JP2011159686A - Printed wiring board and method of manufacturing the same - Google Patents
Printed wiring board and method of manufacturing the same Download PDFInfo
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この発明は、導電性ペーストにより表裏や各層の回路配線層間の層間接続を行うプリント配線板とその製造方法に関する。 The present invention relates to a printed wiring board for performing interlayer connection between front and back and circuit wiring layers of each layer using a conductive paste, and a manufacturing method thereof.
従来、プリント配線板において絶縁層で絶縁された各層の回路配線を電気的に接続するため、内部に導電材が設けられたビアホールが絶縁層を貫通して形成されている。この層間接続構造は、絶縁層に形成されたビアホール内に、銅メッキや導電性ペーストを充填する方法が用いられている。特に、導電性ペーストを用いた層間接続構造は、環境負荷が小さく製造方法も簡易である点で優れている。 Conventionally, in order to electrically connect circuit wiring of each layer insulated by an insulating layer in a printed wiring board, a via hole having a conductive material provided therein is formed through the insulating layer. In this interlayer connection structure, a method of filling a via hole formed in an insulating layer with copper plating or a conductive paste is used. In particular, the interlayer connection structure using the conductive paste is excellent in that the environmental load is small and the manufacturing method is simple.
この層間接続構造は、レーザ光により絶縁層にビアホールを形成し、このビアホールの一方の側に銅箔による回路配線のランド部が位置し、ビアホール内に導電性ペーストが充填されている。ビアホール内の導電性ペーストによる層間接続部は、それに積層された他層の回路配線のランド部に接続され、上下層の回路配線を接続している。 In this interlayer connection structure, a via hole is formed in an insulating layer by laser light, a land portion of a circuit wiring made of copper foil is located on one side of the via hole, and a conductive paste is filled in the via hole. The interlayer connection portion made of the conductive paste in the via hole is connected to the land portion of the circuit wiring of the other layer laminated thereon, and connects the upper and lower layer circuit wiring.
しかしながら、一般に銅箔と導電性ペーストは接着性が良くなく、例えば銅箔と絶縁樹脂層を熱プレスして貼り合わせる際に、加熱加圧により絶縁層側に導電性ペーストが流動して圧力が逃げてしまうと、導電性ペーストの金属粒子が確実に銅箔のランドに圧接されず、接続抵抗が増大したり電気的信頼性が低下するという問題があった。従って、この層間接続構造における各材料の選定が、プリント配線板の性能に大きく影響するものであり、従来、良好な接続条件の一つとして、導電性ペーストのバインダ樹脂の溶融粘度は、絶縁樹脂の溶融粘度より小さいことが挙げられていた。 However, in general, copper foil and conductive paste have poor adhesion. For example, when copper foil and an insulating resin layer are bonded together by hot pressing, the conductive paste flows to the insulating layer side by heat and pressure, and the pressure is increased. If escaped, there was a problem that the metal particles of the conductive paste were not reliably pressed against the land of the copper foil, and the connection resistance increased or the electrical reliability decreased. Therefore, the selection of each material in this interlayer connection structure greatly affects the performance of the printed wiring board. Conventionally, as one of the good connection conditions, the melt viscosity of the binder resin of the conductive paste is the insulating resin It was mentioned that it was smaller than the melt viscosity.
その他、導電性ペーストによる層間接続構造の電気的信頼性を担保するものとして、特許文献１に開示された層間接続構造がある。この層間接続構造は、基材に熱硬化性樹脂が含浸されて構成されたプリプレグシートの両面に金属箔による回路パターンが形成され、このプリプレグシートに設けられた貫通孔に熱硬化性樹脂を含有する導電性ペーストが充填され、これらを加熱加圧することにより導通接続されるものであって、導電性ペースト中の熱硬化性樹脂の軟化点が、プリプレグシート中の熱硬化性樹脂の軟化点よりも低くしたものである。 In addition, there is an interlayer connection structure disclosed in Patent Document 1 as a means for ensuring the electrical reliability of the interlayer connection structure using a conductive paste. In this interlayer connection structure, a circuit pattern made of metal foil is formed on both sides of a prepreg sheet constituted by impregnating a base material with a thermosetting resin, and a thermosetting resin is contained in a through hole provided in the prepreg sheet. The conductive paste is filled and electrically connected by heating and pressurizing them, and the softening point of the thermosetting resin in the conductive paste is more than the softening point of the thermosetting resin in the prepreg sheet. Is also low.
また、特許文献２には、成形工程前にプリプレグシートを構成する含浸樹脂の軟化点近傍の温度で一定時間、所定の圧力で加熱加圧する圧縮工程を行い、金属箔あるいは回路基板上の導体回路とプリプレグシートの接着性および平坦性を高め、さらにプリプレグシートの樹脂の軟化点以下まで温度を冷却することで、プリプレグシートの樹脂溶融時での導電性ペーストの流出を抑制し、接続抵抗値を安定させる回路基板の製造方法も提案されている。 Patent Document 2 discloses a conductor circuit on a metal foil or a circuit board in which a compression process is performed by heating and pressing at a predetermined pressure at a temperature near the softening point of the impregnating resin constituting the prepreg sheet before the molding process. By improving the adhesion and flatness of the prepreg sheet and cooling the temperature to below the softening point of the resin of the prepreg sheet, the outflow of the conductive paste at the time of resin melting of the prepreg sheet is suppressed, and the connection resistance value is reduced. A method for manufacturing a stable circuit board has also been proposed.
しかしながら、導電性ペーストのバインダ樹脂に、より粘度の低い樹脂を用いた場合でも接続抵抗が上昇したり電気的信頼性が低下したりする場合があった。 However, even when a resin having a lower viscosity is used as the binder resin of the conductive paste, the connection resistance may increase or the electrical reliability may decrease.
この発明は、上記背景技術に鑑みて成されたもので、導電性ペーストによる層間接続構造を用いて、接続抵抗が小さく電気的信頼性も高いプリント配線板とその製造方法を提供することを目的とする。 The present invention has been made in view of the above-described background art, and an object thereof is to provide a printed wiring board having a low connection resistance and high electrical reliability, and a method for manufacturing the same, using an interlayer connection structure made of a conductive paste. And
この発明は、導電性ペーストにより回路配線層間の層間接続を行うプリント配線板であって、絶縁性の樹脂フィルムの基板に予め貼り合わされた一方の金属箔のランド部に対して、前記基板を挟んで接着剤により積層される他方の金属箔のランド部が対面し、前記基板は、前記他方の前記ランド部との貼り合わせ時の熱プレスに対して、接着剤層の接着剤樹脂との間で流動化しにくい材料から成るプリント配線板である。前記一方の金属箔は前記樹脂フィルムに対して接着剤レスで直接貼り合わされたもの、またはごく薄い接着層を介して貼り合わされたものでも良い。 The present invention relates to a printed wiring board for performing interlayer connection between circuit wiring layers using a conductive paste, and sandwiching the substrate between land portions of one metal foil previously bonded to a substrate of an insulating resin film. The land portion of the other metal foil laminated by the adhesive faces, and the substrate is between the adhesive resin of the adhesive layer with respect to the hot press at the time of bonding with the other land portion. It is a printed wiring board made of a material that is difficult to fluidize. The one metal foil may be directly bonded to the resin film without an adhesive, or may be bonded via a very thin adhesive layer.
前記樹脂フィルムは、ポリイミド樹脂からなる。さらに、前記各ランド部間の、前記樹脂フィルムの表面から前記一方の金属箔のランド部までの間隔である基板部の厚さが、前記接着剤による接着剤層の厚さ以下の場合は、前記基板部と前記接着剤層から成る絶縁層の厚さに対して前記基板部の厚さが３５％〜５０％とするものである。また、前記基板部の厚さが前記接着剤による接着剤層の厚さよりも厚い場合は、前記絶縁層の厚さに対して前記基板部の厚さが６５％〜９０％とするものである。 The resin film is made of a polyimide resin. Furthermore, when the thickness of the substrate portion, which is the distance from the surface of the resin film to the land portion of the one metal foil, between the land portions is equal to or less than the thickness of the adhesive layer by the adhesive, The thickness of the substrate portion is 35% to 50% with respect to the thickness of the insulating layer composed of the substrate portion and the adhesive layer. Moreover, when the thickness of the said board | substrate part is thicker than the thickness of the adhesive bond layer by the said adhesive agent, the thickness of the said board | substrate part shall be 65%-90% with respect to the thickness of the said insulating layer. .
さらに、前記絶縁層の厚さは５０μｍ以下が好ましく、前記接着剤層の厚さは２５μｍ以下であることが好ましく、さらにこれら両方を満たすことがより好ましい。 Furthermore, the thickness of the insulating layer is preferably 50 μm or less, the thickness of the adhesive layer is preferably 25 μm or less, and more preferably both of them are satisfied.
前記導電性ペーストのバインダ樹脂は、エポキシ化大豆油やエポキシ化亜麻仁油等のエポキシ化植物油である。 The binder resin of the conductive paste is epoxidized vegetable oil such as epoxidized soybean oil or epoxidized linseed oil.
またこの発明は、導電性ペーストにより配線層間の層間接続を行うプリント配線板の製造方法であって、金属箔が予め貼り合わされた絶縁性の樹脂フィルムの基板を用いて、前記金属箔により回路配線及びランド部から成る回路配線層を形成し、前記基板の前記金属箔とは反対側の面に接着剤を塗布して接着剤層を形成し、その際、前記基板の表面から前記金属箔のランド部までの間隔である基板部の厚さが前記接着剤層の厚さ以下の場合は、前記基板部と前記接着剤層から成る絶縁層の厚さに対して前記基板部の厚さが３５％〜５０％となるように前記接着剤層を形成するプリント配線板の製造方法である。または、前記基板部の厚さが前記接着剤による接着剤層の厚さよりも厚い場合は、前記基板部と前記接着剤層から成る絶縁層の厚さに対して前記基板部の厚さが６５％〜９０％となるように形成するプリント配線板の製造方法である。さらにこの後、前記絶縁層にビアホールを形成して前記ビアホールに導電性ペーストを充填し、金属箔から成る他方の回路配線層のランド部を、熱プレスにより前記ビアホールの前記導電性ペーストと接合して層間接続を行うものである。 The present invention also relates to a method of manufacturing a printed wiring board in which an interlayer connection between wiring layers is performed using a conductive paste, wherein a circuit wiring is formed using the metal foil using a substrate made of an insulating resin film on which a metal foil is bonded in advance. And a circuit wiring layer composed of land portions, and an adhesive is formed on the surface of the substrate opposite to the metal foil to form an adhesive layer. When the thickness of the substrate portion, which is the distance to the land portion, is equal to or less than the thickness of the adhesive layer, the thickness of the substrate portion is smaller than the thickness of the insulating layer composed of the substrate portion and the adhesive layer. In this method, the adhesive layer is formed so as to be 35% to 50%. Alternatively, when the thickness of the substrate portion is larger than the thickness of the adhesive layer made of the adhesive, the thickness of the substrate portion is 65 with respect to the thickness of the insulating layer composed of the substrate portion and the adhesive layer. It is a manufacturing method of the printed wiring board formed so that it may become% -90%. Thereafter, a via hole is formed in the insulating layer and the via hole is filled with a conductive paste, and the land portion of the other circuit wiring layer made of metal foil is joined to the conductive paste in the via hole by hot pressing. Layer connection.
この発明のプリント配線板とその製造方法によれば、導電性ペーストによる層間接続部を備え、金属箔のランド部との接続抵抗が小さく、電気的信頼性も高いプリント配線板を形成することができる。
特に、エポキシ化植物油を導電性ペーストのバインダ樹脂に用いることにより、導電性ペーストの粘性を小さくして、絶縁層への導電性ペーストの流動を抑え、導電性ペースト中の金属粒子と金属箔のランド表面との接続をより確実なものとすることができる。
According to the printed wiring board and the manufacturing method thereof of the present invention, it is possible to form a printed wiring board having an interlayer connection portion made of a conductive paste, having a low connection resistance with the land portion of the metal foil, and high electrical reliability. it can.
In particular, by using epoxidized vegetable oil in the binder resin of the conductive paste, the viscosity of the conductive paste is reduced, the flow of the conductive paste to the insulating layer is suppressed, and the metal particles and the metal foil in the conductive paste are reduced. The connection with the land surface can be made more reliable.
以下、この発明のプリント配線板の一実施形態について、図１、図２を基にして説明する。この実施形態のプリント配線板１０は、複数の回路配線層を備えた多層配線板であって、基板１１の片面に、金属箔である銅箔１２が薄い接着層１３を介して貼り合わされた片面銅張り板３０により構成されている。なお、接着層１３を省いて、基板１１と銅箔１２を直接貼り合わせた接着剤レスの片面銅張り板を用いても良い。基板１１は、樹脂フィルムから成り、後述するランド部２２ａの銅箔１２との貼り合わせ時の熱プレスに対して、接着剤層１４の接着剤樹脂と比較して流動化しにくい材料から成るものである。樹脂材料としては、耐熱性の高い樹脂で、好ましくはポリイミド樹脂である。銅箔１２は、回路配線層２０を形成するもので、図示しない回路配線やランド部２０ａを形成している。 Hereinafter, an embodiment of a printed wiring board according to the present invention will be described with reference to FIGS. The printed wiring board 10 of this embodiment is a multilayer wiring board having a plurality of circuit wiring layers, and is a single-sided surface in which a copper foil 12 that is a metal foil is bonded to a single side of a substrate 11 via a thin adhesive layer 13. A copper-clad plate 30 is used. Note that an adhesive-less single-sided copper-clad plate obtained by directly bonding the substrate 11 and the copper foil 12 may be used without the adhesive layer 13. The substrate 11 is made of a resin film, and is made of a material that is less fluidized than the adhesive resin of the adhesive layer 14 with respect to hot pressing at the time of bonding with the copper foil 12 of the land portion 22a described later. is there. The resin material is a highly heat-resistant resin, preferably a polyimide resin. The copper foil 12 forms the circuit wiring layer 20 and forms circuit wiring and land portions 20a (not shown).
基板１１の銅箔１２とは反対側の面には、接着剤層１４を介して、金属箔である銅箔１５が積層されている。銅箔１５も、絶縁性の樹脂フィルム等の基板１６に貼り合わされ、図示しない回路配線やランド部２２ａ等の回路配線層２２を形成している。接着剤層１４の接着剤は、エポキシ樹脂やポリイミド樹脂等の熱硬化性樹脂から成る。 On the surface of the substrate 11 opposite to the copper foil 12, a copper foil 15 that is a metal foil is laminated via an adhesive layer 14. The copper foil 15 is also bonded to a substrate 16 such as an insulating resin film to form a circuit wiring layer 22 such as a circuit wiring (not shown) or a land portion 22a. The adhesive of the adhesive layer 14 is made of a thermosetting resin such as an epoxy resin or a polyimide resin.
ここで、基板１１と接着層１３を基板部１７とし、基板部１７と接着剤層１４により絶縁層１８を構成する。そして、図２に示すように、プリント配線板１０には、表裏の回路配線層２０，２２のランド部２０ａ，２２ａ間を電気的に接続するための貫通孔であるビアホール２４が形成されている。ビアホール２４には、導電性ペースト２６が充填され、回路配線層２０，２２を電気的に接続した層間接続部２８を構成している。 Here, the substrate 11 and the adhesive layer 13 are used as the substrate portion 17, and the substrate portion 17 and the adhesive layer 14 constitute the insulating layer 18. As shown in FIG. 2, the printed wiring board 10 is formed with via holes 24 that are through holes for electrically connecting the land portions 20a and 22a of the circuit wiring layers 20 and 22 on the front and back sides. . The via hole 24 is filled with a conductive paste 26 to form an interlayer connection portion 28 that electrically connects the circuit wiring layers 20 and 22.
ここで、充填する導電性ペースト２６は、バインダ樹脂中に高融点金属と低融点金属等の金属粒子が混合され、後の加熱処理で合金化するとともに金属粒子が互いに接続し、表裏のランド部２０ａ，２２ａを接続するものである。例えば、高融点金属は、少なくとも銅を含み、銅単体の粒子、又は銅と金、銀、亜鉛、及びニッケルのうち１つ以上の金属を含む合金の粒子である。また、これら金属粒子の表面は、金、銀、亜鉛、又はニッケル、又はそれらの合金がメッキ等により被覆されていてもよい。これらの金属粒子の平均粒径は、約１〜１０μｍ例えば６μｍである。また、低融点金属は、Ｓｎ、又はＳｎを含む合金（例えば、ハンダ）の粒子である。ハンダとしては、Ｓｎ−Ｃｕ系ハンダ、Ｓｎ−Ａｇ系ハンダ、Ｓｎ−Ａｇ−Ｃｕ系ハンダ、これらにＩｎ、Ｚｎ、Ｂｉのいずれか一つ以上を添加し、さらに適宜混合して用いても良い。導電性ペースト２６のバインダ樹脂は、エポキシ化大豆油が好適に用いられる。その他、エポキシ化亜麻仁油等のエポキシ化植物油を用いても良い。 Here, in the conductive paste 26 to be filled, metal particles such as a high-melting point metal and a low-melting point metal are mixed in a binder resin and alloyed by a subsequent heat treatment, and the metal particles are connected to each other. 20a and 22a are connected. For example, the refractory metal includes at least copper and is a particle of copper alone or an alloy particle including one or more of copper and gold, silver, zinc, and nickel. The surfaces of these metal particles may be coated with gold, silver, zinc, nickel, or an alloy thereof by plating or the like. The average particle diameter of these metal particles is about 1 to 10 μm, for example 6 μm. The low melting point metal is Sn or an alloy (for example, solder) particles containing Sn. As the solder, Sn-Cu solder, Sn-Ag solder, Sn-Ag-Cu solder, any one or more of In, Zn, and Bi may be added to these solders, and further mixed as appropriate. . As the binder resin of the conductive paste 26, epoxidized soybean oil is preferably used. In addition, epoxidized vegetable oils such as epoxidized linseed oil may be used.
さらに、この実施形態では、基板１１の厚さと接着剤層１４の厚さの大小により、接着剤層１４の厚さが所定の範囲に設定される。その設定は、基板部１７の厚さｔ１が、接着剤層１４の厚さｔ２以下の場合は、絶縁層１８の厚さｔ０に対して、基板部１７の厚さｔ１を、３５％〜５０％とする。また、基板部１７の厚さｔ１が、接着剤層１４の厚さｔ２よりも厚い場合は、絶縁層１８の厚さｔ０に対して、基板部１７の厚さｔ１を、６５％〜９０％とするものである。特に、絶縁層１８の厚さは５０μｍ以下が好ましく、接着剤層１４の厚さは２５μｍ以下であることが好ましい。さらに、これら両方を満たすことがより好ましい。 Furthermore, in this embodiment, the thickness of the adhesive layer 14 is set within a predetermined range depending on the thickness of the substrate 11 and the thickness of the adhesive layer 14. The setting is that when the thickness t1 of the substrate portion 17 is equal to or less than the thickness t2 of the adhesive layer 14, the thickness t1 of the substrate portion 17 is set to 35% to 50% with respect to the thickness t0 of the insulating layer 18. %. Further, when the thickness t1 of the substrate portion 17 is larger than the thickness t2 of the adhesive layer 14, the thickness t1 of the substrate portion 17 is set to 65% to 90% with respect to the thickness t0 of the insulating layer 18. It is what. In particular, the thickness of the insulating layer 18 is preferably 50 μm or less, and the thickness of the adhesive layer 14 is preferably 25 μm or less. Furthermore, it is more preferable to satisfy both of these conditions.
次に、この実施形態のプリント配線板１０の製造方法について、図１を基にして説明する。先ず、図１（ａ）に示すように、ポリイミド等の絶縁性樹脂フィルムの基板１１と接着剤層１４を有した片面銅張り板３０の、銅箔１２が形成された一側面側に配線形成用のレジストを設ける。レジスト形成は、ドライフィルムの貼り付けや塗布により行う。この後、所定の回路配線層２０のパターンを露光し、エッチングを行い、図１（ｂ）に示すように回路配線層２０を形成する。 Next, the manufacturing method of the printed wiring board 10 of this embodiment is demonstrated based on FIG. First, as shown in FIG. 1 (a), wiring is formed on one side of the copper foil 12 on a single-sided copper-clad plate 30 having an insulating resin film substrate 11 such as polyimide and an adhesive layer 14. A resist is provided. The resist is formed by attaching or applying a dry film. Thereafter, the pattern of the predetermined circuit wiring layer 20 is exposed and etched to form the circuit wiring layer 20 as shown in FIG.
次に、片面銅張り板３０の接着剤層１４側からレーザ光を照射し、図１（ｃ）に示すように、絶縁層１８にビアホール２４を形成する。レーザ光は、ＣＯ２レーザやＹＡＧレーザ等、適宜用いることができる。この後、ビアホール２４内をデスミア処理する。 Next, laser light is irradiated from the side of the adhesive layer 14 of the single-sided copper-clad plate 30 to form via holes 24 in the insulating layer 18 as shown in FIG. As the laser light, a CO 2 laser, a YAG laser, or the like can be used as appropriate. Thereafter, desmear processing is performed in the via hole 24.
次に、図１（ｄ）に示すように、導電性ペースト２６をビアホール２４内に充填する。充填方法は、図示しないマスキングテープの表面に導電性ペースト２６を載せ、スキージにより導電性ペースト２６を摺動させ、ビアホール２４内に導電性ペースト２６を直接に充填する。その他、スクリーン印刷、インクジェット印刷等の印刷方法により、導電性ペースト２６をビアホール２４内に充填しても良い。 Next, as shown in FIG. 1D, the conductive paste 26 is filled in the via hole 24. In the filling method, the conductive paste 26 is placed on the surface of a masking tape (not shown), the conductive paste 26 is slid with a squeegee, and the conductive paste 26 is directly filled in the via hole 24. In addition, the conductive paste 26 may be filled in the via hole 24 by a printing method such as screen printing or inkjet printing.
この後、図１（ｅ）に示すように、他の片面銅張り板３０から上記と同様に形成された回路配線層２２のランド部２２ａに、導電性ペースト２６が露出した部分を重ねるようにして、他の回路配線層２２と接着剤層１４を位置合わせして重ねる。さらに、片面銅張り板３０による回路配線層３２を有した回路基板３４のランド部３２ａに、回路配線層２２のランド部２２ａに接続した導電性ペースト２６を対向させ、他層の基板１６に塗布された接着剤層１４を、さらに他の回路基板３２に位置合わせして重ねる。 Thereafter, as shown in FIG. 1E, a portion where the conductive paste 26 is exposed is overlapped on the land portion 22a of the circuit wiring layer 22 formed in the same manner as described above from the other single-sided copper-clad plate 30. Then, the other circuit wiring layer 22 and the adhesive layer 14 are aligned and overlapped. Further, the conductive paste 26 connected to the land portion 22a of the circuit wiring layer 22 is opposed to the land portion 32a of the circuit board 34 having the circuit wiring layer 32 made of the single-sided copper-clad plate 30 and applied to the substrate 16 of the other layer. The bonded adhesive layer 14 is further aligned and overlapped with another circuit board 32.
そして、真空中で熱プレス装置により、ビアホール２４の導電性ペースト２６と銅箔１５のランド部２２ａを接合して層間接続を行う。同様に、他の片面銅張り板から成る回路基板３４のランド部３２ａとビアホール２４の導電性ペースト２６を介して回路配線層２２のランド部２２ａが層間接続される。この層間接続は、熱プレスにより、導電性ペースト２６の金属粒子が溶融し、両側のランド部２０ａ，２２ａ，３２ａと溶融金属が接合し、層間接続構造が形成されるものである。熱プレスは、図示しない加熱プレス装置等を用いて、例えば１６０〜２００℃で２００〜６００Ｎ／ｃｍ2の条件下で、３０〜１８０分間加熱加圧して、銅箔１５と導電性ペースト２６中の金属との接合が確実に成されるようにする（図１（ｆ））。なお、図１（ｂ）で形成した片面銅張り板３０の回路配線層２０は、図１（ｅ）に示す回路基板３４を積層した後に形成しても良い。 Then, the conductive paste 26 in the via hole 24 and the land portion 22a of the copper foil 15 are joined by a hot press apparatus in vacuum to perform interlayer connection. Similarly, the land portion 32a of the circuit board 34 made of another single-sided copper-clad plate and the land portion 22a of the circuit wiring layer 22 are interlayer-connected via the conductive paste 26 of the via hole 24. In this interlayer connection, the metal particles of the conductive paste 26 are melted by hot pressing, and the land portions 20a, 22a, 32a on both sides are joined to the molten metal to form an interlayer connection structure. The hot press is performed by heating and pressurizing for 30 to 180 minutes under a condition of 200 to 600 N / cm 2 at 160 to 200 ° C., for example, using a heating press device (not shown), and the like in the copper foil 15 and the conductive paste 26. It is ensured that the bonding with the metal is achieved (FIG. 1 (f)). The circuit wiring layer 20 of the single-sided copper-clad board 30 formed in FIG. 1B may be formed after the circuit board 34 shown in FIG.
この実施形態のプリント配線板１０によれば、熱プレスに対して、接着剤層１４の接着剤樹脂と比較して流動化しにくい熱硬化性樹脂の基板１１，１６を用いて、基板１１，１６及び接着剤層１４の厚みを上記条件で決定することにより、他層に形成された回路配線層２０，２２，３２等を、導電性ペースト２６による層間接続部２８により確実に電気的に接続し、接続抵抗が小さく、電気的信頼性も高い層間接続構造を形成することができる。 According to the printed wiring board 10 of this embodiment, the substrates 11 and 16 are formed by using the thermosetting resin substrates 11 and 16 that are less fluidized than the adhesive resin of the adhesive layer 14 with respect to hot pressing. In addition, by determining the thickness of the adhesive layer 14 under the above conditions, the circuit wiring layers 20, 22, 32, etc. formed in the other layers are reliably electrically connected by the interlayer connection portion 28 using the conductive paste 26. In addition, an interlayer connection structure with low connection resistance and high electrical reliability can be formed.
なお、この発明のプリント配線板とその製造方法は、上記実施形態に限定されるものではなく、層間接続を導電性ペーストにより行うプリント配線板であれば、適用可能なものであり、ランド部の大きさや形状は適宜設定可能なものであり、導電性ペーストや、基板等の材料も適宜選択可能なものである。また、絶縁層の厚みや材質も、上記条件で、適宜設定可能なものであり、エポキシ化植物油は、上記以外にリノール酸を多く含むコーン油やひまわり油、綿実油等を利用することも可能であり、その他エポキシ化脂肪酸エステル等を利用することも可能である。また、孔開けのレーザ光の種類や照射径、照射方法も適宜設定可能なものである。 The printed wiring board and the manufacturing method thereof according to the present invention are not limited to the above embodiment, and can be applied to any printed wiring board that performs interlayer connection with a conductive paste. The size and shape can be set as appropriate, and materials such as a conductive paste and a substrate can also be selected as appropriate. In addition, the thickness and material of the insulating layer can be set as appropriate under the above conditions, and the epoxidized vegetable oil can use corn oil, sunflower oil, cottonseed oil, etc. containing a large amount of linoleic acid in addition to the above. Yes, it is also possible to use other epoxidized fatty acid esters and the like. Further, the type, irradiation diameter, and irradiation method of the laser beam for drilling can be set as appropriate.
次に、この発明のプリント配線板の実施例について、以下に説明する。この実施例では、表１に示す各数値の条件でプリント配線板を作成し、そのビアホールの抵抗値を測定した。測定結果は、表１及び図４に示すように、単位長さ当たりの抵抗値は、上記の条件に入る場合は抵抗値が低いという結果が得られた。この実施例のプリント配線板の実施例１〜３について、断面の顕微鏡写真を図３（ａ）（ｂ）（ｃ）に示す。 Next, examples of the printed wiring board of the present invention will be described below. In this example, a printed wiring board was prepared under the numerical conditions shown in Table 1, and the resistance value of the via hole was measured. As shown in Table 1 and FIG. 4, the measurement results showed that the resistance value per unit length was low when the above conditions were satisfied. 3A, 3B, and 3C show cross-sectional micrographs of Examples 1 to 3 of the printed wiring board of this example.
１０ プリント配線板
１１，１６ 基板
１２，１５ 銅箔
１４ 接着剤層
１７ 基板部
１８ 絶縁層
２０，２２，３２ 回路配線層
２０ａ，２２ａ，３２ａ ランド部
２４ ビアホール
２６ 導電性ペースト
２８ 層間接続部
３０ 片面銅張り板
DESCRIPTION OF SYMBOLS 10 Printed wiring board 11, 16 Board | substrate 12, 15 Copper foil 14 Adhesive layer 17 Board | substrate part 18 Insulating layer 20, 22, 32 Circuit wiring layer 20a, 22a, 32a Land part 24 Via hole 26 Conductive paste 28 Interlayer connection part 30 One side Copper plate
Claims (9)
絶縁性の樹脂フィルムの基板に予め貼り合わされた一方の金属箔のランド部に対して、前記基板を挟んで接着剤により積層される他方の金属箔のランド部が対面し、前記基板は、前記他方の前記ランド部との貼り合わせ時の熱プレスに対して、接着剤層の接着剤樹脂との間で流動化しにくい材料から成ることを特徴とするプリント配線板 In the printed wiring board that performs interlayer connection between circuit wiring layers with conductive paste,
The land portion of the other metal foil laminated by the adhesive across the substrate faces the land portion of the one metal foil previously bonded to the substrate of the insulating resin film. A printed wiring board comprising a material that hardly flows between an adhesive resin of an adhesive layer and a hot press at the time of bonding to the other land portion.
金属箔が予め貼り合わされた絶縁性の樹脂フィルムの基板を用いて、前記金属箔により回路配線及びランド部から成る回路配線層を形成し、前記基板の前記金属箔とは反対側の面に接着剤を塗布して接着剤層を形成し、その際、前記基板の表面から前記金属箔のランド部までの間隔である基板部の厚さが前記接着剤層の厚さ以下の場合は、前記基板部と前記接着剤層から成る絶縁層の厚さに対して前記基板部の厚さが３５％〜５０％となるように前記接着剤層を形成し、前記基板部の厚さが前記接着剤による接着剤層の厚さよりも厚い場合は、前記基板部と前記接着剤層から成る絶縁層の厚さに対して前記基板部の厚さが６５％〜９０％となるようにし、この後、前記絶縁層にビアホールを形成して前記ビアホールに導電性ペーストを充填し、さらに金属箔から成る他方の回路配線層のランド部を、熱プレスにより前記ビアホールの前記導電性ペーストと接合して層間接続を行うことを特徴とするプリント配線板の製造方法。
In the method of manufacturing a printed wiring board that performs interlayer connection between wiring layers with a conductive paste,
Using a substrate of an insulating resin film on which a metal foil is bonded in advance, a circuit wiring layer composed of circuit wiring and a land portion is formed from the metal foil, and is adhered to a surface of the substrate opposite to the metal foil. An adhesive layer is formed by applying an agent, and when the thickness of the substrate portion, which is the distance from the surface of the substrate to the land portion of the metal foil, is equal to or less than the thickness of the adhesive layer, The adhesive layer is formed such that the thickness of the substrate portion is 35% to 50% with respect to the thickness of the insulating layer composed of the substrate portion and the adhesive layer, and the thickness of the substrate portion is the adhesive. When the thickness is larger than the thickness of the adhesive layer by the agent, the thickness of the substrate portion is 65% to 90% with respect to the thickness of the insulating layer composed of the substrate portion and the adhesive layer. Forming a via hole in the insulating layer and filling the via hole with a conductive paste. Furthermore the land portion of the other of the circuit wiring layer made of a metal foil, a method for manufacturing a printed wiring board, characterized in that hot pressing by and bonded to the conductive paste of the via hole perform interlayer connection.
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| JP2010018265A JP5526818B2 (en) | 2010-01-29 | 2010-01-29 | Printed wiring board |
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| JP2010018265A JP5526818B2 (en) | 2010-01-29 | 2010-01-29 | Printed wiring board |
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| JP2011159686A true JP2011159686A (en) | 2011-08-18 |
| JP5526818B2 JP5526818B2 (en) | 2014-06-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017174997A (en) * | 2016-03-24 | 2017-09-28 | 株式会社村田製作所 | Multilayer substrate and method of manufacturing multilayer substrate |
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|---|---|---|---|---|
| JP2004335921A (en) * | 2003-05-12 | 2004-11-25 | Fujikura Ltd | Multilayer wiring board, substrate for multilayer wiring board, and method for manufacturing these |
| JP2005101269A (en) * | 2003-09-25 | 2005-04-14 | Toyobo Co Ltd | Multilayer printed wiring board |
| JP2006156495A (en) * | 2004-11-25 | 2006-06-15 | Matsushita Electric Works Ltd | Via hole formation metal clad multilayer board and through hole formation unclad board |
| JP2007129017A (en) * | 2005-11-02 | 2007-05-24 | Fujikura Ltd | Multilayer wiring board, substrate therefor, and method of manufacturing same |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335921A (en) * | 2003-05-12 | 2004-11-25 | Fujikura Ltd | Multilayer wiring board, substrate for multilayer wiring board, and method for manufacturing these |
| JP2005101269A (en) * | 2003-09-25 | 2005-04-14 | Toyobo Co Ltd | Multilayer printed wiring board |
| JP2006156495A (en) * | 2004-11-25 | 2006-06-15 | Matsushita Electric Works Ltd | Via hole formation metal clad multilayer board and through hole formation unclad board |
| JP2007129017A (en) * | 2005-11-02 | 2007-05-24 | Fujikura Ltd | Multilayer wiring board, substrate therefor, and method of manufacturing same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2017174997A (en) * | 2016-03-24 | 2017-09-28 | 株式会社村田製作所 | Multilayer substrate and method of manufacturing multilayer substrate |
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