JP2011210930A - Flexible board, and circuit module including the same - Google Patents

Flexible board, and circuit module including the same Download PDF

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JP2011210930A
JP2011210930A JP2010076863A JP2010076863A JP2011210930A JP 2011210930 A JP2011210930 A JP 2011210930A JP 2010076863 A JP2010076863 A JP 2010076863A JP 2010076863 A JP2010076863 A JP 2010076863A JP 2011210930 A JP2011210930 A JP 2011210930A
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pad electrode
flexible substrate
base material
electronic component
wiring
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JP5598054B2 (en
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Kazuhiko Kubota
和彦 久保田
Kenji Kubota
憲二 窪田
Makoto Nagamura
誠 長村
Shunsuke Chisaka
俊介 千阪
Sho Okumura
祥 奥村
Atsushi Nagata
敦 永田
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PROBLEM TO BE SOLVED: To provide a flexible board that allows connection between a wiring from an electronic component and a pad electrode to be executed, without fail, while ensuring flexibility applicable to various electronic devices, and to provide a circuit module which includes the board.SOLUTION: The flexible board 2 includes a flexible base material 21; each pad electrode 23 being provided on the surface of the base material 21 so as to vibrate each wire (wiring) 32 from an electronic component 3 and to allow each wire to be connected therewith; each via (first via) 25 embedded in the base material 21 and jointed to each pad electrode 23. The via (first via) 25 is formed of a material having rigidity which is higher than that of the base material 21.

Description

本発明は、フレキシブル基板及び該フレキシブル基板を備える回路モジュールに関し、特に、振動を加えてパッド電極に電子部品を接続するフレキシブル基板及び該フレキシブル基板を備える回路モジュールに関する。   The present invention relates to a flexible substrate and a circuit module including the flexible substrate, and more particularly to a flexible substrate that applies vibration to connect an electronic component to a pad electrode and a circuit module including the flexible substrate.

近年、携帯端末機器をはじめとする各種電子機器は、小型化、軽量化のために配線基板に可撓性を有する基材を用いたフレキシブル基板を採用している。また、表面にＩＣチップ等の電子部品を実装する回路モジュールは、回路モジュールの基板にフレキシブル基板を採用することで小型化、軽量化が可能になる。   2. Description of the Related Art In recent years, various electronic devices such as portable terminal devices have adopted flexible substrates using flexible base materials for wiring substrates in order to reduce size and weight. In addition, a circuit module on which an electronic component such as an IC chip is mounted on the surface can be reduced in size and weight by adopting a flexible substrate as the circuit module substrate.

フレキシブル基板の表面に、ＩＣチップ等の電子部品を実装する場合、例えば、フレキシブル基板の表面に形成したパッド電極と、電子部品の端子電極とをワイヤボンディング方法を用いて接続する。ワイヤボンディング方法は、端子電極のワイヤの先端をパッド電極に押し当てて振動（例えば、超音波）を加えることで、ワイヤとパッド電極とを接続する。しかし、パッド電極が可撓性を有する基材を用いたフレキシブル基板の表面に形成されている場合、ワイヤの先端をパッド電極に押し当てて振動を加えると、パッド電極が基材の方向に沈み込みワイヤが切断されるという問題があった。また、可撓性を有する基材が、ワイヤに加えた振動を吸収し、ワイヤとパッド電極との接続に問題が生じる場合があった。   When an electronic component such as an IC chip is mounted on the surface of the flexible substrate, for example, a pad electrode formed on the surface of the flexible substrate and a terminal electrode of the electronic component are connected using a wire bonding method. The wire bonding method connects the wire and the pad electrode by pressing the tip of the terminal electrode wire against the pad electrode and applying vibration (for example, ultrasonic waves). However, when the pad electrode is formed on the surface of a flexible substrate using a flexible base material, if the tip of the wire is pressed against the pad electrode and vibration is applied, the pad electrode sinks in the direction of the base material. There was a problem that the wire was cut. In addition, the flexible base material absorbs vibration applied to the wire, which may cause a problem in the connection between the wire and the pad electrode.

そこで、特許文献１では、可撓性を有する基材の略全面に金属補強層を埋め込み、基材の表面にパッド電極を形成することで、ワイヤボンディング方法でフレキシブル基板の表面に電子部品を実装する場合に、パッド電極が基材の方向に沈み込むのを防止し、ワイヤに加えた振動の吸収を低減して、ワイヤとパッド電極との接続を確実に行うことができる。   Therefore, in Patent Document 1, an electronic component is mounted on the surface of a flexible substrate by a wire bonding method by embedding a metal reinforcement layer on substantially the entire surface of a flexible substrate and forming a pad electrode on the surface of the substrate. In this case, it is possible to prevent the pad electrode from sinking in the direction of the base material, reduce absorption of vibration applied to the wire, and reliably connect the wire and the pad electrode.

実公平０６−４５７９３号公報No. 06-45793

しかし、特許文献１では、可撓性を有する基材の略全面に金属補強層を埋め込むため、フレキシブル基板の可撓性が損なわれ、携帯端末機器をはじめとする各種電子機器に採用することができないという問題があった。また、フレキシブル基板において電子部品と接する部分の可撓性が損なわれると、フレキシブル基板の表面に電子部品を実装する場合に、電子部品に加わる衝撃により電子部品に割れや欠けが生じるという問題があった。   However, in Patent Document 1, since the metal reinforcing layer is embedded on substantially the entire surface of the flexible base material, the flexibility of the flexible substrate is impaired, and it can be employed in various electronic devices such as portable terminal devices. There was a problem that I could not. In addition, if the flexibility of the portion of the flexible substrate that contacts the electronic component is impaired, there is a problem that when the electronic component is mounted on the surface of the flexible substrate, the electronic component is cracked or chipped due to the impact applied to the electronic component. It was.

本発明は、上記事情に鑑みてなされたものであり、各種電子機器に採用することが可能な可撓性を確保しつつ、電子部品からの配線とパッド電極との接続を確実に行うことができるフレキシブル基板、及び該フレキシブル基板を備える回路モジュールを提供することを目的とする。   The present invention has been made in view of the above circumstances, and can reliably connect a wiring from an electronic component and a pad electrode while ensuring flexibility that can be employed in various electronic devices. An object of the present invention is to provide a flexible substrate that can be used and a circuit module including the flexible substrate.

上記目的を達成するために第１発明に係るフレキシブル基板は、可撓性を有する基材と、該基材の表面に設けられ、電子部品からの配線に振動を加えて接続するパッド電極と、前記基材に埋め込まれ、前記パッド電極と接合する第１ビアとを備え、前記第１ビアは、前記基材に比べて剛性の高い材料で形成してある。   In order to achieve the above object, a flexible substrate according to the first invention includes a base material having flexibility, a pad electrode provided on the surface of the base material, and connected by applying vibration to wiring from an electronic component, The first via is embedded in the base material and joined to the pad electrode, and the first via is formed of a material having higher rigidity than the base material.

また、第２発明に係るフレキシブル基板は、第１発明において、前記パッド電極と接合する前記第１ビアの接合部分と、前記電子部品からの配線を接続する前記パッド電極の接合部分とは、前記パッド電極を挟んで対向する。   The flexible substrate according to a second aspect of the present invention is the flexible substrate according to the first aspect, wherein the joint portion of the first via that joins the pad electrode and the joint portion of the pad electrode that connects the wiring from the electronic component are Opposite across the pad electrode.

また、第３発明に係るフレキシブル基板は、第１又は第２発明において、前記パッド電極と接合する前記第１ビアは、複数である。   The flexible substrate according to a third aspect of the present invention is the first or second aspect of the present invention, wherein there are a plurality of the first vias joined to the pad electrode.

また、第４発明に係るフレキシブル基板は、第１乃至第３発明のいずれか一つにおいて、前記第１ビアは、前記パッド電極と接合する接合面の面積が、該接合面に平行な別の面の面積より小さいテーパ形状である。   The flexible substrate according to a fourth aspect of the present invention is the flexible substrate according to any one of the first to third aspects, wherein the first via has another area where the area of the bonding surface bonded to the pad electrode is parallel to the bonding surface. The taper shape is smaller than the surface area.

また、第５発明に係るフレキシブル基板は、第４発明において、前記第１ビアの前記接合面に平行な別の面の面積は、前記パッド電極の前記第１ビアと接合する接合面の面積以下である。   In the flexible substrate according to a fifth aspect of the present invention, in the fourth aspect, the area of another surface parallel to the bonding surface of the first via is equal to or less than the area of the bonding surface bonded to the first via of the pad electrode. It is.

また、第６発明に係るフレキシブル基板は、第１乃至第５発明のいずれか一つにおいて、前記第１ビアは、絶縁材料である。   The flexible substrate according to a sixth aspect of the present invention is the flexible substrate according to any one of the first to fifth aspects, wherein the first via is an insulating material.

また、第７発明に係るフレキシブル基板は、第１乃至第６発明のいずれか一つにおいて、複数の前記基材が積層され、複数の前記基材のそれぞれに埋め込まれた前記第１ビアが互いに接合する。   A flexible substrate according to a seventh aspect is the flexible substrate according to any one of the first to sixth aspects, wherein the plurality of base materials are stacked, and the first vias embedded in the plurality of base materials are mutually connected. Join.

また、第８発明に係るフレキシブル基板は、第１乃至第７発明のいずれか一つにおいて、前記第１ビアは、前記基材に設けてある面内配線の間を電気的に接続するための第２ビアと同じ材料で形成してある。   The flexible substrate according to an eighth invention is the flexible substrate according to any one of the first to seventh inventions, wherein the first via is for electrically connecting in-plane wirings provided in the base material. It is made of the same material as the second via.

また、第９発明に係るフレキシブル基板は、第１乃至第８発明のいずれか一つにおいて、前記第１ビアの凸部と、前記パッド電極の凹部とを嵌合して前記第１ビアと前記パッド電極とを接合する。   A flexible substrate according to a ninth aspect of the present invention is the flexible substrate according to any one of the first to eighth aspects, wherein the convex portion of the first via and the concave portion of the pad electrode are fitted to each other and the first via Bond the pad electrode.

また、第１０発明に係るフレキシブル基板は、第１乃至第９発明のいずれか一つにおいて、複数の前記基材が積層され、前記第１ビアは、前記基材と前記基材との間に形成される面内配線のうち、別の面内配線と電気的に接続していない配線と接合する。   The flexible substrate according to a tenth invention is the flexible substrate according to any one of the first to ninth inventions, wherein the plurality of base materials are laminated, and the first via is between the base material and the base material. Among the in-plane wirings to be formed, bonding is performed with a wiring that is not electrically connected to another in-plane wiring.

上記目的を達成するために第１１発明に係る回路モジュールは、電子部品と、可撓性を有する基材と、該基材の表面に設けられ、前記電子部品からの配線に振動を加えて接続するパッド電極と、前記基材に埋め込まれ、前記パッド電極と接合する第１ビアとを有するフレキシブル基板とを備え、前記第１ビアは、前記基材に比べて剛性の高い材料で形成してある。   In order to achieve the above object, a circuit module according to an eleventh invention is provided with an electronic component, a flexible base material, a surface of the base material, and connected to the wiring from the electronic component by applying vibration. And a flexible substrate having a first via embedded in the base material and bonded to the pad electrode, wherein the first via is formed of a material having higher rigidity than the base material. is there.

第１発明では、フレキシブル基板は、可撓性を有する基材の表面に設けられたパッド電極と接合し、基材に比べて剛性の高い材料で形成してある第１ビアを備えるので、基材に比べて剛性の高い材料を略全面に設けるのではなく、基材に比べて剛性の高い材料で形成してある第１ビアを基材のパッド電極が存在する部分にのみ設けることができ、各種電子機器に採用することが可能な可撓性を確保しつつパッド電極を補強することが可能となり、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the first invention, the flexible substrate is bonded to the pad electrode provided on the surface of the flexible base material, and includes the first via formed of a material having higher rigidity than the base material. Rather than providing a material with higher rigidity compared to the material, the first via formed of a material higher in rigidity than the base material can be provided only in the portion where the pad electrode of the base material exists. The pad electrode can be reinforced while ensuring the flexibility that can be used in various electronic devices, and the wiring from the electronic component and the pad electrode can be securely connected to mount the electronic component. The reliability of the substrate is improved.

第２発明では、パッド電極と接合する第１ビアの接合部分と、電子部品からの配線を接続するパッド電極の接合部分とは、パッド電極を挟んで対向するので、電子部品からの配線を接続するパッド電極を第１ビアで確実に補強することができ、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the second invention, the joint portion of the first via that joins the pad electrode and the joint portion of the pad electrode that connects the wiring from the electronic component face each other with the pad electrode interposed therebetween, so the wiring from the electronic component is connected The pad electrode to be reinforced can be surely reinforced with the first via, and the wiring from the electronic component and the pad electrode are reliably connected to improve the reliability of the flexible substrate on which the electronic component is mounted.

第３発明では、パッド電極と接合する第１ビアは、複数あるので、複数の第１ビアと接合するパッド電極が基材の表面から剥離しにくく、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the third invention, since there are a plurality of first vias bonded to the pad electrode, the pad electrodes bonded to the plurality of first vias are difficult to peel off from the surface of the substrate, and the wiring from the electronic component and the pad electrode are surely secured. The reliability of the flexible substrate mounted with the electronic component is improved.

第４発明では、第１ビアは、パッド電極と接合する接合面の面積が、該接合面に平行な別の面の面積より小さいテーパ形状であるので、第１ビアがパッド電極の方向に抜けにくくなり、第１ビアと接合するパッド電極が基材の表面から剥離しにくく、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the fourth invention, since the first via has a tapered shape in which the area of the bonding surface bonded to the pad electrode is smaller than the area of another surface parallel to the bonding surface, the first via is removed in the direction of the pad electrode. The pad electrode joined to the first via is difficult to peel off from the surface of the base material, and the wiring from the electronic component and the pad electrode are securely connected to improve the reliability of the flexible substrate on which the electronic component is mounted. .

第５発明では、第１ビアの接合面に平行な別の面の面積は、パッド電極の第１ビアと接合する接合面の面積以下であるので、基材の電子部品が接する部分の可撓性を確保しつつパッド電極を補強することが可能となる。   In the fifth invention, the area of another surface parallel to the bonding surface of the first via is equal to or less than the area of the bonding surface bonded to the first via of the pad electrode. Thus, it is possible to reinforce the pad electrode while securing the property.

第６発明では、第１ビアは、絶縁材料であるので、第１ビアを介して電子部品からの電流が漏れることがないため、電子部品の動作の信頼性が向上する。   In the sixth invention, since the first via is an insulating material, the current from the electronic component does not leak through the first via, so that the reliability of the operation of the electronic component is improved.

第７発明では、複数の基材のそれぞれに埋め込まれた第１ビアが互いに接合するので、第１ビアと接合するパッド電極が基材の表面から剥離しにくく、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the seventh invention, since the first vias embedded in each of the plurality of base materials are joined to each other, the pad electrode joined to the first via is hardly peeled off from the surface of the base material, and the wiring from the electronic component and the pad electrode And the reliability of the flexible board on which the electronic component is mounted is improved.

第８発明では、第１ビアは、基材に設けてある面内配線の間を電気的に接続するための第２ビアと同じ材料で形成してあるので、第１ビアと第２ビアとを同じ工程で形成することができ、第１ビアを形成するコストを低減することができる。   In the eighth invention, since the first via is formed of the same material as the second via for electrically connecting the in-plane wirings provided in the base material, the first via and the second via Can be formed in the same process, and the cost of forming the first via can be reduced.

第９発明では、第１ビアの凸部と、パッド電極の凹部とを嵌合して第１ビアとパッド電極とを接合するので、第１ビアとパッド電極とが強く接合され、第１ビアと接合するパッド電極が基材の表面から剥離しにくく、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the ninth invention, since the first via and the pad electrode are joined by fitting the convex portion of the first via and the concave portion of the pad electrode, the first via and the pad electrode are strongly joined, and the first via The pad electrode to be bonded is difficult to peel off from the surface of the base material, and the wiring from the electronic component and the pad electrode are securely connected to improve the reliability of the flexible substrate on which the electronic component is mounted.

第１０発明では、複数の基材が積層され、第１ビアは、基材と基材との間に形成される面内配線のうち、別の面内配線と電気的に接続していない配線と接合するので、第１ビアがパッド電極の方向に抜けにくくなり、第１ビアと接合するパッド電極が基材の表面から剥離しにくく、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the tenth invention, a plurality of base materials are laminated, and the first via is a wiring that is not electrically connected to another in-plane wiring among the in-plane wirings formed between the base material and the base material. Since the first via is difficult to come off in the direction of the pad electrode, the pad electrode joined to the first via is difficult to peel off from the surface of the base material, and the wiring from the electronic component and the pad electrode are securely connected. Thus, the reliability of the flexible substrate on which the electronic component is mounted is improved.

第１１発明では、電子部品と、可撓性を有する基材の表面に設けられたパッド電極と、パッド電極と接合し、基材に比べて剛性の高い材料で形成してある第１ビアとを有するフレキシブル基板とを備えるので、各種電子機器に採用することが可能な可撓性を確保しつつパッド電極を補強することが可能となり、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the eleventh aspect of the invention, the electronic component, the pad electrode provided on the surface of the flexible base material, the first via formed by joining the pad electrode and having a higher rigidity than the base material, Since the pad electrode can be reinforced while ensuring the flexibility that can be employed in various electronic devices, the wiring from the electronic component and the pad electrode can be securely connected. Thus, the reliability of the flexible substrate on which the electronic component is mounted is improved.

本発明は、フレキシブル基板は、可撓性を有する基材の表面に設けられたパッド電極と接合し、基材に比べて剛性の高い材料で形成してある第１ビアを備えるので、各種電子機器に採用することが可能な可撓性を確保しつつパッド電極を補強することが可能となり、電子部品からの配線とパッド電極とを確実に接続して、電子部品を実装したフレキシブル基板の信頼性が向上する。   In the present invention, the flexible substrate is bonded to the pad electrode provided on the surface of the base material having flexibility, and includes the first via formed of a material having higher rigidity than the base material. It is possible to reinforce the pad electrode while ensuring the flexibility that can be used in equipment, and the reliability of the flexible board on which the electronic component is mounted by securely connecting the wiring from the electronic component and the pad electrode. Improves.

本発明の実施の形態１に係る回路モジュールの構成を示す断面図である。It is sectional drawing which shows the structure of the circuit module which concerns on Embodiment 1 of this invention. 従来のフレキシブル基板のパッド電極の構成を示す断面図である。It is sectional drawing which shows the structure of the pad electrode of the conventional flexible substrate. 本発明の実施の形態１に係るフレキシブル基板のパッド電極の構成を示す断面図である。It is sectional drawing which shows the structure of the pad electrode of the flexible substrate which concerns on Embodiment 1 of this invention. 本発明の実施の形態２に係るフレキシブル基板のパッド電極の構成を示す断面図である。It is sectional drawing which shows the structure of the pad electrode of the flexible substrate which concerns on Embodiment 2 of this invention. 本発明の実施の形態３に係るフレキシブル基板のパッド電極の構成を示す断面図である。It is sectional drawing which shows the structure of the pad electrode of the flexible substrate which concerns on Embodiment 3 of this invention. 本発明の実施の形態４に係るフレキシブル基板のパッド電極の構成を示す断面図である。It is sectional drawing which shows the structure of the pad electrode of the flexible substrate which concerns on Embodiment 4 of this invention. 本発明の実施の形態５に係るフレキシブル基板のパッド電極の構成を示す断面図である。It is sectional drawing which shows the structure of the pad electrode of the flexible substrate which concerns on Embodiment 5 of this invention. 本発明の実施の形態６に係る回路モジュールの構成を示す断面図である。It is sectional drawing which shows the structure of the circuit module which concerns on Embodiment 6 of this invention. 本発明の実施の形態７に係るフレキシブル基板のパッド電極の構成を示す断面図である。It is sectional drawing which shows the structure of the pad electrode of the flexible substrate which concerns on Embodiment 7 of this invention. 本発明の実施の形態７に係るフレキシブル基板のパッド電極の構成を示す平面図である。It is a top view which shows the structure of the pad electrode of the flexible substrate which concerns on Embodiment 7 of this invention.

（実施の形態１）
図１は、本発明の実施の形態１に係る回路モジュールの構成を示す断面図である。図１に示す回路モジュール１は、フレキシブル基板２、可撓性を有する複数の基材２１、２１、２１で構成されたフレキシブル基板２に実装する電子部品３を備えている。フレキシブル基板２は、可撓性を有する基材２１が複数積層され、基材２１の表面に所定のパターンの面内配線２２が形成されている。つまり、面内配線２２は、積層された基材２１と基材２１との間、フレキシブル基板２の表面を構成する基材２１の表面に形成されている。また、フレキシブル基板２の表面を構成する基材２１の表面には、所定のパターンのパッド電極２３も形成されている。パッド電極２３は、電子部品３からのワイヤ（配線）３２と接続するとともに、基材２１の表面に形成された面内配線２２とも接続されている。異なる基材２１の表面に形成された複数の面内配線２２の間を電気的に接続するためのビア（第２ビア）２４が基材２１に埋め込まれている。ここで、基材２１は、シート状の素材であり、例えばポリイミド等の熱硬化性樹脂や、液晶ポリマ、ポリエーテルエーテルケトン等の熱可塑性樹脂が用いられる。面内配線２２やパッド電極２３には、Ｃｕ箔等の金属導体が用いられている。ビア２４には、Ｓｎ−Ａｇ合金等の金属導体（金属焼結体）が用いられている。 (Embodiment 1)
1 is a cross-sectional view showing a configuration of a circuit module according to Embodiment 1 of the present invention. A circuit module 1 shown in FIG. 1 includes a flexible substrate 2 and an electronic component 3 mounted on the flexible substrate 2 composed of a plurality of flexible base materials 21, 21, 21. A plurality of flexible base materials 21 are stacked on the flexible substrate 2, and a predetermined pattern of in-plane wirings 22 is formed on the surface of the base material 21. That is, the in-plane wiring 22 is formed between the laminated base material 21 and the base material 21 on the surface of the base material 21 constituting the surface of the flexible substrate 2. A pad electrode 23 having a predetermined pattern is also formed on the surface of the base material 21 constituting the surface of the flexible substrate 2. The pad electrode 23 is connected to a wire (wiring) 32 from the electronic component 3 and is also connected to an in-plane wiring 22 formed on the surface of the substrate 21. Vias (second vias) 24 for electrically connecting a plurality of in-plane wirings 22 formed on the surfaces of different base materials 21 are embedded in the base material 21. Here, the base material 21 is a sheet-like material, and for example, a thermosetting resin such as polyimide, or a thermoplastic resin such as liquid crystal polymer or polyether ether ketone is used. A metal conductor such as a Cu foil is used for the in-plane wiring 22 and the pad electrode 23. A metal conductor (metal sintered body) such as a Sn—Ag alloy is used for the via 24.

フレキシブル基板２の製造方法は、従来の方法と同じである。すなわち、まずリソグラフィ法を用いて基材２１の表面に所定のパターンの面内配線２２及びパッド電極２３を形成する。面内配線２２又はパッド電極２３を形成した基材２１の表面とは反対側の基材２１の表面にレーザ光を照射してビアホールを形成し、形成したビアホールに金属導体を埋め込みビア２４を形成する。面内配線２２、パッド電極２３、ビア２４を形成した基材２１を複数積層し、各層間を接着剤で接着する。   The manufacturing method of the flexible substrate 2 is the same as the conventional method. That is, first, the in-plane wiring 22 and the pad electrode 23 having a predetermined pattern are formed on the surface of the substrate 21 by using a lithography method. A via hole is formed by irradiating the surface of the base 21 opposite to the surface of the base 21 on which the in-plane wiring 22 or the pad electrode 23 is formed, and a via 24 is formed by embedding a metal conductor in the formed via hole. To do. A plurality of base materials 21 on which in-plane wirings 22, pad electrodes 23, and vias 24 are formed are stacked, and the respective layers are bonded with an adhesive.

フレキシブル基板２に実装する電子部品３は、例えばＩＣチップである。電子部品３がＩＣチップの場合、ワイヤボンディング方法を用いてフレキシブル基板２と電子部品３とを接続する。ワイヤボンディング方法では、まず一次側として電子部品３の電極３１にワイヤ３２を押し当て、ワイヤ３２に振動（例えば超音波）を加えて電子部品３の電極３１に接続する。次に二次側としてフレキシブル基板２のパッド電極２３にワイヤ３２を押し当て、ワイヤ３２に振動（例えば超音波）を加えてパッド電極２３に接続する。なお、本発明の実施の形態１では、二次側であるフレキシブル基板２のパッド電極２３とワイヤ３２との接続について説明する。   The electronic component 3 mounted on the flexible substrate 2 is, for example, an IC chip. When the electronic component 3 is an IC chip, the flexible substrate 2 and the electronic component 3 are connected using a wire bonding method. In the wire bonding method, first, the wire 32 is pressed against the electrode 31 of the electronic component 3 as the primary side, and vibration (for example, ultrasonic waves) is applied to the wire 32 to connect to the electrode 31 of the electronic component 3. Next, as a secondary side, a wire 32 is pressed against the pad electrode 23 of the flexible substrate 2, and vibration (for example, ultrasonic waves) is applied to the wire 32 to connect to the pad electrode 23. In the first embodiment of the present invention, the connection between the pad electrode 23 of the flexible substrate 2 on the secondary side and the wire 32 will be described.

図２は、従来のフレキシブル基板のパッド電極の構成を示す断面図である。図２（ａ）はワイヤ１０４を接続する前のパッド電極１０２の構成を示す断面図、図２（ｂ）はワイヤ１０４を接続する場合のパッド電極１０２の構成を示す断面図である。図２（ａ）に示すように、従来のフレキシブル基板１００のパッド電極１０２は、可撓性を有する基材１０１の表面に形成してある。そのため、図２（ｂ）に示すように、ワイヤボンディング方法で用いるキャピラリ１０３を用いてワイヤ１０４をパッド電極１０２に押し当て、ワイヤ１０４に振動を加えた場合、パッド電極１０２が基材１０１の方向に沈み込むことによりワイヤ１０４が切断される、あるいは基材１０１がワイヤ１０４に加えた振動を吸収してワイヤ１０４とパッド電極１０２との接続に問題が生じる場合があった。   FIG. 2 is a cross-sectional view showing a configuration of a pad electrode of a conventional flexible substrate. 2A is a cross-sectional view showing the configuration of the pad electrode 102 before connecting the wire 104, and FIG. 2B is a cross-sectional view showing the configuration of the pad electrode 102 when connecting the wire 104. As shown in FIG. As shown in FIG. 2A, the pad electrode 102 of the conventional flexible substrate 100 is formed on the surface of a base material 101 having flexibility. Therefore, as shown in FIG. 2B, when the wire 104 is pressed against the pad electrode 102 using the capillary 103 used in the wire bonding method and vibration is applied to the wire 104, the pad electrode 102 is oriented in the direction of the substrate 101. In some cases, the wire 104 is cut by sinking into the wire, or the substrate 101 absorbs vibration applied to the wire 104 to cause a problem in the connection between the wire 104 and the pad electrode 102.

図１に戻って、本発明の実施の形態１に係るフレキシブル基板２は、パッド電極２３と接合するビア（第１ビア）２５が基材２１に埋め込まれている。ビア２５には、ビア２４と同じ材料のＳｎ−Ａｇ合金等の金属導体（金属焼結体）が用いられているが、これに限定されるものではなく、基材２１に比べて剛性の高い材料で形成してあれば良い。基材２１に比べて剛性の高い材料には、例えばＣｕ等の金属導体がある。また、ビア２５は、同じ基材２１に形成されているビア２４と同じ工程で形成しても、別の工程で形成しても良い。ビア２５をビア２４と同じ工程で形成する場合、ビア２５を形成するコストを低減することができる。   Returning to FIG. 1, in the flexible substrate 2 according to the first embodiment of the present invention, a via (first via) 25 bonded to the pad electrode 23 is embedded in the base material 21. For the via 25, a metal conductor (metal sintered body) such as an Sn—Ag alloy made of the same material as that of the via 24 is used. However, the via 25 is not limited to this and has higher rigidity than the base material 21. What is necessary is just to form with a material. Examples of the material having higher rigidity than the base material 21 include a metal conductor such as Cu. The via 25 may be formed in the same process as the via 24 formed on the same base material 21 or may be formed in a different process. When the via 25 is formed in the same process as the via 24, the cost for forming the via 25 can be reduced.

図３は、本発明の実施の形態１に係るフレキシブル基板２のパッド電極２３の構成を示す断面図である。図３（ａ）はワイヤ３２を接続する前のパッド電極２３の構成を示す断面図であり、図３（ｂ）はワイヤ３２を接続したパッド電極２３の構成を示す断面図である。図３（ａ）に示すように、本発明の実施の形態１に係るフレキシブル基板２のパッド電極２３は、可撓性を有する基材２１の表面に形成され、基材２１に埋め込まれているビア２５と接合する。そのため、図３（ｂ）に示すように、パッド電極２３は、ワイヤボンディング方法で用いるキャピラリ１０３を用いてワイヤ３２をパッド電極２３に押し当て、ワイヤ３２に振動を加えた場合であっても、接合したビア２５によりパッド電極２３が基材２１の方向に沈み込まない。したがって、基材２１のワイヤ３２に加えた振動の吸収を低減することができ、ワイヤ３２が切断されず、ワイヤ３２とパッド電極２３とを確実に接続することができる。なお、ビア２５は、パッド電極２３を表面に形成した基材２１には埋め込まれているが、パッド電極２３を表面に形成した基材２１の下層の基材２１には埋め込まれていない。また、パッド電極２３がＣｕ箔で、ビア２５がＳｎ−Ａｇ合金でそれぞれ形成されている場合、パッド電極２３とビア２５との境界部にはＳｎ−Ｃｕ系の固相拡散層が形成されるので、ビア２５とパッド電極２３とを強固に接合することができる。   FIG. 3 is a cross-sectional view showing the configuration of the pad electrode 23 of the flexible substrate 2 according to the first embodiment of the present invention. 3A is a cross-sectional view showing the configuration of the pad electrode 23 before the wire 32 is connected, and FIG. 3B is a cross-sectional view showing the configuration of the pad electrode 23 to which the wire 32 is connected. As shown in FIG. 3A, the pad electrode 23 of the flexible substrate 2 according to the first embodiment of the present invention is formed on the surface of the flexible base material 21 and embedded in the base material 21. Bonded with the via 25. Therefore, as shown in FIG. 3B, even if the pad electrode 23 is a case where the wire 32 is pressed against the pad electrode 23 using the capillary 103 used in the wire bonding method and vibration is applied to the wire 32, The pad electrode 23 does not sink in the direction of the base material 21 due to the bonded via 25. Therefore, absorption of vibration applied to the wire 32 of the base material 21 can be reduced, the wire 32 is not cut, and the wire 32 and the pad electrode 23 can be reliably connected. The via 25 is embedded in the base material 21 with the pad electrode 23 formed on the surface, but is not embedded in the base material 21 below the base material 21 with the pad electrode 23 formed on the surface. When the pad electrode 23 is made of Cu foil and the via 25 is made of an Sn—Ag alloy, an Sn—Cu solid phase diffusion layer is formed at the boundary between the pad electrode 23 and the via 25. Therefore, the via 25 and the pad electrode 23 can be firmly bonded.

ビア２５は、パッド電極２３と接合する接合面の面積が、該接合面に平行な別の面の面積より小さいテーパ形状である。そのため、ビア２５は、パッド電極２３の方向に抜けにくい。当該形状のビア２５と接合したパッド電極２３は、単に基材１０１の表面に形成した図２（ａ）に示す従来のフレキシブル基板１００のパッド電極１０２に比べて、基材２１の表面から剥離しにくくなり、ワイヤボンディング方法を用いて電子部品３からのワイヤ３２とパッド電極２３とを確実に接続して、電子部品３を実装したフレキシブル基板２の信頼性が向上する。   The via 25 has a tapered shape in which the area of the bonding surface bonded to the pad electrode 23 is smaller than the area of another surface parallel to the bonding surface. For this reason, the via 25 is not easily removed in the direction of the pad electrode 23. The pad electrode 23 bonded to the via 25 having the shape is peeled off from the surface of the base material 21 as compared with the pad electrode 102 of the conventional flexible substrate 100 shown in FIG. This makes it difficult to reliably connect the wire 32 from the electronic component 3 and the pad electrode 23 by using a wire bonding method, thereby improving the reliability of the flexible substrate 2 on which the electronic component 3 is mounted.

また、ビア２５は、パッド電極２３と接合する接合面に平行な別の面の面積が、パッド電極２３のビア２５と接合する接合面の面積以下である。そのため、ビア２５は、パッド電極２３の直下の基材２１には埋め込まれているが、図１に示すようにパッド電極２３が設けられていない部分の直下の基材２１には埋め込まれていない。従って、フレキシブル基板２は、各種電子機器に採用することが可能な可撓性を確保しつつ、ワイヤボンディング方法を用いて電子部品３からのワイヤ３２とパッド電極２３とを接続する場合に生じる不具合を防止できる程度にパッド電極２３を補強することができる。さらに、ビア２５は、パッド電極２３が設けられていない部分の直下の基材２１には埋め込まれていないことから、電子部品３が基材２１と接する部分の直下の基材２１にも埋め込まれることはない。よって、基材２１の電子部品３と接する部分は可撓性を確保することができるので、フレキシブル基板２に電子部品３を実装する場合に、電子部品３に加わる衝撃を緩和することができ、電子部品３の割れや欠けを防止することができる。   In addition, the area of another surface of the via 25 parallel to the bonding surface bonded to the pad electrode 23 is equal to or smaller than the area of the bonding surface bonded to the via 25 of the pad electrode 23. Therefore, the via 25 is embedded in the base material 21 immediately below the pad electrode 23, but is not embedded in the base material 21 immediately below the portion where the pad electrode 23 is not provided as shown in FIG. . Therefore, the flexible substrate 2 has a defect that occurs when the wire 32 from the electronic component 3 and the pad electrode 23 are connected using the wire bonding method while ensuring flexibility that can be employed in various electronic devices. It is possible to reinforce the pad electrode 23 to the extent that can be prevented. Further, since the via 25 is not embedded in the base material 21 immediately below the portion where the pad electrode 23 is not provided, the via 25 is also embedded in the base material 21 immediately below the portion where the electronic component 3 is in contact with the base material 21. There is nothing. Therefore, since the part which contacts the electronic component 3 of the base material 21 can ensure flexibility, when mounting the electronic component 3 on the flexible substrate 2, the impact applied to the electronic component 3 can be reduced. It is possible to prevent the electronic component 3 from cracking or chipping.

以上のように、本発明の実施の形態１に係る回路モジュール１は、可撓性を有する基材２１の表面に設けられたパッド電極２３と接合し、基材２１に比べて剛性の高い材料で形成してあるビア２５を有するフレキシブル基板２を備えているので、各種電子機器に採用することが可能な可撓性を確保しつつパッド電極２３を補強することが可能となり、電子部品３からのワイヤ３２とパッド電極２３とを確実に接続して、電子部品３を実装したフレキシブル基板２の信頼性が向上する。なお、本実施の形態１では、ビア２５は、積層された基材２１と基材２１との間に形成された面内配線２２とは電気的に接続していないので、ワイヤボンディング方法を用いて電子部品３からのワイヤ３２とパッド電極２３とを接続する際に圧力や振動が加わってもフレキシブル基板２の電気的な接続に影響を与えることはない。もっとも、ビア２５が面内配線２２と接続されていても、パッド電極２３を補強するという効果は奏する。   As described above, the circuit module 1 according to Embodiment 1 of the present invention is bonded to the pad electrode 23 provided on the surface of the flexible base material 21 and has a higher rigidity than the base material 21. Since the flexible substrate 2 having the via 25 formed in the above-described configuration is provided, the pad electrode 23 can be reinforced while ensuring flexibility that can be employed in various electronic devices. The wire 32 and the pad electrode 23 are securely connected, and the reliability of the flexible substrate 2 on which the electronic component 3 is mounted is improved. In the first embodiment, since the via 25 is not electrically connected to the in-plane wiring 22 formed between the laminated base material 21 and the base material 21, a wire bonding method is used. Thus, even when pressure or vibration is applied when the wire 32 from the electronic component 3 and the pad electrode 23 are connected, the electrical connection of the flexible substrate 2 is not affected. However, even if the via 25 is connected to the in-plane wiring 22, the effect of reinforcing the pad electrode 23 is exhibited.

また、パッド電極２３と接合するビア２５の接合部分と、電子部品３からのワイヤ３２を接続するパッド電極２３の接合部分とは、パッド電極２３を挟んで対向しているので、電子部品３からのワイヤ３２を接続するパッド電極２３をビア２５で確実に補強することができ、電子部品３からのワイヤ３２とパッド電極２３とを確実に接続することができる。   Further, since the joint portion of the via 25 that joins the pad electrode 23 and the joint portion of the pad electrode 23 that connects the wire 32 from the electronic component 3 face each other with the pad electrode 23 interposed therebetween, the electronic component 3 The pad electrode 23 for connecting the wire 32 can be reliably reinforced by the via 25, and the wire 32 from the electronic component 3 and the pad electrode 23 can be reliably connected.

（実施の形態２）
図４は、本発明の実施の形態２に係るフレキシブル基板２のパッド電極２３の構成を示す断面図である。なお、本発明の実施の形態２に係る回路モジュール１、及びフレキシブル基板２の構成は、図４で説明する構成以外、実施の形態１で説明した構成と同じであるため、同じ構成には同じ符号を付して詳細な説明は省略する。 (Embodiment 2)
FIG. 4 is a cross-sectional view showing the configuration of the pad electrode 23 of the flexible substrate 2 according to Embodiment 2 of the present invention. The configurations of the circuit module 1 and the flexible substrate 2 according to Embodiment 2 of the present invention are the same as those described in Embodiment 1 except for the configuration described in FIG. A detailed description is omitted with reference numerals.

図４に示す本発明の実施の形態２に係るフレキシブル基板２のパッド電極２３は、可撓性を有する基材２１の表面に形成され、基材２１に埋め込まれているビア（第１ビア）４１と接合する。ビア４１は、実施の形態１で説明したビア２５と形状や形成方法は同じであるが、用いる材料が絶縁材料である点で異なる。ビア４１に用いる絶縁材料には、例えばエポキシ樹脂等の熱硬化性樹脂や、シリカ等のフィラーを混ぜた樹脂がある。また、ビア４１は、パッド電極２３との接合を強化するために、パッド電極２３と接した状態でビア４１を構成する絶縁材料である樹脂を硬化する。   The pad electrode 23 of the flexible substrate 2 according to the second embodiment of the present invention shown in FIG. 4 is formed on the surface of the flexible base material 21 and is embedded in the base material 21 (first via). 41 is joined. The via 41 has the same shape and formation method as the via 25 described in the first embodiment, but differs in that the material used is an insulating material. Examples of the insulating material used for the via 41 include a thermosetting resin such as an epoxy resin and a resin mixed with a filler such as silica. In addition, the via 41 is cured with a resin, which is an insulating material constituting the via 41, in contact with the pad electrode 23 in order to strengthen the bonding with the pad electrode 23.

以上のように、本発明の実施の形態２に係るフレキシブル基板２は、ビア４１が絶縁材料であるので、ビア４１を介して電子部品３からの電流が漏れることがないため、電子部品３の動作の信頼性が向上する。   As described above, in the flexible substrate 2 according to the second embodiment of the present invention, since the via 41 is an insulating material, current from the electronic component 3 does not leak through the via 41. Reliability of operation is improved.

（実施の形態３）
図５は、本発明の実施の形態３に係るフレキシブル基板２のパッド電極２３の構成を示す断面図である。なお、本発明の実施の形態３に係る回路モジュール１、及びフレキシブル基板２の構成は、図５で説明する構成以外、実施の形態１で説明した構成と同じであるため、同じ構成には同じ符号を付して詳細な説明は省略する。 (Embodiment 3)
FIG. 5 is a cross-sectional view showing the configuration of the pad electrode 23 of the flexible substrate 2 according to Embodiment 3 of the present invention. The configurations of the circuit module 1 and the flexible substrate 2 according to Embodiment 3 of the present invention are the same as those described in Embodiment 1 except for the configuration described in FIG. A detailed description is omitted with reference numerals.

図５に示す本発明の実施の形態３に係るフレキシブル基板２のパッド電極２３は、可撓性を有する基材２１の表面に形成され、基材２１に埋め込まれているビア（第１ビア）５１と接合する。ビア５１は、さらにビア５１の下層の基材２１に埋め込まれているビア（第１ビア）５２と接合する。   The pad electrode 23 of the flexible substrate 2 according to the third embodiment of the present invention shown in FIG. 5 is formed on the surface of the flexible base material 21 and is embedded in the base material 21 (first via). Join to 51. The via 51 is further joined to a via (first via) 52 embedded in the base material 21 below the via 51.

ビア５１は、パッド電極２３と接合する接合面の面積が、該接合面に平行な別の面の面積より大きいテーパ形状である。一方、ビア５２は、ビア５１と接合する接合面の面積が、該接合面に平行な別の面の面積より小さいテーパ形状である。ビア５１とビア５２とを接合することで、ビア５１、５２は、パッド電極２３の方向にも逆方向にも抜けにくくなる。当該ビア５１、５２と接合したパッド電極２３は、実施の形態１で形成したパッド電極２３に比べて、基材２１の表面から剥離しにくくなる。   The via 51 has a tapered shape in which the area of the bonding surface bonded to the pad electrode 23 is larger than the area of another surface parallel to the bonding surface. On the other hand, the via 52 has a tapered shape in which the area of the bonding surface bonded to the via 51 is smaller than the area of another surface parallel to the bonding surface. By joining the via 51 and the via 52, the vias 51 and 52 are not easily removed in the direction of the pad electrode 23 or in the opposite direction. The pad electrode 23 bonded to the vias 51 and 52 is less likely to peel from the surface of the substrate 21 than the pad electrode 23 formed in the first embodiment.

なお、ビア５１、５２の形状は、図５に示すテーパ形状に限定されるものではない。また、ビア５１、５２は、実施の形態１で説明した形成方法で形成され、金属導体、絶縁材料のいずれの材料であっても良い。また、ビア５１とビア５２とで、形状、サイズが異なっても良い。   The vias 51 and 52 are not limited to the tapered shape shown in FIG. The vias 51 and 52 are formed by the formation method described in the first embodiment, and may be any material of a metal conductor and an insulating material. Further, the via 51 and the via 52 may have different shapes and sizes.

以上のように、本発明の実施の形態３に係るフレキシブル基板２は、複数の基材２１が積層され、複数の基材２１に埋め込まれたビア５１、５２が互いに接合するので、ビア５１と接合するパッド電極２３が基材２１の表面から剥離しにくくなる。また、パッド電極２３を補強するビア５１，５２の体積が増え、剛性がより増すので、ワイヤボンディング方法を用いて電子部品３からのワイヤ３２とパッド電極２３とをより確実に接続して、電子部品３を実装したフレキシブル基板２の信頼性が向上する。   As described above, in the flexible substrate 2 according to the third embodiment of the present invention, the plurality of base materials 21 are laminated, and the vias 51 and 52 embedded in the plurality of base materials 21 are joined to each other. The pad electrode 23 to be joined becomes difficult to peel off from the surface of the substrate 21. Moreover, since the volume of the vias 51 and 52 that reinforce the pad electrode 23 is increased and the rigidity is further increased, the wire 32 from the electronic component 3 and the pad electrode 23 are more reliably connected by using a wire bonding method, and The reliability of the flexible substrate 2 on which the component 3 is mounted is improved.

（実施の形態４）
図６は、本発明の実施の形態４に係るフレキシブル基板２のパッド電極２３の構成を示す断面図である。なお、本発明の実施の形態４に係る回路モジュール１、及びフレキシブル基板２の構成は、図６で説明する構成以外、実施の形態１で説明した構成と同じであるため、同じ構成には同じ符号を付して詳細な説明は省略する。 (Embodiment 4)
FIG. 6 is a cross-sectional view showing the configuration of the pad electrode 23 of the flexible substrate 2 according to Embodiment 4 of the present invention. The configurations of the circuit module 1 and the flexible substrate 2 according to Embodiment 4 of the present invention are the same as those described in Embodiment 1 except for the configuration described in FIG. A detailed description is omitted with reference numerals.

図６に示す本発明の実施の形態４に係るフレキシブル基板２のパッド電極２３は、可撓性を有する基材２１の表面に形成され、基材２１に埋め込まれているビア（第１ビア）６１と接合する。ビア６１とパッド電極２３とは、ビア６１の凸部６１ａとパッド電極２３の凹部２３ａとを嵌合して接合している。なお、パッド電極２３の凹部２３ａは、ビア６１のビアホールを形成する際のレーザ光照射を用いてパッド電極２３の表面に容易に形成することができる。また、ビア６１の凸部６１ａは、凹部２３ａを形成したパッド電極２３を底部とするビアホールに金属導体又は絶縁材料を埋め込むことで容易に形成することができる。   The pad electrode 23 of the flexible substrate 2 according to the fourth embodiment of the present invention shown in FIG. 6 is a via (first via) formed on the surface of the flexible base material 21 and embedded in the base material 21. 61 is joined. The via 61 and the pad electrode 23 are joined by fitting the convex portion 61 a of the via 61 and the concave portion 23 a of the pad electrode 23. The recess 23 a of the pad electrode 23 can be easily formed on the surface of the pad electrode 23 using laser light irradiation when forming the via hole of the via 61. Further, the convex portion 61a of the via 61 can be easily formed by embedding a metal conductor or an insulating material in a via hole whose bottom is the pad electrode 23 in which the concave portion 23a is formed.

以上のように、本発明の実施の形態４に係るフレキシブル基板２は、ビア６１の凸部６１ａと、パッド電極２３の凹部２３ａとを嵌合して、ビア６１とパッド電極２３とを接合するので、ビア６１とパッド電極２３とが強く接合され、パッド電極２３が基材２１の表面から剥離しにくくなる。したがって、ワイヤボンディング方法を用いて電子部品３からのワイヤ３２とパッド電極２３とを確実に接続して、電子部品３を実装したフレキシブル基板２の信頼性が向上する。   As described above, in the flexible substrate 2 according to the fourth embodiment of the present invention, the protrusion 61a of the via 61 and the recess 23a of the pad electrode 23 are fitted, and the via 61 and the pad electrode 23 are joined. Therefore, the via 61 and the pad electrode 23 are strongly bonded, and the pad electrode 23 is difficult to peel off from the surface of the substrate 21. Therefore, the reliability of the flexible substrate 2 on which the electronic component 3 is mounted is improved by reliably connecting the wire 32 from the electronic component 3 and the pad electrode 23 using a wire bonding method.

（実施の形態５）
図７は、本発明の実施の形態５に係るフレキシブル基板２のパッド電極２３の構成を示す断面図である。なお、本発明の実施の形態５に係る回路モジュール１、及びフレキシブル基板２の構成は、図７で説明する構成以外、実施の形態１で説明した構成と同じであるため、同じ構成には同じ符号を付して詳細な説明は省略する。 (Embodiment 5)
FIG. 7 is a cross-sectional view showing the configuration of the pad electrode 23 of the flexible substrate 2 according to the fifth embodiment of the present invention. The configurations of the circuit module 1 and the flexible substrate 2 according to Embodiment 5 of the present invention are the same as those described in Embodiment 1 except for the configuration described in FIG. A detailed description is omitted with reference numerals.

図７に示す本発明の実施の形態５に係るフレキシブル基板２のパッド電極２３は、可撓性を有する基材２１の表面に形成され、基材２１に埋め込まれているビア（第１ビア）７１と接合する。ビア７１は、さらにビア７１の下層の基材２１と基材２１との間に形成されるダミー配線７２と接合する。ダミー配線７２は、面内配線２２のうち、別の面内配線２２と電気的に接続していない配線である。   The pad electrode 23 of the flexible substrate 2 according to the fifth embodiment of the present invention shown in FIG. 7 is formed on the surface of the flexible base material 21 and is embedded in the base material 21 (first via). 71 is joined. The via 71 is further joined to a dummy wiring 72 formed between the base material 21 and the base material 21 below the via 71. The dummy wiring 72 is a wiring that is not electrically connected to another in-plane wiring 22 among the in-plane wirings 22.

以上のように、本発明の実施の形態５に係るフレキシブル基板２は、複数の基材２１が積層され、ビア７１は、基材２１と基材２１との間に形成される面内配線２２のうち、別の面内配線２２と電気的に接続していないダミー配線７２と接合するので、ビア７１がパッド電極２３の方向に抜けにくくなり、当該ビア７１と接合するパッド電極２３が基材２１の表面から剥離しにくい。したがって、ワイヤボンディング方法を用いて電子部品３からのワイヤ３２とパッド電極２３とを確実に接続して、電子部品３を実装したフレキシブル基板２の信頼性が向上する。なお、ダミー配線７２のビア７１と接合する接合面の面積は、ダミー配線７２と接合するビア７１の接合面の面積より大きい方が、よりパッド電極２３の方向に抜けにくくなる。   As described above, in the flexible substrate 2 according to the fifth embodiment of the present invention, the plurality of base materials 21 are stacked, and the via 71 is the in-plane wiring 22 formed between the base material 21 and the base material 21. Of these, the via 71 is difficult to come off in the direction of the pad electrode 23 and the pad electrode 23 joined to the via 71 is a base material. It is difficult to peel from the surface of 21. Therefore, the reliability of the flexible substrate 2 on which the electronic component 3 is mounted is improved by reliably connecting the wire 32 from the electronic component 3 and the pad electrode 23 using a wire bonding method. Note that the area of the bonding surface of the dummy wiring 72 that is bonded to the via 71 is larger than the area of the bonding surface of the via 71 that is bonded to the dummy wiring 72 is less likely to come out in the direction of the pad electrode 23.

（実施の形態６）
図８は、本発明の実施の形態６に係る回路モジュール１の構成を示す断面図である。なお、本発明の実施の形態６に係る回路モジュール１、及びフレキシブル基板２の構成は、電子部品３をフレキシブル基板２に実装する構成以外、実施の形態１で説明した構成と同じであるため、同じ構成には同じ符号を付して詳細な説明は省略する。 (Embodiment 6)
FIG. 8 is a cross-sectional view showing the configuration of the circuit module 1 according to Embodiment 6 of the present invention. The configurations of the circuit module 1 and the flexible substrate 2 according to the sixth embodiment of the present invention are the same as the configurations described in the first embodiment except for the configuration in which the electronic component 3 is mounted on the flexible substrate 2. The same components are denoted by the same reference numerals and detailed description thereof is omitted.

図８に示す回路モジュール１は、電子部品３の電極３１にバンプ８１を設け、設けたバンプ８１をパッド電極２３に接続することで、電子部品３をフレキシブル基板２に実装する。バンプ８１が、ワイヤボンディング方法を用いる場合のワイヤに相当し、電子部品３からのワイヤ（配線）３２に相当する。バンプ８１とパッド電極２３との接続は、フレキシブル基板２のパッド電極２３にバンプ８１を押し当て、バンプ８１に振動（例えば超音波）を加えてパッド電極２３に接続する。なお、バンプ８１には、Ａｕ等を用いる。   In the circuit module 1 shown in FIG. 8, the bumps 81 are provided on the electrodes 31 of the electronic component 3, and the provided bumps 81 are connected to the pad electrode 23, thereby mounting the electronic component 3 on the flexible substrate 2. The bump 81 corresponds to a wire when the wire bonding method is used, and corresponds to a wire (wiring) 32 from the electronic component 3. The bump 81 and the pad electrode 23 are connected by pressing the bump 81 against the pad electrode 23 of the flexible substrate 2 and applying vibration (for example, ultrasonic waves) to the bump 81 to connect to the pad electrode 23. Note that Au or the like is used for the bump 81.

以上のように、本発明の実施の形態６に係る回路モジュール１は、バンプ８１を用いて電子部品３をフレキシブル基板２に実装する場合であっても、各種電子機器に採用することが可能な可撓性を確保しつつパッド電極２３を補強することができる。したがって、電子部品３の電極３１に設けたバンプ８１とパッド電極２３とを確実に接続して、電子部品３を実装したフレキシブル基板２の信頼性が向上する。   As described above, the circuit module 1 according to Embodiment 6 of the present invention can be employed in various electronic devices even when the electronic component 3 is mounted on the flexible substrate 2 using the bumps 81. The pad electrode 23 can be reinforced while ensuring flexibility. Therefore, the bump 81 provided on the electrode 31 of the electronic component 3 and the pad electrode 23 are securely connected to improve the reliability of the flexible substrate 2 on which the electronic component 3 is mounted.

（実施の形態７）
図９は、本発明の実施の形態７に係るフレキシブル基板２のパッド電極２３の構成を示す断面図である。図１０は、本発明の実施の形態７に係るフレキシブル基板２のパッド電極２３の構成を示す平面図である。なお、本発明の実施の形態７に係る回路モジュール１、及びフレキシブル基板２の構成は、図９及び図１０で説明する構成以外、実施の形態１で説明した構成と同じであるため、同じ構成には同じ符号を付して詳細な説明は省略する。 (Embodiment 7)
FIG. 9 is a cross-sectional view showing a configuration of pad electrode 23 of flexible substrate 2 according to Embodiment 7 of the present invention. FIG. 10 is a plan view showing the configuration of the pad electrode 23 of the flexible substrate 2 according to the seventh embodiment of the present invention. The configurations of the circuit module 1 and the flexible substrate 2 according to the seventh embodiment of the present invention are the same as the configurations described in the first embodiment except for the configurations described in FIGS. Are denoted by the same reference numerals, and detailed description thereof is omitted.

図９に示す本発明の実施の形態７に係るフレキシブル基板２のパッド電極２３は、可撓性を有する基材２１の表面に形成され、基材２１に埋め込まれている複数のビア（第１ビア）９１、９１と接合する。ビア９１、９１は、図１０に示すようにパッド電極２３の四隅にそれぞれ配置され、パッド電極２３とそれぞれ接合する。なお、ビア９１の数、配置は、４本をパッド電極２３の四隅に配置することに限定されるものではなく、例えば８本を円形に配置しても良い。   The pad electrode 23 of the flexible substrate 2 according to the seventh embodiment of the present invention shown in FIG. 9 is formed on the surface of the base material 21 having flexibility, and a plurality of vias embedded in the base material 21 (first Via) 91 and 91 are joined. The vias 91 and 91 are arranged at the four corners of the pad electrode 23 as shown in FIG. The number and arrangement of the vias 91 are not limited to the arrangement of four at the four corners of the pad electrode 23, and for example, eight may be arranged in a circle.

以上のように、本発明の実施の形態７に係るフレキシブル基板２は、パッド電極２３に複数のビア９１、９１が接合するので、当該ビア９１、９１と接合するパッド電極２３が基材２１の表面から剥離しにくく、ワイヤボンディング方法を用いて電子部品３からのワイヤ３２とパッド電極２３とを確実に接続して、電子部品３を実装したフレキシブル基板２の信頼性が向上する。   As described above, since the plurality of vias 91 and 91 are joined to the pad electrode 23 in the flexible substrate 2 according to the seventh embodiment of the present invention, the pad electrode 23 joined to the vias 91 and 91 is the base 21. It is difficult to peel off from the surface, and the reliability of the flexible substrate 2 on which the electronic component 3 is mounted is improved by reliably connecting the wire 32 from the electronic component 3 and the pad electrode 23 using a wire bonding method.

１ 回路モジュール
２ フレキシブル基板
２１ 基材
２２ 面内配線
２３ パッド電極
３ 電子部品
２４ ビア（第２ビア）
２５、４１、５１、５２、６１、７１、９１ ビア（第１ビア）
３２ ワイヤ
７２ ダミー配線
８１ バンプ
１０３ キャピラリ DESCRIPTION OF SYMBOLS 1 Circuit module 2 Flexible substrate 21 Base material 22 In-plane wiring 23 Pad electrode 3 Electronic component 24 Via (2nd via)
25, 41, 51, 52, 61, 71, 91 Via (first via)
32 Wire 72 Dummy wiring 81 Bump 103 Capillary

Claims (11)

可撓性を有する基材と、
該基材の表面に設けられ、電子部品からの配線に振動を加えて接続するパッド電極と、
前記基材に埋め込まれ、前記パッド電極と接合する第１ビアと
を備え、
前記第１ビアは、前記基材に比べて剛性の高い材料で形成してあることを特徴とするフレキシブル基板。 A flexible substrate;
A pad electrode provided on the surface of the base material and connected by applying vibration to the wiring from the electronic component;
A first via embedded in the substrate and bonded to the pad electrode;
The flexible substrate, wherein the first via is made of a material having higher rigidity than the base material. 前記パッド電極と接合する前記第１ビアの接合部分と、前記電子部品からの配線を接続する前記パッド電極の接合部分とは、前記パッド電極を挟んで対向することを特徴とする請求項１に記載のフレキシブル基板。   2. The bonding portion of the first via that is bonded to the pad electrode and the bonding portion of the pad electrode that connects wiring from the electronic component are opposed to each other with the pad electrode interposed therebetween. The flexible substrate as described. 前記パッド電極と接合する前記第１ビアは、複数であることを特徴とする請求項１又は請求項２に記載のフレキシブル基板。   The flexible substrate according to claim 1, wherein a plurality of the first vias bonded to the pad electrode are provided. 前記第１ビアは、前記パッド電極と接合する接合面の面積が、該接合面に平行な別の面の面積より小さいテーパ形状であることを特徴とする請求項１乃至請求項３のいずれか一項に記載のフレキシブル基板。   4. The first via according to claim 1, wherein the first via has a tapered shape in which an area of a bonding surface bonded to the pad electrode is smaller than an area of another surface parallel to the bonding surface. The flexible substrate according to one item. 前記第１ビアの前記接合面に平行な別の面の面積は、前記パッド電極の前記第１ビアと接合する接合面の面積以下であることを特徴とする請求項４に記載のフレキシブル基板。   The flexible substrate according to claim 4, wherein an area of another surface parallel to the bonding surface of the first via is equal to or less than an area of the bonding surface bonded to the first via of the pad electrode. 前記第１ビアは、絶縁材料であることを特徴とする請求項１乃至５のいずれか一項に記載のフレキシブル基板。   The flexible substrate according to claim 1, wherein the first via is an insulating material. 複数の前記基材が積層され、
複数の前記基材のそれぞれに埋め込まれた前記第１ビアが互いに接合することを特徴とする請求項１乃至請求項６のいずれか一項に記載のフレキシブル基板。 A plurality of the base materials are laminated,
The flexible substrate according to any one of claims 1 to 6, wherein the first vias embedded in each of the plurality of base materials are bonded to each other. 前記第１ビアは、前記基材に設けてある面内配線の間を電気的に接続するための第２ビアと同じ材料で形成してあることを特徴とする請求項１乃至請求項７のいずれか一項に記載のフレキシブル基板。   The said 1st via | veer is formed with the same material as the 2nd via | veer for electrically connecting between the in-plane wiring provided in the said base material, The Claim 1 thru | or 7 characterized by the above-mentioned. The flexible substrate as described in any one of Claims. 前記第１ビアの凸部と、前記パッド電極の凹部とを嵌合して前記第１ビアと前記パッド電極とを接合することを特徴とする請求項１乃至請求項８のいずれか一項に記載のフレキシブル基板。   The convex portion of the first via and the concave portion of the pad electrode are fitted to join the first via and the pad electrode. The flexible substrate as described. 複数の前記基材が積層され、
前記第１ビアは、前記基材と前記基材との間に形成される面内配線のうち、別の面内配線と電気的に接続していない配線と接合することを特徴とする請求項１乃至請求項９のいずれか一項に記載のフレキシブル基板。 A plurality of the base materials are laminated,
The said 1st via | veer is joined to the wiring which is not electrically connected with another in-plane wiring among the in-plane wiring formed between the said base material and the said base material. The flexible substrate according to any one of claims 1 to 9. 電子部品と、
可撓性を有する基材と、該基材の表面に設けられ、前記電子部品からの配線に振動を加えて接続するパッド電極と、前記基材に埋め込まれ、前記パッド電極と接合する第１ビアとを有するフレキシブル基板と
を備え、
前記第１ビアは、前記基材に比べて剛性の高い材料で形成してあることを特徴とする回路モジュール。 Electronic components,
A base material having flexibility, a pad electrode provided on the surface of the base material and connected by applying vibration to the wiring from the electronic component, and a first electrode embedded in the base material and joined to the pad electrode A flexible substrate having vias, and
The circuit module, wherein the first via is made of a material having higher rigidity than the base material.
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