態様と比較して、凸部２２２Ｂと導電ペーストＰ３０２との当接面積を広くできる。第１部分３０２と凸部２２２Ｂとの接合強度を、さらに向上させることができる。なお、溝２２３Ｂの形状は図９（Ａ）、図９（Ｂ）に示す形状に限らず、他の形状であってもよく、溝でなく凹部であってもよい。   By setting it as such a structure, the contact area of the convex part 222B and the electrically conductive paste P302 can be enlarged compared with the aspect in which the groove | channel 223B is not formed. The bonding strength between the first portion 302 and the convex portion 222B can be further improved. Note that the shape of the groove 223B is not limited to the shape shown in FIGS. 9A and 9B, and may be other shapes, and may be a recess instead of the groove.

また、図９（Ｃ）に示すように、第２平面導体パターン２０２Ｂの表面に、複数の凸部２２２１Ｂ，２２２２Ｂを形成してもよい。この構成であっても、接合強度をさらに向上させることができる。なお、図９（Ｃ）では、凸部は２個であるが、３個以上であってもよい。   Further, as shown in FIG. 9C, a plurality of convex portions 2221B and 2222B may be formed on the surface of the second planar conductor pattern 202B. Even with this configuration, the bonding strength can be further improved. In FIG. 9C, the number of convex portions is two, but may be three or more.

次に、本発明の第５の実施形態に係る多層基板について、図を参照して説明する。図１０は、本発明の第５の実施形態に係る多層基板の一部を拡大した側面断面図である。図１０に示すように、本実施形態に係る多層基板１０Ｃは、第１の実施形態に係る多層基板１０に対して、第２部分３０３Ｃの形状において異なる。多層基板１０Ｃの他の構成は、第１の実施形態に係る多層基板１０と同じであり、同じ箇所の説明は省略する。   Next, a multilayer substrate according to a fifth embodiment of the present invention will be described with reference to the drawings. FIG. 10 is an enlarged side sectional view of a part of the multilayer substrate according to the fifth embodiment of the present invention. As shown in FIG. 10, the multilayer substrate 10C according to the present embodiment is different from the multilayer substrate 10 according to the first embodiment in the shape of the second portion 303C. Other configurations of the multilayer substrate 10C are the same as those of the multilayer substrate 10 according to the first embodiment, and the description of the same portions is omitted.

第２部分３０３Ｃの底面は、第２平面導体パターン２０２に当接している。第２部分３０３Ｃの天面は、第１平面導体パターン２０１に当接している。第２部分３０３Ｃと第１部分３０２とによって、層間接続導体３０１Ｃが形成される。   The bottom surface of the second portion 303C is in contact with the second planar conductor pattern 202. The top surface of the second portion 303C is in contact with the first planar conductor pattern 201. The second part 303C and the first part 302 form an interlayer connection conductor 301C.

このような構成では、第１平面導体パターン２０１と第２平面導体パターン２０２とが第２部分３０３Ｃによって直接接続される部分を有する。したがって、層間接続導体３０１Ｃの導電率を、さらに高くすることができ、層間接続導体３０１Ｃによる伝送損失をさらに小さくできる。   In such a configuration, the first planar conductor pattern 201 and the second planar conductor pattern 202 have a portion directly connected by the second portion 303C. Therefore, the conductivity of the interlayer connection conductor 301C can be further increased, and the transmission loss due to the interlayer connection conductor 301C can be further reduced.

なお、上述の各実施形態では、貫通孔と第２部分とが平面視して円形の場合を示したが、平面視した形状は他の形状であってもよい。また、第２部分は、柱状でなくてもよく、例えば円錐、角錐等の錐状であってもよい。   In each of the above-described embodiments, the case where the through hole and the second portion are circular in plan view is shown, but the shape in plan view may be another shape. The second portion may not be columnar, and may be conical, such as a cone or a pyramid.

Ｐ３０２：導電ペースト
Ｐ３０２：導電ペースト
ＶＨ３０２：貫通孔
１０，１０Ａ，１０Ｂ，１０Ｃ：多層基板
１００：積層体
１０１：第１絶縁性基材
１０２：第２絶縁性基材
２０１：第１平面導体パターン
２０２，２０２Ａ，２０２ＡＤ，２０２Ｂ：第２平面導体パターン
２２１Ａ：平面導体部
２２２Ａ，２２２Ｂ，２２２１Ｂ，２２２２Ｂ：凸部
２２３Ｂ：溝
３０１，３０１Ａ，３０１Ｂ，３０１Ｃ：層間接続導体
３０２：第１部分
３０３，３０３Ｃ：第２部分 P302: Conductive paste P302: Conductive paste VH302: Through holes 10, 10A, 10B, 10C: Multilayer substrate 100: Laminated body 101: First insulating substrate 102: Second insulating substrate 201: First planar conductor pattern 202 202A, 202AD, 202B: second planar conductor pattern 221A: planar conductor portions 222A, 222B, 2221B, 2222B: convex portions 223B: grooves 301, 301A, 301B, 301C: interlayer connection conductor 302: first portions 303, 303C: Second part

Claims (14)

複数の絶縁性基材が積層された積層体と、
前記積層体に形成された第１平面導体パターンと、
前記積層体に形成され、前記第１平面導体パターンに対して積層方向に離間している第２平面導体パターンと、
前記第１平面導体パターンと前記第２平面導体パターンとを接続する層間接続導体と、
を備え、
前記層間接続導体は、
導電ペーストを固化してなる第１部分と、
前記固化された導電ペーストよりも導電率が高く、該第２平面導体パターンの表面から突起する第２部分と、を備える、
多層基板。 A laminate in which a plurality of insulating substrates are laminated;
A first planar conductor pattern formed in the laminate;
A second planar conductor pattern formed in the multilayer body and spaced apart in the stacking direction with respect to the first planar conductor pattern;
An interlayer connection conductor connecting the first planar conductor pattern and the second planar conductor pattern;
With
The interlayer connection conductor is
A first portion formed by solidifying the conductive paste;
A conductivity higher than that of the solidified conductive paste, and a second portion protruding from the surface of the second planar conductor pattern,
Multilayer board. 前記第１平面導体パターンと前記第２平面導体パターンとは、金属箔からなる、
請求項１に記載の多層基板。 The first planar conductor pattern and the second planar conductor pattern are made of metal foil.
The multilayer substrate according to claim 1. 前記第２部分は、前記第２平面導体パターンと同じ材料である、
請求項１または請求項２に記載の多層基板。 The second portion is made of the same material as the second planar conductor pattern.
The multilayer substrate according to claim 1 or 2. 前記第２部分は、前記第１平面導体パターンに当接している、
請求項１乃至請求項３のいずれかに記載の多層基板。 The second portion is in contact with the first planar conductor pattern;
The multilayer substrate according to any one of claims 1 to 3. 前記第２部分は、溝または凹部を有する、
請求項１乃至請求項４のいずれかに記載の多層基板。 The second part has a groove or a recess,
The multilayer substrate according to any one of claims 1 to 4. 前記第２部分は、複数設けられている、
請求項１乃至請求項５のいずれかに記載の多層基板。 A plurality of the second parts are provided,
The multilayer substrate according to any one of claims 1 to 5. 前記第１部分と前記第２部分とは、固相拡散層を介して接合されている、
請求項１乃至請求項６のいずれかに記載の多層基板。 The first part and the second part are joined via a solid phase diffusion layer,
The multilayer substrate according to any one of claims 1 to 6. 前記層間接続導体の径は、前記第１平面導体パターン側よりも前記第２平面導体パターン側の方が大きい、
請求項１乃至請求項７のいずれかに記載の多層基板。 The diameter of the interlayer connection conductor is larger on the second planar conductor pattern side than on the first planar conductor pattern side,
The multilayer substrate according to any one of claims 1 to 7. 第１絶縁性基材と第２絶縁性基材とが積層された多層基板の製造方法であって、
前記第１絶縁性基材に第１平面導体パターンを形成し、前記第２絶縁性基材に第２平面導体パターンを形成する工程と、
前記第１絶縁性基材における前記第１平面導体パターンに重なる部分に、貫通孔を形成する工程と、
前記貫通孔に導電ペーストを流し込む工程と、
前記第２平面導体パターンが前記第２絶縁性基材に当接する面に対向する面を、前記第２平面導体パターンの表面とし、この表面から突起する導電性の凸部を形成する工程と、
前記凸部が前記貫通孔内に収まるように、前記第１絶縁性基材と前記第２絶縁性基材とを積層する工程と、
この積層された状態において、前記第１絶縁性基材と前記第２絶縁性基材とを加熱プレスする工程と、
を有する多層基板の製造方法。 A method for producing a multilayer substrate in which a first insulating substrate and a second insulating substrate are laminated,
Forming a first planar conductor pattern on the first insulating substrate, and forming a second planar conductor pattern on the second insulating substrate;
Forming a through hole in a portion of the first insulating substrate that overlaps the first planar conductor pattern;
Pouring a conductive paste into the through hole;
The surface of the second planar conductor pattern that faces the surface that contacts the second insulating substrate is the surface of the second planar conductor pattern, and a conductive protrusion projecting from the surface is formed.
Laminating the first insulating base material and the second insulating base material so that the convex portion fits in the through hole;
In this laminated state, the step of heat pressing the first insulating substrate and the second insulating substrate;
A method for manufacturing a multilayer substrate having: 前記第１平面導体パターンと前記第２平面導体パターンとは金属箔からなる、
請求項９に記載の多層基板の製造方法。 The first planar conductor pattern and the second planar conductor pattern are made of metal foil.
The manufacturing method of the multilayer substrate of Claim 9. 前記貫通孔は、前記第１平面導体パターンに当接する面の径よりも、開口面の径の方が大きい、
請求項９または請求項１０に記載の多層基板の製造方法。 In the through hole, the diameter of the opening surface is larger than the diameter of the surface in contact with the first planar conductor pattern.
The manufacturing method of the multilayer substrate of Claim 9 or Claim 10. 前記凸部を形成する工程は、
前記第２平面導体パターンの表面に、導電性材料を部分的にメッキする工程である、
請求項９乃至請求項１１のいずれかに記載の多層基板の製造方法。 The step of forming the convex portion includes
A step of partially plating a conductive material on the surface of the second planar conductor pattern;
The method for producing a multilayer substrate according to any one of claims 9 to 11. 前記凸部を形成する工程は、
前記第２平面導体パターンの表面に、該第２平面導体パターンと同じ材料を部分的に成長させる工程である、
請求項９乃至請求項１１のいずれかに記載の多層基板の製造方法。 The step of forming the convex portion includes
A step of partially growing the same material as the second planar conductor pattern on the surface of the second planar conductor pattern;
The method for producing a multilayer substrate according to any one of claims 9 to 11. 前記凸部を形成する工程は、
前記第２平面導体パターンを、部分的にエッチングする工程である、
請求項９乃至請求項１１のいずれかに記載の多層基板の製造方法。 The step of forming the convex portion includes
A step of partially etching the second planar conductor pattern;
The method for producing a multilayer substrate according to any one of claims 9 to 11.
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