JP2017168852A - 真空プロセス・チャンバの構成部品及び製造方法 - Google Patents
真空プロセス・チャンバの構成部品及び製造方法 Download PDFInfo
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/20—Tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
- F16B5/08—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of welds or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ceramic Products (AREA)
- Chemical Vapour Deposition (AREA)
- Gasket Seals (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
11:第1の部分
12:第2の部分
13、75:Oリング
14:外側半径方向部分
15:内側半径方向部分
16:はんだ接合部
17、37、39a、39b、78:溝
18:はんだ
19:間隙
20:基板支持部
22:基板
24:静電チャック
26:台座
27:静電パック
29:環状フランジ
30:誘電体
32:電極
33:熱電対
34:基板受け面
38:ガス・ポート
40:台座フランジ
41、50、92:孔
42:ベースプレート
44:コネクタ
45:リフトピン
46:周辺レッジ
49:電極柱
52:中央突起部
53:環状トラフ
54a、54b、54c:開口部
55:キャビティ
56:熱伝導板
57:流体供給部
58:流体チャネル
61、126:導管
72:ガス管
73:反応性箔
74:ガス・カプラー
76:電気コネクタ
80:ハウジング
82:可動柱
83:ばね
84:ベローズ
86:熱導体
100:装置
102:チャンバ
104:壁
106:天井
108:側壁
110:底壁
112:プロセス区域
120:ガス供給部
122:プロセス・ガス源
124:ガス分配器
128:ガス流量弁
134:流れ制御弁
140:排気部
148:絞り弁
150:ポンプ
154:ガス・エナジャイザ
160:電極電源
164:インダクタ・コイル
170:ターゲット
174:シールド
176:堆積リング
178:カバー・リング
180:基板搬送部
184:ロボットアーム
190:リフトピン・システム
200:チャンバ・コントローラ
Claims (15)
- 真空プロセス・チャンバ内で用いるための構成部品であって、
第1の部分と、
第2の部分と、
前記第1の部分と前記第2の部分との間で圧縮され、前記構成部品の外側半径方向部分及び内側半径方向部分を定める、少なくとも1つのOリングと、
前記第1の部分を前記第2の部分に接合して前記第1の部分と前記第2の部分との間に気密シールをもたらし、その結果、前記外側部分及び前記内側部分のうちの一方が真空下にあり、前記外側部分及び前記内側部分のうちの他方が大気圧下にあるとき、前記気密シールが前記外側部分と前記内側部分との間の漏れを防止する、はんだ接合部と、
を含むことを特徴とする構成部品。 - 前記少なくとも1つのOリングは、前記第1の部分及び前記第2の部分の1つ又はそれ以上の中の溝内に配置されることを特徴とする、請求項1に記載の構成部品。
- 前記第1の部分はセラミック・ボディを含む静電パックであり、前記第2の部分は金属ボディを含むベースプレートであることを特徴とする、請求項1〜請求項2のいずれか1項に記載の構成部品。
- 前記少なくとも1つのOリングはペルフルオロポリマーで作製されることを特徴とする、請求項1〜請求項3のいずれか1項に記載の構成部品。
- 圧縮状態にある前記少なくとも1つのOリングは、圧縮されていない状態にあるときの厚さの約75%の厚さを有することを特徴とする、請求項1〜請求項4のいずれか1項に記載の構成部品。
- 前記はんだ接合部は、電気的に点火される箔材料を用いて形成されることを特徴とする、請求項1〜請求項5のいずれか1項に記載の構成部品。
- 真空チャンバの構成部品を作製する方法であって、
第1の部分及び第2の部分を準備するステップと、
前記第1の部分と前記第2の部分との間に、反応性箔と、外側部分及び内側部分を定める少なくとも1つのOリングとを配置するステップと、
前記反応性箔を点火して前記箔を局所的に加熱し、それらの間に前記Oリングを有する前記第1の部分と前記第2の部分との間に低温はんだ接合部を形成し、前記第1の部分と前記第2の部分との間に気密シールをもたらし、前記外側部分及び前記内側部分のうちの一方が真空下にあり、前記外側部分及び前記内側部分のうちの他方が大気圧下にあるとき、前記気密シールが前記外側部分と前記内側部分の間の漏れを防止するようにするステップと、
を含むことを特徴とする方法。 - 前記反応性箔の点火前に、前記第1の部分及び前記第2の部分のうちの一方又は両方の上にはんだ濡れ薄層を準備するステップをさらに含み、前記はんだ濡れ薄層は、前記反応性箔及び前記少なくとも1つのOリングに隣接することを特徴とする、請求項7に記載の方法。
- 前記第1の部分及び前記第2の部分を互いに押し付けて、前記少なくとも1つのOリングが圧縮されていない厚さの約75%の厚さに圧縮されるようにするステップをさらに含むことを特徴とする、請求項7又は請求項8に記載の方法。
- 前記第1の部分と前記第2の部分との間の前記はんだ接合部は、前記第1の部分又は前記第2の部分の温度を上げずに形成されることを特徴とする、請求項7〜請求項9のいずれか1項に記載の方法。
- 前記反応性箔の点火は、約50℃未満の温度で行われることを特徴とする、請求項7〜請求項10のいずれか1項に記載の方法。
- 前記はんだ接合部は、約2秒未満で形成されることを特徴とする、請求項7〜請求項11のいずれか1項に記載の方法。
- ある電位により前記反応性箔が点火されることを特徴とする、請求項7〜請求項12のいずれか1項に記載の方法。
- 第1の部分と第2の部分との間に少なくとも1つのOリングを含む構成部品であって、前記構成部品は、圧入されて前記少なくとも1つのOリングを圧縮し、はんだ接合部により相互接合されて、それらの間に気密シールをもたらすことを特徴とする構成部品。
- 前記少なくとも1つのOリングは、前記構成部品の外側部分及び内側部分を定め、前記はんだ接合部は前記第1の部分と前記第2の部分との間に気密シールをもたらし、前記外側部分及び前記内側部分のうちの一方が真空下にあり、前記外側部分及び前記内側部分のうちの他方が大気圧下にあるとき、前記気密シールは前記外側部分と前記内側部分との間の漏れを防ぐことを特徴とする、請求項14に記載の構成部品。
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US9556074B2 (en) * | 2011-11-30 | 2017-01-31 | Component Re-Engineering Company, Inc. | Method for manufacture of a multi-layer plate device |
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US20120076574A1 (en) | 2012-03-29 |
JP2013541211A (ja) | 2013-11-07 |
JP6180935B2 (ja) | 2017-08-16 |
JP2019016813A (ja) | 2019-01-31 |
JP6689937B2 (ja) | 2020-04-28 |
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WO2012047636A3 (en) | 2012-06-21 |
US9969022B2 (en) | 2018-05-15 |
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